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OMAP5912ZDY

Texas Instruments

OMAP5912ZDY by Texas Instruments

OMAP5912ZDY by Texas Instruments is a 16-bit DSP with integrated cache and 163840 RAM words. It operates at a max clock frequency of 19.2 MHz, suitable for industrial applications requiring low power consumption and high-speed processing. With 289 terminals in a grid array package style, it offers boundary scan capability for efficient testing and debugging.

Median Price

$67.280

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,887 parts In-Stock

1+ parts

$67.280

100+ parts

$49.983

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$48.745

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1,887

$67.280

$49.983

$48.745

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Distributors (In-Stock)

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Bristol Electronics

USA . 9 parts In-Stock

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$30.000

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Digiode

USA . 4,619 parts In-Stock

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$56.145

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Vyrian

USA . 6,239 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Eagle Technology Solutions

USA . 9 parts In-Stock

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Holdelec - ElecDif-Pro

France . 3 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

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Microfarads

USA . 2 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 720 parts In-Stock

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$18.813

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720

$18.813

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Corohmni

South Africa . 56 parts In-Stock

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$32.015

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Semicontronic

India . 336 parts In-Stock

1+ parts

$50.230

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$48.974

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$48.723

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336

$50.230

$48.974

$48.723

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Corphita

USA . 158 parts In-Stock

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$53.190

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Parana Technologies

USA . 2,258 parts In-Stock

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$68.208

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DigiPath Technology Company

USA . 483 parts In-Stock

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$75.105

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$69.097

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483

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ChromeModa Solutions

Germany . 2,315 parts In-Stock

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$76.638

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$62.843

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$76.638

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IDEA Electronic Components Group

UK . 47 parts In-Stock

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$76.638

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$72.806

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$68.974

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47

$76.638

$72.806

$68.974

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Ampacity Inc.

Singapore . 336 parts In-Stock

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$109.340

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336

$109.340

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,975 parts In-Stock

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Argo Parts USA

USA . 3,452 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Continental Prestige Electronics

USA . 1,278 parts In-Stock

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Overview

Experience the power and precision of the Texas Instruments OMAP5912ZDY Digital Signal Processor. Crafted with quality in mind, this cutting-edge processor offers unparalleled performance and reliability for a wide range of applications. From industrial automation to telecommunications, the OMAP5912ZDY delivers seamless operation and exceptional results. Trust in Texas Instruments, a leader in semiconductor technology, to provide you with the value and benefits you need to succeed in today's competitive market. Elevate your projects with the OMAP5912ZDY and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for the product, ensuring it can withstand various environmental conditions.

Integrated Cache: YES

Improves processing speed and efficiency by storing frequently accessed data closer to the processor, reducing access times.

Maximum Supply Voltage: 1.65 V

Allows for efficient power usage while still providing enough voltage for proper operation.

Address Bus Width: 26

Allows for addressing a larger amount of memory locations, enabling more complex signal processing operations.

Bit Size: 16

Offers a balance between performance and power consumption, suitable for a wide range of signal processing tasks.

No. of Terminals: 289

Provides sufficient connectivity options for interfacing with external components and peripherals.

Maximum Clock Frequency: 19.2 MHz

Enables fast and efficient signal processing operations, suitable for real-time applications.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Offers versatile processing capabilities for handling different types of digital signals and mixed-signal applications.

Technical Specifications

Digital Signal Processors (DSPs) OMAP5912ZDY attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 2.75V OR 3.3V SUPPLY

Address Bus Width:

26

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

19.2 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of Terminals:

289

No. of Timers:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA289,17X17,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.6,1.8/2.75/3.3

Qualification:

Not Qualified

RAM Words:

163840

Maximum Seated Height:

2.32 mm

Speed:

192 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.65 V

Minimum Supply Voltage:

1.525 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

OMAP5912ZDY Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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