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TMS32C6414EGLZ7E3

Texas Instruments

TMS32C6414EGLZ7E3 by Texas Instruments

TMS32C6414EGLZ7E3 by Texas Instruments is a 32-bit DSP with integrated cache, operating at max 75.18 MHz clock frequency. Ideal for digital signal processing applications, it features 64 external data bus width and low power mode for efficient performance.

Median Price

$190.302

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 451 parts In-Stock

1+ parts

$174.990

100+ parts

$164.490

1k+ parts

$153.990

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451

$174.990

$164.490

$153.990

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DigiKey

USA . 607 parts In-Stock

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607

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Verical

USA . 242 parts In-Stock

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$205.613

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$192.488

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242

-

$205.613

$192.488

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 1 parts In-Stock

1+ parts

$153.850

100+ parts

$115.380

1k+ parts

$100.000

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1

$153.850

$115.380

$100.000

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Digiode

USA . 645 parts In-Stock

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$193.021

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645

$193.021

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DigiKey Marketplace

USA . 607 parts In-Stock

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$195.680

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607

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Vyrian

USA . 4,934 parts In-Stock

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4,934

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Netsource Technology, Inc.

USA . 281 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 2,469 parts In-Stock

1+ parts

$51.066

100+ parts

-

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2,469

$51.066

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Parana Technologies

USA . 2,230 parts In-Stock

1+ parts

$58.365

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2,230

$58.365

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ChromeModa Solutions

Germany . 6,162 parts In-Stock

1+ parts

$65.579

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$53.775

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6,162

$65.579

$53.775

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IDEA Electronic Components Group

UK . 1,425 parts In-Stock

1+ parts

$65.579

100+ parts

$62.300

1k+ parts

$59.021

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1,425

$65.579

$62.300

$59.021

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Ampacity Inc.

Singapore . 384 parts In-Stock

1+ parts

$172.700

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384

$172.700

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Semicontronic

India . 38 parts In-Stock

1+ parts

$172.700

100+ parts

$168.382

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$167.519

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38

$172.700

$168.382

$167.519

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Corphita

USA . 212 parts In-Stock

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$182.862

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212

$182.862

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Continental Prestige Electronics

USA . 5,471 parts In-Stock

1+ parts

$197.339

100+ parts

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$193.392

5,471

$197.339

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-

$193.392

Netroflash

USA . 100 parts In-Stock

1+ parts

$197.339

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100

$197.339

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Microchip USA

USA . 1,515 parts In-Stock

1+ parts

$278.878

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1,515

$278.878

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DigiPath Technology Company

USA . 1,469 parts In-Stock

1+ parts

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$59.126

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1,469

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$59.126

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Argo Parts USA

USA . 1,453 parts In-Stock

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1,453

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Overview

Unlock the full potential of digital signal processing with Texas Instruments' TMS32C6414EGLZ7E3. This cutting-edge DSP offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications. Whether you're working on audio processing, telecommunications, or industrial control systems, this DSP delivers exceptional value, benefits, and advantages to meet your needs. Trust in Texas Instruments' reputation for quality and innovation, and take your projects to the next level with the TMS32C6414EGLZ7E3.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLastic/Epoxy material ensures durability and resilience, making it ideal for a variety of applications.

Integrated Cache: YES

Integrated cache helps in reducing data access time and improving processing speed.

Maximum Supply Voltage: 1.44 V

Higher maximum supply voltage allows for efficient power management and performance.

Address Bus Width: 32

32-bit address bus width enables handling large memory addressing efficiently.

Package Shape: SQUARE

Square package shape allows for easier integration and placement on circuit boards.

Bit Size: 32

32-bit architecture provides enhanced data processing capabilities.

Power Supplies (V): 1.4,3.3

Multiple power supply options provide flexibility in design and operation.

No. of Terminals: 532

Ample number of terminals allow for versatile connectivity options and functionality.

Maximum Operating Temperature: 90 °C

High maximum operating temperature range ensures reliability in various environmental conditions.

No. of External Interrupts: 4

Multiple external interrupts enable efficient communication with external devices and real-time processing.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality even in colder temperatures.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/Lead terminal finish provides good solderability and reliability in circuit assembly.

RAM Words: 16384

Ample RAM capacity allows for efficient data storage and processing.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging of the device during manufacturing and maintenance.

External Data Bus Width: 64

Wider external data bus width improves data transfer rates and overall performance.

Maximum Clock Frequency: 75.18 MHz

High maximum clock frequency allows for fast data processing and execution speed.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specialized peripheral IC type ensures optimized performance for digital signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: BALL

Ball terminal form facilitates secure connections and efficient heat dissipation.

No. of DMA Channels: 64

High number of DMA channels enable efficient data transfer and processing without CPU intervention.

Low Power Mode: YES

Low power mode helps in conserving energy and extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6414EGLZ7E3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3VI/O SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75.18 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

64

No. of External Interrupts:

4

No. of Terminals:

532

No. of Timers:

3

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS32C6414EGLZ7E3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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