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SM320F2812PGFMEP

Texas Instruments

SM320F2812PGFMEP by Texas Instruments

SM320F2812PGFMEP by Texas Instruments is a 32-bit DSP with 150 MHz clock frequency, 16-bit data RAM width, and 19-bit address bus width. Ideal for military applications, it features flash ROM programmability, 8 timers, and low power mode for efficient performance in digital signal processing tasks.

Median Price

$80.430

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

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DigiKey

USA . 433 parts In-Stock

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$75.220

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$57.967

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$55.447

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433

$75.220

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$55.447

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Mouser Electronics

USA . 60 parts In-Stock

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$85.640

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$66.360

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$63.540

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$85.640

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$63.540

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Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

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$47.093

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Digiode

USA . 3,390 parts In-Stock

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$57.466

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$57.466

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Bristol Electronics

USA . 31 parts In-Stock

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$70.200

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$62.099

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Vyrian

USA . 5,127 parts In-Stock

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Chip Stock

USA . 3,597 parts In-Stock

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Lakeland Logistics Inc

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EMSNET

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QIE Inc.

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North Shore Components

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Cyclops Electronics Ltd

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SPM Sales

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Distributors (Availability)

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AZTECH Wire

Italy . 301 parts In-Stock

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$15.356

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$15.356

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Continental Prestige Electronics

USA . 4,698 parts In-Stock

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$47.093

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$46.151

4,698

$47.093

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$46.151

Corohmni

South Africa . 626 parts In-Stock

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$49.280

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Ampacity Inc.

Singapore . 83 parts In-Stock

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$51.420

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Semicontronic

India . 83 parts In-Stock

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$51.420

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$50.134

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$49.877

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Corphita

USA . 4,125 parts In-Stock

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$54.441

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Parana Technologies

USA . 690 parts In-Stock

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$54.870

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$54.870

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DigiPath Technology Company

USA . 906 parts In-Stock

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$60.419

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$55.585

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ChromeModa Solutions

Germany . 1,196 parts In-Stock

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$61.652

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$50.555

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IDEA Electronic Components Group

UK . 21 parts In-Stock

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$61.652

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$58.569

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Microchip USA

USA . 2,606 parts In-Stock

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$122.730

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$120.590

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$119.530

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$118.460

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$119.530

$118.460

QUARKTWIN TECHNOLOGY LTD

USA . 15,652 parts In-Stock

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A-Z Elektronik GmbH

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iodParts Technologies Inc.

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Lixinc

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GreenTree Electronics

Israel . 3,295 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Kepictronics

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Argo Parts USA

USA . 2,785 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Computer Components Inc. - USA

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Overview

Unlock the power of cutting-edge technology with the Texas Instruments SM320F2812PGFMEP Digital Signal Processor. Boasting top-notch quality and reliability from a trusted manufacturer, this versatile DSP is perfect for a wide range of applications. Experience lightning-fast processing speeds and seamless performance thanks to its advanced features. Whether you're in the military, automotive, or industrial sector, this DSP offers unparalleled value and benefits that will take your projects to the next level. Upgrade to the SM320F2812PGFMEP and revolutionize your digital signal processing capabilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this DSP lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly on PCBs.

Maximum Supply Voltage: 2 V

With a maximum supply voltage of 2V, this DSP is suitable for low power applications.

On Chip Data RAM Width: 16

The 16-bit data RAM width provides ample space for storing data in real-time processing.

Address Bus Width: 19

The 19-bit address bus width enables efficient memory access and data management.

Package Shape: SQUARE

The square package shape helps in optimizing space on the PCB.

Bit Size: 32

With a 32-bit architecture, this DSP can perform complex calculations and processing tasks efficiently.

Power Supplies (V): 1.9,3.3

The availability of multiple power supply options allows for flexibility in design and operation.

No. of Terminals: 176

The high number of terminals enable connectivity with various external components and interfaces.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

These package styles offer versatility in terms of board layout and design options.

Minimum Supply Voltage: 1.81 V

The low minimum supply voltage ensures efficient power consumption and operation in low voltage scenarios.

Maximum Operating Temperature: 125 °C

The wide operating temperature range makes this DSP suitable for harsh environmental conditions.

CPU Family: C28X

The C28X CPU family provides high performance and processing capabilities for demanding applications.

No. of External Interrupts: 3

The presence of 3 external interrupts allows for efficient handling of external events and triggers.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures reliable operation in extreme cold conditions.

Technical Specifications

Digital Signal Processors (DSPs) SM320F2812PGFMEP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATES AT 1.8V SUPPLY AT 135MHZ

Address Bus Width:

19

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G176

JESD-609 Code:

e4

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

176

No. of Timers:

8

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP176,1.0SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

RAM Words:

18432

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

SM320F2812PGFMEP Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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