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SM320C30GBM33

Texas Instruments

SM320C30GBM33 by Texas Instruments

The Texas Instruments SM320C30GBM33 is a 32-bit DSP with 5V supply, 33.33MHz clock frequency, and 1024 RAM words. Ideal for military applications due to its -55°C to 125°C operating temperature range and ceramic/metal-sealed package. Features include a barrel shifter, low power mode, and multiple internal bus architecture for efficient signal processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,021 parts In-Stock

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8,021

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Digiode

USA . 174 parts In-Stock

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174

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 239 parts In-Stock

1+ parts

$12.444

100+ parts

-

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239

$12.444

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One Stop Electronics

USA . 1,100 parts In-Stock

1+ parts

$24.000

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-

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1,100

$24.000

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Parana Technologies

USA . 851 parts In-Stock

1+ parts

$41.174

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851

$41.174

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DigiPath Technology Company

USA . 205 parts In-Stock

1+ parts

$45.338

100+ parts

$41.711

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205

$45.338

$41.711

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ChromeModa Solutions

Germany . 3,249 parts In-Stock

1+ parts

$46.263

100+ parts

$37.936

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3,249

$46.263

$37.936

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IDEA Electronic Components Group

UK . 354 parts In-Stock

1+ parts

$46.263

100+ parts

$43.950

1k+ parts

$41.637

10k+ parts

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354

$46.263

$43.950

$41.637

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Corohmni

South Africa . 640 parts In-Stock

1+ parts

$68.822

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640

$68.822

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Corphita

USA . 3,144 parts In-Stock

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3,144

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Overview

Unleash the power of cutting-edge technology with the SM320C30GBM33 by Texas Instruments. As a leading manufacturer in the field of Digital Signal Processors, Texas Instruments offers unparalleled quality and reliability. This versatile DSP is perfect for a wide range of applications, providing customers with exceptional value and performance. With features like low power mode, barrel shifter, and multiple internal bus architecture, this product delivers outstanding benefits and advantages to users. Experience the difference with the SM320C30GBM33 and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired package body material ensures high reliability and durability of the DSP, making it suitable for harsh environments.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in powering the DSP and ensures compatibility with a wide range of applications.

Address Bus Width: 24

The 24-bit address bus width allows for efficient memory addressing, enabling the DSP to access large amounts of data quickly and accurately.

Maximum Clock Frequency: 33.33 MHz

The high maximum clock frequency of 33.33 MHz enables fast processing speeds, making the DSP suitable for real-time signal processing applications.

Temperature Grade: MILITARY

The military-grade temperature grade ensures that the DSP can operate effectively in rugged environmental conditions, making it ideal for defense and aerospace applications.

Technical Specifications

Digital Signal Processors (DSPs) SM320C30GBM33 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

33.33 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CPGA-P181

Low Power Mode:

YES

No. of DMA Channels:

1

No. of External Interrupts:

4

No. of Serial I/Os:

2

No. of Terminals:

181

No. of Timers:

2

On Chip Data RAM Width:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA181M,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

600 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Peripheral IC Type:

Trade Compliance

SM320C30GBM33 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-14-505-2684, 5962145052684

NIIN

145052684

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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