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DSPIC33EP256MC206-E/MR

Microchip Technology

DSPIC33EP256MC206-E/MR by Microchip Technology

DSPIC33EP256MC206-E/MR by Microchip Technology is a 16-bit DSP with 3.3V supply, 60MHz clock frequency, and 32768 RAM words. Ideal for automotive applications, it features flash ROM programmability, low power mode, and boundary scan support for efficient digital signal processing tasks in compact designs.

Median Price

$4.997

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.997

100+ parts

-

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10

$4.997

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Vyrian

USA . 5,446 parts In-Stock

1+ parts

-

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5,446

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 656 parts In-Stock

1+ parts

$4.740

100+ parts

$4.622

1k+ parts

$4.598

10k+ parts

-

656

$4.740

$4.622

$4.598

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Continental Prestige Electronics

USA . 6,871 parts In-Stock

1+ parts

$4.990

100+ parts

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$4.890

6,871

$4.990

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$4.890

Netroflash

USA . 50 parts In-Stock

1+ parts

$4.997

100+ parts

$4.897

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50

$4.997

$4.897

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AZTECH Wire

Italy . 837 parts In-Stock

1+ parts

$5.443

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837

$5.443

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Ampacity Inc.

Singapore . 382 parts In-Stock

1+ parts

$10.320

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382

$10.320

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Marpe Global Electronics

Taiwan . 5,420 parts In-Stock

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5,420

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QualityLine Systems

Poland . 5,420 parts In-Stock

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5,420

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XL Components Corporation

Australia . 5,420 parts In-Stock

1+ parts

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5,420

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Argo Parts USA

USA . 4,882 parts In-Stock

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4,882

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Overview

Unleash the power of digital signal processing with the Microchip Technology DSPIC33EP256MC206-E/MR. This top-notch product boasts superior quality and reliability from a trusted manufacturer, making it the go-to choice for applications in various industries. Elevate your projects with the cutting-edge technology and advanced features this digital signal processor offers. Experience seamless performance, enhanced functionality, and exceptional value with the DSPIC33EP256MC206-E/MR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY for the package body material provides durability and protection for the internal components of the DSP ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly of the DSP onto circuit boards, saving time and effort in the manufacturing process.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6 V allows for flexibility in power supply options, making it compatible with a wide range of systems.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of CHIP CARRIER, HEAT SINK/SLUG, and VERY THIN PROFILE package styles offer thermal management, compact size, and ease of installation in various applications.

Maximum Clock Frequency: 60 MHz

The high maximum clock frequency of 60 MHz enables fast processing speeds and efficient performance, ideal for real-time signal processing applications.

Technology: CMOS

The CMOS technology used in the DSP provides low power consumption and high noise immunity, making it energy efficient and reliable for extended operation.

ROM Programmability: FLASH

The ROM programmability using FLASH memory allows for easy and quick updates to the program code, making the DSP versatile and adaptable to evolving requirements.

Low Power Mode: YES

The inclusion of a low power mode option helps in reducing power consumption during idle or low activity periods, extending battery life and improving energy efficiency.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MC206-E/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

64

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33EP256MC206-E/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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