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DSPIC33CK256MP506T-I/MR

Microchip Technology

DSPIC33CK256MP506T-I/MR by Microchip Technology

DSPIC33CK256MP506T-I/MR by Microchip Technology is a 16-bit digital signal processor with a max clock frequency of 64 MHz. It has 24576 RAM words and operates at an industrial temperature grade of -40 to 85 °C. This DSP is commonly used in applications requiring high-speed processing and low power consumption.

Median Price

$5.055

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

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$5.055

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150

$5.055

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Vyrian

USA . 7,675 parts In-Stock

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7,675

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,884 parts In-Stock

1+ parts

$1.950

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$1.950

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Component Stockers USA

USA . 12,909 parts In-Stock

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$4.530

100+ parts

$3.760

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$3.460

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12,909

$4.530

$3.760

$3.460

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Continental Prestige Electronics

USA . 1,540 parts In-Stock

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$5.055

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$4.954

1,540

$5.055

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$4.954

Bastille Electronics

Australia . 900 parts In-Stock

1+ parts

$5.055

100+ parts

$4.802

1k+ parts

$4.562

10k+ parts

$4.499

900

$5.055

$4.802

$4.562

$4.499

AZTECH Wire

Italy . 525 parts In-Stock

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$11.565

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525

$11.565

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Corohmni

South Africa . 460 parts In-Stock

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$32.705

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460

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NIA Electronics

USA . 7,024 parts In-Stock

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Ledger Components

France . 7,024 parts In-Stock

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Montano Global Distributors

Canada . 6,901 parts In-Stock

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Argo Parts USA

USA . 4,961 parts In-Stock

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LMD Electronica

Estonia . 3,434 parts In-Stock

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LOOK Integrated Logistics

Peru . 3,163 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Overview

Experience the power and precision of the DSPIC33CK256MP506T-I/MR by Microchip Technology, a leader in digital signal processors (DSPs). Designed with excellence, this chip offers unmatched quality and reliability. With its advanced technology and versatile applications, this product is perfect for various industries, including telecommunications, automotive, and industrial automation. Enjoy the benefits of its high clock frequency, extensive RAM capacity, and low power mode. Trust Microchip Technology to provide you with cutting-edge solutions that meet your needs and exceed your expectations. Elevate your designs with the DSPIC33CK256MP506T-I/MR and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material makes the DSP lightweight and cost-effective.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options for various peripherals and interfaces.

Maximum Clock Frequency: 64 MHz

The high maximum clock frequency enables fast signal processing and efficient operation.

Technology: CMOS

Using CMOS technology ensures low power consumption and high integration capabilities.

ROM Programmability: FLASH

The flash programmable ROM allows for easy updates and customization of the software.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33CK256MP506T-I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N64

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Serial I/Os:

4

No. of Terminals:

64

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

24576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Maximum Supply Current:

35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Trade Compliance

DSPIC33CK256MP506T-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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