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DSPIC33EP128MC504-I/TL

Microchip Technology

DSPIC33EP128MC504-I/TL by Microchip Technology

DSPIC33EP128MC504-I/TL by Microchip Technology is a 16-bit digital signal processor with 3.3V power supply, 60 MHz clock frequency, and 16384 RAM bytes. It features 9-Ch 12-Bit ADC channels, CAN, I2C, SPI connectivity, and low power mode for industrial applications requiring high-speed processing and multiple peripherals.

Median Price

$3.440

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

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$3.440

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$3.440

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Vyrian

USA . 10,091 parts In-Stock

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10,091

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 973 parts In-Stock

1+ parts

$3.440

100+ parts

-

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$3.371

973

$3.440

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$3.371

Argo Parts USA

USA . 163 parts In-Stock

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$3.440

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163

$3.440

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Netroflash

USA . 100 parts In-Stock

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$3.440

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$3.371

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100

$3.440

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AZTECH Wire

Italy . 880 parts In-Stock

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$9.918

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880

$9.918

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Corohmni

South Africa . 3,128 parts In-Stock

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$23.810

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3,128

$23.810

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Semicontronic

India . 380 parts In-Stock

1+ parts

$25.000

100+ parts

$24.375

1k+ parts

$24.250

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380

$25.000

$24.375

$24.250

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Ampacity Inc.

Singapore . 969 parts In-Stock

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$31.000

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RGB Technical Solutions

Ukraine . 7,155 parts In-Stock

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Lixinc

USA . 4,306 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Microchip USA

USA . 398 parts In-Stock

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Perfect Parts

USA . 138 parts In-Stock

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Overview

Discover the unparalleled quality of Microchip Technology's DSPIC33EP128MC504-I/TL, a cutting-edge Digital Signal Processor designed for a wide range of applications. With advanced features like multiple peripherals, low power mode, and high-speed operation, this chip offers customers unmatched value and benefits. Ideal for industrial use, this product boasts a robust design and innovative technology, making it a game-changer in the industry. Upgrade your projects with the DSPIC33EP128MC504-I/TL and experience the difference in performance and efficiency.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes it easy to integrate into compact designs, saving space and reducing assembly costs.

Maximum Supply Voltage: 3.6 V

Can handle a wide range of supply voltages, providing flexibility in power supply design.

Package Shape: SQUARE

Square package shape allows for efficient use of board space and easy placement on a PCB.

Bit Size: 16

16-bit processing capability provides high precision and performance for signal processing tasks.

Maximum Clock Frequency: 60 MHz

High clock frequency allows for fast processing of signals, making it suitable for real-time applications.

Connectivity: CAN, I2C(2), IRDA, LIN, SPI(2), UART(2)

Multiple communication interfaces enable seamless integration with other components and external devices.

ROM Programmability: FLASH

Flash ROM allows for easy reprogramming of the device, enabling firmware updates and customization.

Low Power Mode: YES

Low power mode helps to conserve energy and extend battery life in portable applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128MC504-I/TL attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-XQCC-N44

JESD-609 Code:

e4

Length:

6 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of I/O Lines:

35

No. of Terminals:

44

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC44,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16384

ROM Words:

43690

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1 mm

Speed:

70 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Data EEPROM Size:

0

Connectivity:

CAN, I2C(2), IRDA, LIN, SPI(2), UART(2)

Peripherals:

BOD, COMPARATOR(4), DMA(4), POR, PWM(4), RTCC, TIMER(5), WDT

Analog To Digital Convertors:

9-Ch 12-Bit

Trade Compliance

DSPIC33EP128MC504-I/TL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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