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VCBUSAM648T9

Texas Instruments

VCBUSAM648T9 by Texas Instruments

VCBUSAM648T9 by Texas Instruments is a digital signal processor (DSP) with a max clock frequency of 900 MHz. It has an address bus width of 14 and an external data bus width of 32. This DSP is commonly used in applications that require high-speed processing and low power consumption.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 4,767 parts In-Stock

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Digiode

USA . 275 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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AZTECH Wire

Italy . 357 parts In-Stock

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$6.159

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Ampacity Inc.

Singapore . 1,029 parts In-Stock

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$13.000

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$13.000

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Semicontronic

India . 683 parts In-Stock

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$21.000

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$20.475

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$20.370

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One Stop Electronics

USA . 900 parts In-Stock

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$22.000

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$22.000

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Corohmni

South Africa . 14 parts In-Stock

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$23.779

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Parana Technologies

USA . 2,323 parts In-Stock

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$28.549

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$48.769

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DigiPath Technology Company

USA . 416 parts In-Stock

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$31.435

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$28.921

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IDEA Electronic Components Group

UK . 1,314 parts In-Stock

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$32.077

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$30.473

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$28.869

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ChromeModa Solutions

Germany . 665 parts In-Stock

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$32.077

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$26.303

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Corphita

USA . 2,447 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Robosynatics

Brazil . 500 parts In-Stock

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Lucentia Tech

USA . 500 parts In-Stock

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$1.923

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$1.923

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$1.923

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$1.923

Continental Prestige Electronics

USA . 456 parts In-Stock

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Argo Parts USA

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Microchip USA

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Overview

Discover the incredible power and versatility of the VCBUSAM648T9 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products, and this digital signal processor is no exception. Designed for a range of applications, this DSP offers unmatched performance and efficiency. With its advanced technology and low power mode, it provides customers with exceptional value and benefits. Whether you need precise data processing or high-speed computations, the VCBUSAM648T9 has got you covered. Experience the advantages of this cutting-edge product and unlock endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protection for the digital signal processor, making it resistant to external factors such as heat and moisture.

Surface Mount: YES

With the surface mount feature, this digital signal processor is easy to install and can be directly mounted on electronic circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 1.26 V

The maximum supply voltage of 1.26 V ensures efficient power management, allowing the digital signal processor to operate effectively without the risk of over-voltage.

Address Bus Width: 14

With a wide 14-bit address bus width, this digital signal processor can handle a larger memory space, allowing for more complex and demanding signal processing tasks.

Package Shape: SQUARE

The square package shape provides a compact design for the digital signal processor, enabling easy integration into various electronic devices and saving valuable space.

No. of Terminals: 520

With 520 terminals, this digital signal processor offers a high level of connectivity, allowing for complex data communication and integration with multiple devices or peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style provides a reliable and efficient electrical connection between the digital signal processor and the circuit board, ensuring stable performance and reducing signal loss.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14 V allows for flexible power options and lower power consumption, making this digital signal processor energy-efficient and suitable for portable or battery-operated devices.

Maximum Operating Temperature: 90 °C

With a maximum operating temperature of 90°C, this digital signal processor can handle high-temperature environments without compromising performance, making it suitable for industrial applications.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable performance even in colder environments, expanding the usability of this digital signal processor across various industries.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance, ensuring stable and long-lasting connections between the digital signal processor and other components.

Terminal Position: BOTTOM

With a bottom terminal position, this digital signal processor can be easily mounted and connected on the underside of the circuit board, optimizing space utilization and facilitating efficient cooling.

Boundary Scan: YES

The boundary scan feature allows for efficient testing and debugging of the digital signal processor during production, ensuring high quality and reliability in the final product.

External Data Bus Width: 32

The wide 32-bit external data bus width offers high-speed data transfer and processing capabilities, enabling this digital signal processor to handle demanding real-time applications with ease.

Maximum Clock Frequency: 900 MHz

The maximum clock frequency of 900 MHz allows for fast and efficient signal processing, enabling this digital signal processor to handle complex algorithms and calculations quickly.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this digital signal processor can withstand the required soldering process without the risk of damage, ensuring reliable manufacturing and assembly.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C ensures proper soldering and connectivity during the assembly process, guaranteeing a robust and reliable digital signal processor.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture allows for efficient data transfer and processing between different parts of the digital signal processor, enhancing overall performance and responsiveness.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

With a peripheral IC type of digital signal processor, this product offers powerful and specialized signal processing capabilities, making it suitable for a wide range of applications requiring advanced digital signal processing algorithms.

Technology: CMOS

The CMOS technology utilized in this digital signal processor ensures low power consumption, high performance, and compatibility with modern electronic devices, making it a reliable and future-proof choice.

Terminal Form: BALL

The ball terminal form provides a reliable and secure electrical connection, allowing the digital signal processor to be easily integrated into electronic systems and withstand the rigors of daily use.

Nominal Supply Voltage: 1.2 V

With a nominal supply voltage of 1.2 V, this digital signal processor offers stable power delivery and optimized energy efficiency, ensuring optimal performance and prolonged battery life in portable devices.

Format: FIXED POINT

The fixed-point format used in this digital signal processor allows for precise and efficient numerical calculations, making it ideal for applications that require accurate signal processing and analysis.

Moisture Sensitivity Level (MSL): 4

With a moisture sensitivity level of 4, this digital signal processor is designed to withstand moderate moisture exposure, ensuring long-term reliability and preventing potential damage in humid environments.

Low Power Mode: YES

The low power mode feature allows for energy-saving operation, reducing power consumption and extending battery life in devices powered by this digital signal processor, making it a sustainable and cost-effective choice.

Technical Specifications

Digital Signal Processors (DSPs) VCBUSAM648T9 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

14

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

900 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B520

JESD-609 Code:

e1

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

520

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

VCBUSAM648T9 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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