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ADSP-BF514BBCZ4F16

Analog Devices

ADSP-BF514BBCZ4F16 by Analog Devices

ADSP-BF514BBCZ4F16 by Analog Devices is a CMOS DSP with Tin/Silver/Copper finish. It can withstand 30s at 260°C peak reflow temp. Ideal for applications requiring high-performance digital signal processing capabilities.

Median Price

$15.679

Lifecycle Status

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4

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1k+

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Nova Conductors

Japan . 700 parts In-Stock

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Vyrian

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Digiode

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AZTECH Wire

Italy . 232 parts In-Stock

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$5.419

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One Stop Electronics

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Semicontronic

India . 626 parts In-Stock

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$17.550

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$17.460

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Aztec Data Supply Inc.

USA . 816 parts In-Stock

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Ampacity Inc.

Singapore . 945 parts In-Stock

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Parana Technologies

USA . 3,811 parts In-Stock

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IDEA Electronic Components Group

UK . 249 parts In-Stock

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Corohmni

South Africa . 805 parts In-Stock

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DigiPath Technology Company

USA . 3,811 parts In-Stock

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Vigor

Singapore . 7,756 parts In-Stock

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Argo Parts USA

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Microchip USA

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Corphita

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Netroflash

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$15.365

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Perfect Parts

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Overview

Unlock the power of cutting-edge technology with the ADSP-BF514BBCZ4F16 by Analog Devices. As a leading manufacturer in the industry, Analog Devices delivers quality digital signal processors that offer unparalleled performance and reliability. Ideal for a wide range of applications, this DSP provides exceptional value to customers seeking advanced processing capabilities. Experience the benefits of seamless integration, rapid data processing, and optimized efficiency with the ADSP-BF514BBCZ4F16. Elevate your projects to new heights with this innovative solution from Analog Devices.

Feature Benefit Bullets

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

This terminal finish provides a reliable and durable connection, ensuring long-term performance and stability of the product.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time of 30 seconds helps in preventing damage to sensitive components during the manufacturing process, leading to a higher yield of fully functioning products.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes without any adverse effects on its functionality.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The use of a digital signal processor in conjunction with other peripheral ICs enhances the processing power and capabilities of the product, making it suitable for a wide range of applications.

Technology: CMOS

The CMOS technology used in this product ensures low power consumption, improved performance, and compatibility with various devices, making it an energy-efficient and versatile choice.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, this product can withstand moderate exposure to moisture during storage and transportation, increasing its reliability and longevity.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-BF514BBCZ4F16 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

JESD-609 Code:

e1

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Technology:

CMOS

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

ADSP-BF514BBCZ4F16 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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