Loading...

DSPIC33EP256MC206T-I/MR

Microchip Technology

DSPIC33EP256MC206T-I/MR by Microchip Technology

DSPIC33EP256MC206T-I/MR by Microchip Technology is a 16-bit digital signal processor (DSP) with a max clock frequency of 60 MHz. It operates at a supply voltage range of 3V to 3.6V and is suitable for industrial applications requiring high-performance signal processing capabilities.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,648 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,648

-

-

-

-

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

300

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 539 parts In-Stock

1+ parts

$10.000

100+ parts

$9.750

1k+ parts

$9.700

10k+ parts

-

539

$10.000

$9.750

$9.700

-

AZTECH Wire

Italy . 790 parts In-Stock

1+ parts

$19.763

100+ parts

-

1k+ parts

-

10k+ parts

-

790

$19.763

-

-

-

Ampacity Inc.

Singapore . 485 parts In-Stock

1+ parts

$28.000

100+ parts

-

1k+ parts

-

10k+ parts

-

485

$28.000

-

-

-

West Coast Incorporated

USA . 5,689 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,689

-

-

-

-

Continental Prestige Electronics

USA . 3,435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,435

-

-

-

-

Microchip USA

USA . 2,711 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,711

-

-

-

-

Argo Parts USA

USA . 641 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

641

-

-

-

-

Bastille Electronics

Australia . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

200

-

-

-

-

Overview

Discover the power of the DSPIC33EP256MC206T-I/MR by Microchip Technology, a high-quality Digital Signal Processor (DSP) that brings unparalleled performance to your applications. With its advanced CMOS technology and flash ROM programmability, this chip offers exceptional speed and flexibility. Whether you're designing industrial control systems or digital audio equipment, the DSPIC33EP256MC206T-I/MR is the perfect choice. Its compact size and surface mount package make it easy to integrate into any design, while its low power consumption ensures energy efficiency. Trust Microchip Technology, a leading manufacturer known for their reliability and innovation. Experience the benefits of this powerful DSP and unlock new possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body enhances durability and reduces the risk of damage.

Surface Mount: YES

Surface mount capability allows for easier and more convenient integration of the DSP into electronic devices.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, this DSP can handle a wide range of power inputs, providing flexibility in different applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space, making it suitable for compact designs.

Bit Size: 16

The 16-bit architecture enables this DSP to process data with high precision and accuracy, enhancing the overall performance.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with various standard voltage levels, simplifying the integration process.

No. of Terminals: 64

The presence of 64 terminals provides ample connectivity options, enabling versatile and extensive functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers excellent heat dissipation capabilities, ensuring optimal performance even in demanding operations.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V allows for efficient power management, enhancing energy efficiency and prolonging battery life.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this DSP can withstand harsh environments and perform reliably in demanding conditions.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C guarantees that the DSP remains functional even in extremely cold environments.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability, contributing to reliable connections and ensuring long-term stability.

Terminal Position: QUAD

The quad terminal position promotes ease of installation and facilitates efficient PCB layouts.

Maximum Seated Height: 1 mm

The low seated height of 1mm enables space-saving designs and seamless integration into compact electronic devices.

Width: 9 mm

With a width of 9mm, this DSP fits well into various electronic applications, offering flexibility in design choices.

Maximum Clock Frequency: 60 MHz

The high maximum clock frequency of 60MHz allows for fast and efficient signal processing tasks.

Maximum Time At Peak Reflow Temperature (s): 40

The maximum time at peak reflow temperature ensures that the DSP can withstand reflow processes during assembly without compromising its reliability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures optimal solder joints during assembly, reducing the risk of soldering defects.

Length: 9 mm

The compact length of 9mm makes this DSP suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this DSP can operate reliably in challenging environments with varying temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

With its capability as a digital signal processor and controller, this product offers versatility and flexibility for a wide range of applications.

Technology: CMOS

The use of CMOS technology ensures low-power operation, making this DSP energy-efficient and suitable for battery-powered devices.

Terminal Form: NO LEAD

The no-lead terminal form enhances the durability and reliability of the connections, contributing to overall product longevity.

Maximum Supply Current: 60 mA

With a maximum supply current of 60mA, this DSP is designed to provide efficient power usage and reduce energy consumption.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with standard power sources, simplifying integration into various systems.

ROM Programmability: FLASH

The flash ROM programmability offers flexibility for firmware updates and customization, enhancing the product's adaptability to different applications.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5mm enables high-density packaging and precise connections, supporting miniaturization and improved performance.

Format: FLOATING POINT

The floating-point format allows for accurate and efficient numerical calculations, making this DSP well-suited for complex mathematical operations.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this product can withstand moderate levels of moisture exposure, ensuring reliability during handling and transportation.

On Chip Program ROM Width: 24

The 24-bit on-chip program ROM width allows for storing and executing complex instructions and algorithms, enhancing the application possibilities of this DSP.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MC206T-I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33EP256MC206T-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20