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DSPIC33CK512MP605-I/M7

Microchip Technology

DSPIC33CK512MP605-I/M7 by Microchip Technology

DSPIC33CK512MP605-I/M7 by Microchip Technology is a 16-bit DSP with 64 MHz clock frequency, 65536 RAM words, and 8 DMA channels. It is used in digital signal processing applications requiring low power mode, FLASH ROM programmability, and multiple internal bus architecture for efficient data processing.

Median Price

$2.560

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 2,867 parts In-Stock

1+ parts

$2.490

100+ parts

$2.050

1k+ parts

$1.880

10k+ parts

$1.800

2,867

$2.490

$2.050

$1.880

$1.800

Mouser Electronics

USA . 502 parts In-Stock

1+ parts

$2.490

100+ parts

-

1k+ parts

-

10k+ parts

-

502

$2.490

-

-

-

DigiKey

USA . 366 parts In-Stock

1+ parts

$2.490

100+ parts

$2.050

1k+ parts

-

10k+ parts

-

366

$2.490

$2.050

-

-

Newark

USA . 220 parts In-Stock

1+ parts

$2.560

100+ parts

$2.220

1k+ parts

$2.110

10k+ parts

-

220

$2.560

$2.220

$2.110

-

Farnell

UK . 175 parts In-Stock

1+ parts

$3.130

100+ parts

-

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-

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175

$3.130

-

-

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Element14

Singapore . 37 parts In-Stock

1+ parts

$3.610

100+ parts

$2.970

1k+ parts

-

10k+ parts

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37

$3.610

$2.970

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-

RS (Exports)

UK . 120 parts In-Stock

1+ parts

-

100+ parts

$4.336

1k+ parts

$4.019

10k+ parts

-

120

-

$4.336

$4.019

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Verical

USA . 119 parts In-Stock

1+ parts

-

100+ parts

$6.388

1k+ parts

-

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119

-

$6.388

-

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Future Electronics

Canada . 61 parts In-Stock

1+ parts

-

100+ parts

$1.880

1k+ parts

$1.850

10k+ parts

$1.800

61

-

$1.880

$1.850

$1.800

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

NAC Semi

USA . 2,318 parts In-Stock

1+ parts

$2.680

100+ parts

$2.420

1k+ parts

$2.170

10k+ parts

-

2,318

$2.680

$2.420

$2.170

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TME

Poland . 119 parts In-Stock

1+ parts

$4.120

100+ parts

-

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119

$4.120

-

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$4.395

100+ parts

-

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15

$4.395

-

-

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Vyrian

USA . 436 parts In-Stock

1+ parts

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436

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IBS Electronics

USA . 61 parts In-Stock

1+ parts

-

100+ parts

$2.444

1k+ parts

$2.405

10k+ parts

$2.340

61

-

$2.444

$2.405

$2.340

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 133 parts In-Stock

1+ parts

$2.120

100+ parts

-

1k+ parts

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10k+ parts

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133

$2.120

-

-

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Semicontronic

India . 125 parts In-Stock

1+ parts

$2.120

100+ parts

$2.067

1k+ parts

$2.056

10k+ parts

-

125

$2.120

$2.067

$2.056

-

Continental Prestige Electronics

USA . 175 parts In-Stock

1+ parts

$3.760

100+ parts

$3.420

1k+ parts

-

10k+ parts

-

175

$3.760

$3.420

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-

Argo Parts USA

USA . 4,244 parts In-Stock

1+ parts

$4.120

100+ parts

-

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10k+ parts

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4,244

$4.120

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$4.395

100+ parts

$4.307

1k+ parts

-

10k+ parts

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2,000

$4.395

$4.307

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Advanced Electronics

New Zealand . 900 parts In-Stock

1+ parts

$4.483

100+ parts

$4.483

1k+ parts

$4.483

10k+ parts

-

900

$4.483

$4.483

$4.483

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Component Stockers USA

USA . 4,441 parts In-Stock

1+ parts

$4.830

100+ parts

$4.020

1k+ parts

$3.680

10k+ parts

-

4,441

$4.830

$4.020

$3.680

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Aztec Data Supply Inc.

USA . 4,476 parts In-Stock

1+ parts

$20.110

100+ parts

-

1k+ parts

-

10k+ parts

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4,476

$20.110

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Corohmni

South Africa . 255 parts In-Stock

1+ parts

$23.011

100+ parts

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255

$23.011

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Montano Global Distributors

Canada . 5,016 parts In-Stock

1+ parts

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5,016

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LOOK Integrated Logistics

Peru . 4,664 parts In-Stock

1+ parts

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4,664

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NIA Electronics

USA . 3,473 parts In-Stock

1+ parts

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3,473

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Ledger Components

France . 3,473 parts In-Stock

1+ parts

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3,473

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LMD Electronica

Estonia . 2,579 parts In-Stock

1+ parts

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2,579

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Overview

Experience the power and precision of the DSPIC33CK512MP605-I/M7 by Microchip Technology, a leader in digital signal processors. This versatile device is perfect for a wide range of applications, offering unparalleled performance and reliability. With its cutting-edge technology and top-notch quality, this product provides customers with exceptional value and benefits. From industrial automation to consumer electronics, trust the DSPIC33CK512MP605-I/M7 to deliver superior results every time. Elevate your projects with Microchip Technology's innovative solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the DSP, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing overall manufacturing costs.

Maximum Supply Voltage: 3.6 V

Operates efficiently within a range of 3 V to 3.6 V, making it suitable for low power consumption applications.

On Chip Data RAM Width: 8

With a data RAM width of 8, the DSP can efficiently process and handle data-intensive tasks with ease.

Package Shape: SQUARE

The square package shape provides a compact form factor, making it ideal for space-constrained applications.

Bit Size: 16

With a 16-bit architecture, the DSP can handle complex calculations and processing tasks effectively.

No. of Terminals: 48

Having 48 terminals allows for multiple connectivity options and flexibility in interfacing with other components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles enhance thermal management and overall performance of the DSP.

Minimum Supply Voltage: 3 V

Operates efficiently within a range of 3 V to 3.6 V, making it suitable for low power consumption applications.

Maximum Operating Temperature: 85 °C

Capable of operating at high temperatures up to 85°C, making it suitable for rugged industrial environments.

No. of External Interrupts: 4

Having 4 external interrupts allows for efficient handling of external events and interrupts for improved real-time performance.

Minimum Operating Temperature: -40 °C

Capable of operating at low temperatures down to -40°C, making it suitable for a wide range of environments.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection, ensuring reliable operation in high vibration environments.

Maximum Seated Height: 0.9 mm

The maximum seated height of 0.9 mm ensures a low profile design, ideal for compact electronic devices.

RAM Words: 65536

With a large RAM capacity of 65536 words, the DSP can efficiently store and process a significant amount of data.

Width: 6 mm

With a width of 6 mm, the DSP can be easily integrated into compact electronic devices without occupying much space.

Boundary Scan: YES

Boundary scan feature allows for easier testing and debugging during manufacturing and improves overall product reliability.

Maximum Clock Frequency: 64 MHz

With a high maximum clock frequency of 64 MHz, the DSP can handle real-time processing tasks efficiently and effectively.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures allows for efficient data transfer and communication between different components of the DSP.

Length: 6 mm

With a length of 6 mm, the DSP maintains a compact form factor suitable for space-constrained applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

As a digital signal processor and controller, the DSP can handle both signal processing and control functions efficiently in various applications.

Technology: CMOS

CMOS technology offers low power consumption and high integration capabilities, making the DSP energy-efficient and cost-effective.

Terminal Form: NO LEAD

No lead terminal form eliminates the risk of lead contamination and ensures environmental sustainability.

Maximum Supply Current: 35 mA

Operating at a maximum supply current of 35 mA ensures efficient power management and low energy consumption.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage of 3.3 V provides stable and reliable power to the DSP for consistent performance.

No. of DMA Channels: 8

Having 8 DMA channels allows for efficient data transfer between peripherals and memory, improving overall system performance.

No. of Serial I/Os: 3

With 3 serial I/Os, the DSP can communicate with multiple external devices simultaneously, expanding its connectivity options.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick firmware updates, enhancing the flexibility and versatility of the DSP.

Terminal Pitch: 0.4 mm

With a terminal pitch of 0.4 mm, the DSP offers high density mounting options, saving space on the PCB.

Format: FIXED POINT

Operates in fixed-point format, providing faster and more efficient processing of integer-based calculations.

Low Power Mode: YES

With a low power mode, the DSP can reduce power consumption during idle or low processing tasks, improving overall energy efficiency.

Barrel Shifter: YES

Incorporating a barrel shifter allows for efficient shifting and rotating operations, enhancing the processing speed and power efficiency of the DSP.

On Chip Program ROM Width: 8

With an on-chip program ROM width of 8, the DSP can store and execute program instructions efficiently, improving overall performance.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33CK512MP605-I/M7 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N48

Length:

6 mm

Low Power Mode:

YES

No. of DMA Channels:

8

No. of External Interrupts:

4

No. of Serial I/Os:

3

No. of Terminals:

48

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.24SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

.9 mm

Maximum Supply Current:

35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

DSPIC33CK512MP605-I/M7 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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