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TMS320C6672ACYPA25

Texas Instruments

TMS320C6672ACYPA25 by Texas Instruments

TMS320C6672ACYPA25 by Texas Instruments is a 32-bit DSP with integrated cache and 64-bit external data bus. It operates at temperatures from -40 to 100 °C, suitable for industrial applications. With 144 DMA channels and low power mode, it offers high performance in digital signal processing tasks.

Median Price

$316.438

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 234 parts In-Stock

1+ parts

$227.093

100+ parts

$205.559

1k+ parts

$195.770

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234

$227.093

$205.559

$195.770

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Rochester

USA . 11,330 parts In-Stock

1+ parts

$269.310

100+ parts

$253.150

1k+ parts

$236.990

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11,330

$269.310

$253.150

$236.990

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DigiKey

USA . 11,330 parts In-Stock

1+ parts

$336.640

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11,330

$336.640

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Mouser Electronics

USA . 34 parts In-Stock

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$383.470

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$305.350

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34

$383.470

$305.350

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Verical

USA . 10,358 parts In-Stock

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-

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$316.438

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$296.238

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10,358

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$316.438

$296.238

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Distributors (In-Stock)

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Digiode

USA . 687 parts In-Stock

1+ parts

$215.738

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687

$215.738

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Nova Conductors

Japan . 50 parts In-Stock

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$235.073

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50

$235.073

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Vyrian

USA . 5,535 parts In-Stock

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5,535

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Chip Stock

USA . 601 parts In-Stock

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601

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Distributors (Availability)

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Parana Technologies

USA . 295 parts In-Stock

1+ parts

$15.952

100+ parts

-

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$16.303

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295

$15.952

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$16.303

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DigiPath Technology Company

USA . 916 parts In-Stock

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$17.566

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916

$17.566

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ChromeModa Solutions

Germany . 5,518 parts In-Stock

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$17.924

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$14.698

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5,518

$17.924

$14.698

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IDEA Electronic Components Group

UK . 2,209 parts In-Stock

1+ parts

$17.924

100+ parts

$17.028

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$16.132

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2,209

$17.924

$17.028

$16.132

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Corohmni

South Africa . 857 parts In-Stock

1+ parts

$47.029

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$47.029

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Ampacity Inc.

Singapore . 5,444 parts In-Stock

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$193.030

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$193.030

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Semicontronic

India . 5,281 parts In-Stock

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$193.030

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$188.204

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$187.239

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5,281

$193.030

$188.204

$187.239

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Corphita

USA . 717 parts In-Stock

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$204.384

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$204.384

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Continental Prestige Electronics

USA . 5,758 parts In-Stock

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$232.729

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$228.074

5,758

$232.729

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$228.074

QUARKTWIN TECHNOLOGY LTD

USA . 20,622 parts In-Stock

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

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Argo Parts USA

USA . 2,749 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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$230.372

1k+ parts

$223.320

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$218.618

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$230.372

$223.320

$218.618

Perfect Parts

USA . 58 parts In-Stock

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GreenTree Electronics

Israel . 6 parts In-Stock

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Overview

Experience unparalleled performance and efficiency with the TMS320C6672ACYPA25 by Texas Instruments, a leading manufacturer in the field of Digital Signal Processors. This revolutionary product boasts integrated cache, boundary scan capabilities, and a wide array of power supplies for optimal flexibility. Ideal for a variety of applications, this DSP offers customers unmatched speed and precision, making it the perfect choice for those seeking top-notch quality and reliability. Upgrade your system today with the TMS320C6672ACYPA25 and unlock a world of possibilities!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes this DSP lightweight and durable.

Integrated Cache: YES

The integrated cache helps improve processing speed and efficiency of this DSP.

Surface Mount: YES

Being surface mountable allows for easy and convenient integration of this DSP onto circuit boards.

Maximum Supply Voltage: 1.155 V

This maximum supply voltage ensures safe operation of the DSP without exceeding its limits.

On Chip Data RAM Width: 8

The wide on-chip data RAM width of 8 allows for efficient data storage and retrieval.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design for this DSP.

Bit Size: 32

With a bit size of 32, this DSP offers high processing capability for complex algorithms and computations.

Power Supplies (V): 1,1.5,1.8

The multiple power supply options provide flexibility in powering the DSP according to different requirements.

No. of Terminals: 841

The large number of terminals allows for versatile connectivity options with other components in a system.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style ensures secure mounting and reliable connections for the DSP.

Minimum Supply Voltage: 1.045 V

The minimum supply voltage requirement ensures that the DSP can operate efficiently even at lower power levels.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100°C, this DSP can function reliably under varying environmental conditions.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40°C ensures that this DSP can perform in cold temperatures without any issues.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper provides excellent conductivity and corrosion resistance for long-lasting performance of the DSP.

Terminal Position: BOTTOM

The bottom terminal position allows for easy access and connection of external components to the DSP.

Maximum Seated Height: 3.39 mm

The maximum seated height of 3.39 mm ensures proper clearance and space for the DSP within a system.

RAM Words: 16384

With a capacity of 16384 RAM words, this DSP can handle large amounts of data for processing efficiently.

Width: 24 mm

The width of 24 mm makes this DSP compact and suitable for applications with space constraints.

Boundary Scan: YES

The boundary scan feature allows for efficient testing and debugging of the DSP during production and maintenance.

External Data Bus Width: 64

The wide external data bus width of 64 enables high-speed data transfer between the DSP and external devices.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering of the DSP onto circuit boards without overheating.

Peak Reflow Temperature °C: 245

With a peak reflow temperature of 245°C, this DSP can withstand the soldering process during assembly.

Internal Bus Architecture: SINGLE

The single internal bus architecture simplifies data flow and communication within the DSP for efficient processing.

Length: 24 mm

The length of 24 mm provides a compact form factor for easy integration of the DSP into various systems.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this DSP can operate reliably in harsh environmental conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type of digital signal processor along with other functions makes this DSP versatile for a wide range of applications.

No. of Timers: 10

With 10 timers, this DSP can handle multiple timing functions simultaneously, making it suitable for time-sensitive applications.

Technology: CMOS

The CMOS technology used in this DSP offers low power consumption and high-speed performance.

Terminal Form: BALL

The ball terminal form provides secure connections and ensures reliable contact with other components in a system.

Nominal Supply Voltage: 1.1 V

The nominal supply voltage of 1.1 V ensures stable operation and power efficiency of this DSP.

No. of DMA Channels: 144

With 144 DMA channels, this DSP can efficiently manage data transfer tasks between peripherals and memory.

ROM Programmability: MROM

The MROM programmability feature allows for secure and permanent storage of essential data and firmware on the DSP.

Terminal Pitch: 0.8 mm

The terminal pitch of 0.8 mm enables precise and compact placement of the DSP on circuit boards.

Format: FLOATING POINT

With a floating-point format, this DSP can perform complex mathematical calculations with high precision.

Moisture Sensitivity Level (MSL): 4

With an MSL of 4, this DSP can withstand moderate moisture exposure during storage and handling.

Low Power Mode: YES

The low power mode option allows the DSP to operate efficiently with reduced power consumption when required.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 provides ample space for storing program code and instructions on the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6672ACYPA25 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B841

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

144

No. of Terminals:

841

No. of Timers:

10

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

16384

ROM Programmability:

MROM

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.155 V

Minimum Supply Voltage:

1.045 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6672ACYPA25 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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