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DSPIC33CH512MP508T-E/PTVAO

Microchip Technology

DSPIC33CH512MP508T-E/PTVAO by Microchip Technology

DSPIC33CH512MP508T-E/PTVAO by Microchip Technology is a 16-bit digital signal processor with 64 MHz clock frequency, 49152 RAM words, and 3.6V max supply voltage. Ideal for automotive applications due to AEC-Q100 screening level, it features low power mode, flash ROM programmability, and multiple internal bus architecture.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 26,062 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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15

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Ampacity Inc.

Singapore . 26,296 parts In-Stock

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$3.680

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$3.680

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AZTECH Wire

Italy . 884 parts In-Stock

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$18.610

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Aztec Data Supply Inc.

USA . 3,458 parts In-Stock

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$47.070

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$47.070

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Corohmni

South Africa . 569 parts In-Stock

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$61.819

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569

$61.819

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Infinite Electronics LLP (Excess)

. 11,803 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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Fulton Briggs Corp.

USA . 5,792 parts In-Stock

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Argo Parts USA

USA . 2,681 parts In-Stock

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Continental Prestige Electronics

USA . 2,330 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the DSPIC33CH512MP508T-E/PTVAO by Microchip Technology. This high-quality Digital Signal Processor boasts a range of applications in various industries, offering unparalleled performance and reliability. With a maximum clock frequency of 64 MHz and low power mode feature, this product provides exceptional value to customers looking for top-notch solutions that deliver results. Trust in Microchip Technology's expertise and invest in the future of innovation with the DSPIC33CH512MP508T-E/PTVAO.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body can provide good thermal conductivity and electrical insulation, making the product reliable and durable.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into compact electronic devices, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6V, the product can operate efficiently within a standard voltage range, ensuring compatibility with various power sources.

On Chip Data RAM Width: 8

Having a wider data RAM width of 8 can enhance the processing speed and efficiency of the digital signal processor, allowing for faster data manipulation and analysis.

Package Shape: SQUARE

The square package shape offers a compact and symmetrical design, making it easier to mount and align the DSP in electronic circuits.

Bit Size: 16

With a bit size of 16, the DSP can handle a wide range of data and provide high precision in signal processing, suitable for demanding applications.

No. of Terminals: 80

Having 80 terminals provides ample connectivity options for interfacing with external devices and peripherals, increasing the versatility of the DSP.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40°C ensures reliable performance even in harsh environmental conditions, making it suitable for automotive and industrial applications.

Maximum Clock Frequency: 64 MHz

With a maximum clock frequency of 64 MHz, the DSP can execute instructions quickly and handle high-speed data processing tasks efficiently.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, contributing to energy efficiency and reliable performance of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33CH512MP508T-E/PTVAO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

16kbytes slave core Ram available

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G80

Length:

12 mm

Low Power Mode:

YES

No. of DMA Channels:

8

No. of External Interrupts:

3

No. of Serial I/Os:

2

No. of Terminals:

80

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

RAM Words:

49152

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

98 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

12 mm

Peripheral IC Type:

Trade Compliance

DSPIC33CH512MP508T-E/PTVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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