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TMS320C30GEL40

Texas Instruments

TMS320C30GEL40 by Texas Instruments

TMS320C30GEL40 by Texas Instruments is a 32-bit DSP with 5V supply, 40MHz clock frequency, and 1024 RAM words. Ideal for digital signal processing applications due to its 32-bit data RAM width, 24-bit address bus width, and floating-point format support.

Median Price

$741.025

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,038 parts In-Stock

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$722.930

100+ parts

$679.550

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$636.180

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$722.930

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$636.180

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DigiKey

USA . 1,084 parts In-Stock

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$759.120

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$759.120

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Freelance Electronics

USA . 1 parts In-Stock

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$254.453

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Nova Conductors

Japan . 41 parts In-Stock

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$651.460

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Digiode

USA . 1,468 parts In-Stock

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$693.424

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Vyrian

USA . 978 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

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Resion

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Electronics Depot

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Parana Technologies

USA . 719 parts In-Stock

1+ parts

$26.290

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$26.887

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719

$26.290

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ChromeModa Solutions

Germany . 6,622 parts In-Stock

1+ parts

$29.539

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$24.222

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$29.539

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IDEA Electronic Components Group

UK . 41 parts In-Stock

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$29.539

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$28.062

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$26.585

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41

$29.539

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$26.585

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Corohmni

South Africa . 268 parts In-Stock

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$65.134

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Ampacity Inc.

Singapore . 1,067 parts In-Stock

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$620.430

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Semicontronic

India . 721 parts In-Stock

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$620.430

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$604.919

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$601.817

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$601.817

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Continental Prestige Electronics

USA . 2,687 parts In-Stock

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$650.810

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$637.794

2,687

$650.810

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$637.794

Argo Parts USA

USA . 412 parts In-Stock

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$650.810

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$644.302

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$637.794

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$631.286

412

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$644.302

$637.794

$631.286

Corphita

USA . 2,476 parts In-Stock

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$656.928

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QUARKTWIN TECHNOLOGY LTD

USA . 21,816 parts In-Stock

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Authorized Procurement Solutions

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DigiPath Technology Company

USA . 1,795 parts In-Stock

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Kepictronics

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Perfect Parts

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Bastille Electronics

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Microchip USA

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ChipTracer

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Overview

Experience next-level processing power with the TMS320C30GEL40 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers exceptional quality and reliability. This DSP offers unparalleled performance for a wide range of applications, from telecommunications to industrial automation. With its cutting-edge technology and efficient design, the TMS320C30GEL40 provides customers with unmatched value, benefits, and advantages. Upgrade your system today with the TMS320C30GEL40 and revolutionize your processing capabilities.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability, making the product suitable for various environments and applications.

Maximum Supply Voltage: 5.25 V

Allows for a higher supply voltage range, providing flexibility and stability in power input.

On Chip Data RAM Width: 32

Wide data RAM width allows for efficient data processing and storage capabilities.

Address Bus Width: 24

A wider address bus width enables the processor to access a larger memory space, improving overall performance.

Package Shape: SQUARE

Square shape is space-efficient and allows for easier integration into circuit boards or systems.

Bit Size: 32

Larger bit size provides higher precision and processing capabilities for complex algorithms and computations.

Power Supplies (V): 5

Standard voltage supply ensures compatibility with existing power sources and systems.

No. of Terminals: 181

High number of terminals allow for versatile connectivity and interfacing with other components or devices.

Package Style (Meter): GRID ARRAY

Grid array package style offers better thermal performance and signal integrity, enhancing overall reliability.

Minimum Supply Voltage: 4.75 V

Provides a lower voltage limit to prevent overloading the processor and ensure safe operation.

Maximum Operating Temperature: 85 °C

High operating temperature range enables the processor to function reliably in demanding conditions.

No. of External Interrupts: 4

External interrupts allow for responsive and real-time processing of events or signals from external sources.

Minimum Operating Temperature: 0 °C

Low operating temperature limit ensures the processor can operate in cold environments without performance degradation.

Terminal Position: PERPENDICULAR

Perpendicular terminal position facilitates easier and more secure connection to external components or circuitry.

Maximum Seated Height: 6.22 mm

Compact seated height allows for space-saving installation in constrained areas or devices.

RAM Words: 1024

Large RAM capacity provides ample storage for data processing and computation, accommodating complex algorithms and programs.

Width: 39 mm

Moderate width facilitates easy integration into standard PCB designs or form factors.

External Data Bus Width: 32

Wide external data bus width enables high-speed data transfer and processing between the processor and external components.

Maximum Clock Frequency: 40 MHz

High clock frequency allows for fast and efficient execution of instructions, improving overall processing speed.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data transfer efficiency and enables parallel processing, optimizing performance.

Length: 39 mm

Moderate length ensures compatibility with standard PCB layouts and form factors, facilitating easy integration.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated peripheral IC type enhances signal processing capabilities and supports a wide range of applications.

No. of Timers: 2

Timers facilitate scheduling and timing functions, essential for real-time processing and event triggering.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and reliable performance, making the processor energy-efficient and durable.

Terminal Form: PIN/PEG

Pin/peg terminal form simplifies installation and connection processes, ensuring secure and reliable electrical contacts.

Maximum Supply Current: 600 mA

High supply current enables the processor to power multiple components or peripherals, supporting complex and demanding applications.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent and reliable operation of the processor across various conditions and loads.

No. of Serial I/Os: 2

Serial I/O ports enable communication with external devices or interfaces, expanding the processor's connectivity and versatility.

ROM Programmability: MROM

MROM programmability allows for permanent storage of essential firmware or software, ensuring data integrity and system stability.

Terminal Pitch: 2.54 mm

Standard terminal pitch simplifies PCB design and assembly processes, facilitating compatibility with common connectors and sockets.

Format: FLOATING POINT

Floating-point format enhances computational accuracy and precision for numerical calculations, critical for scientific or data-intensive applications.

Barrel Shifter: YES

Barrel shifter feature improves the efficiency of shift operations, enabling faster data manipulation and computation.

On Chip Program ROM Width: 32

Wide program ROM width allows for storing a large number of instructions and programs, supporting complex software algorithms and applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C30GEL40 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-CPGA-P181

Length:

39 mm

Low Power Mode:

NO

No. of DMA Channels:

1

No. of External Interrupts:

4

No. of Serial I/Os:

2

No. of Terminals:

181

No. of Timers:

2

On Chip Data RAM Width:

32

On Chip Program ROM Width:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

PGA

Package Equivalence Code:

PGA181M,15X15

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Words:

1024

ROM Programmability:

MROM

Maximum Seated Height:

6.22 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

600 mA

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

PERPENDICULAR

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

39 mm

Peripheral IC Type:

Trade Compliance

TMS320C30GEL40 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-449-1191, 5962014491191

NIIN

014491191

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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