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DSPIC33EP256MC502-E/SO

Microchip Technology

DSPIC33EP256MC502-E/SO by Microchip Technology

DSPIC33EP256MC502-E/SO by Microchip Technology is a 16-bit digital signal processor with 3.3V power supplies, 60MHz clock frequency, and 32768 RAM words. Ideal for automotive applications, it features flash ROM programmability, low power mode, and boundary scan capability for efficient control and processing tasks in compact designs.

Median Price

$4.500

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 81 parts In-Stock

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$4.500

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81

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Vyrian

USA . 5,349 parts In-Stock

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5,349

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 2,000 parts In-Stock

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$4.500

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2,000

$4.500

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Continental Prestige Electronics

USA . 1,315 parts In-Stock

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$4.500

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$4.410

1,315

$4.500

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$4.410

Argo Parts USA

USA . 426 parts In-Stock

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$4.500

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426

$4.500

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Ampacity Inc.

Singapore . 821 parts In-Stock

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$18.000

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821

$18.000

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AZTECH Wire

Italy . 738 parts In-Stock

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$19.854

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738

$19.854

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Semicontronic

India . 1,125 parts In-Stock

1+ parts

$33.000

100+ parts

$32.175

1k+ parts

$32.010

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1,125

$33.000

$32.175

$32.010

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$34.126

100+ parts

$32.420

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$32.420

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1,000

$34.126

$32.420

$32.420

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Corohmni

South Africa . 321 parts In-Stock

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$47.968

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321

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Aztec Data Supply Inc.

USA . 143 parts In-Stock

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$78.260

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143

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QUARKTWIN TECHNOLOGY LTD

USA . 28,348 parts In-Stock

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NIA Electronics

USA . 4,890 parts In-Stock

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Ledger Components

France . 4,890 parts In-Stock

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LOOK Integrated Logistics

Peru . 3,819 parts In-Stock

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Montano Global Distributors

Canada . 1,931 parts In-Stock

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LMD Electronica

Estonia . 1,249 parts In-Stock

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Microchip USA

USA . 157 parts In-Stock

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157

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Overview

Unleash the power of digital signal processing with the Microchip Technology DSPIC33EP256MC502-E/SO. Crafted by industry leaders, this versatile chip delivers unmatched performance and reliability for a wide range of applications. Whether you're designing cutting-edge automotive systems or high-tech controllers, this DSP will exceed your expectations. With its innovative features and top-notch quality, the DSPIC33EP256MC502-E/SO offers unbeatable value and benefits to customers looking to stay ahead of the curve. Elevate your projects to new heights with this exceptional digital signal processor from Microchip Technology.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and cost-effectiveness.

Surface Mount:

YES - Easy to integrate into PCB designs.

Maximum Supply Voltage:

3.6 V - Supports a wide range of power supply options.

On Chip Data RAM Width:

8 - Efficient data processing capabilities.

Screening Level:

TS 16949 - Ensures high-quality standards for automotive applications.

Package Shape:

RECTANGULAR - Space-efficient design for compact systems.

Bit Size:

16 - Suitable for processing complex algorithms.

Power Supplies (V):

3.3 - Common voltage level for compatibility with other components.

No. of Terminals:

28 - Sufficient connectivity options for various applications.

Package Style (Meter):

SMALL OUTLINE - Ensures compatibility with modern PCB layouts.

Minimum Supply Voltage:

3 V - Can operate on low-power sources.

Maximum Operating Temperature:

125 °C - Suitable for harsh operating environments.

No. of External Interrupts:

3 - Allows for efficient handling of external events.

Minimum Operating Temperature:

40 °C - Can withstand cold temperature conditions.

Terminal Finish:

Matte Tin (Sn) - annealed - Provides corrosion resistance for longevity.

Terminal Position:

DUAL - Offers flexibility in PCB mounting orientations.

Maximum Seated Height:

2.65 mm - Low profile design for space-constrained applications.

RAM Words:

32768 - Sufficient memory capacity for data storage and processing.

Width:

7.5 mm - Compact form factor for integration in tight spaces.

Boundary Scan:

YES - Facilitates testing and debugging during manufacturing.

Maximum Clock Frequency:

60 MHz - Fast processing speed for real-time applications.

Maximum Time At Peak Reflow Temperature (s):

40 - Ensures reliable soldering during assembly.

Peak Reflow Temperature °C:

250 - Ensures components can withstand high soldering temperatures.

Length:

17.9 mm - Balanced dimensions for a versatile range of applications.

Temperature Grade:

AUTOMOTIVE - Suitable for automotive-grade performance standards.

Peripheral IC Type:

DIGITAL SIGNAL PROCESSOR, CONTROLLER - Versatile capabilities for various signal processing tasks.

No. of Timers:

5 - Allows for precise timing functions in applications.

Technology:

CMOS - Provides low power consumption and high-speed operation.

Terminal Form:

GULL WING - Secure and stable terminal connection for reliability.

Maximum Supply Current:

55 mA - Efficient power usage for extended battery life.

Nominal Supply Voltage:

3.3 V - Stable voltage supply for consistent performance.

No. of DMA Channels:

4 - Supports efficient data transfer operations.

ROM Programmability:

FLASH - Enables easy firmware updates and customization.

Terminal Pitch:

1.27 mm - Standard pitch size for compatibility with mounting processes.

Format:

FIXED POINT - Suitable for applications requiring precise mathematical calculations.

Low Power Mode:

YES - Energy-efficient operation for battery-powered devices.

On Chip Program ROM Width:

8 - Adequate storage for program code.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MC502-E/SO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Trade Compliance

DSPIC33EP256MC502-E/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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