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TMS320DM6435ZWT6CX

Texas Instruments

TMS320DM6435ZWT6CX by Texas Instruments

TMS320DM6435ZWT6CX by Texas Instruments is a 32-bit DSP with 13-bit address bus, operating b/w 0-90°C. It features low power mode, boundary scan, and CMOS technology. Ideal for digital signal processing applications requiring high performance in a compact package.

Median Price

$30.449

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

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$30.449

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Vyrian

USA . 8,406 parts In-Stock

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Digiode

USA . 2,416 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 133 parts In-Stock

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$3.000

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Ampacity Inc.

Singapore . 1,166 parts In-Stock

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$8.000

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AZTECH Wire

Italy . 589 parts In-Stock

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$13.769

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589

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Semicontronic

India . 980 parts In-Stock

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$23.000

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$22.425

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$22.310

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980

$23.000

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Aranea Global

USA . 1,000 parts In-Stock

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$29.840

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$28.646

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$29.840

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Continental Prestige Electronics

USA . 3,626 parts In-Stock

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$30.449

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$29.840

Corohmni

South Africa . 272 parts In-Stock

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$33.217

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Parana Technologies

USA . 1,141 parts In-Stock

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$68.882

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DigiPath Technology Company

USA . 894 parts In-Stock

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$75.847

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$69.779

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ChromeModa Solutions

Germany . 4,116 parts In-Stock

1+ parts

$77.395

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$63.464

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IDEA Electronic Components Group

UK . 2,341 parts In-Stock

1+ parts

$77.395

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$73.525

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$69.656

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2,341

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QUARKTWIN TECHNOLOGY LTD

USA . 22,775 parts In-Stock

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Argo Parts USA

USA . 4,018 parts In-Stock

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Corphita

USA . 566 parts In-Stock

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Overview

Experience unparalleled performance and efficiency with the TMS320DM6435ZWT6CX by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality digital signal processors that excel in a variety of applications. From audio processing to image recognition, this DSP offers exceptional value, benefits, and advantages to customers looking to enhance their products. Trust Texas Instruments for cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is cost-effective and provides good thermal and electrical insulation for the DSP.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly of the DSP.

Maximum Supply Voltage: 1.26 V

Operates efficiently within a safe voltage range to prevent damage to the DSP.

Address Bus Width: 13

High address bus width allows for efficient memory addressing within the DSP.

Terminal Finish: TIN SILVER COPPER

TIN SILVER COPPER terminal finish provides good conductivity and corrosion resistance for reliable connections.

Maximum Operating Temperature: 90 °C

Capable of operating at high temperatures without performance degradation, suitable for various environments.

External Data Bus Width: 32

Wide external data bus allows for fast data processing and communication within the DSP.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Designed specifically as a digital signal processor for efficient signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for energy-efficient operation.

Low Power Mode: YES

Low power mode feature helps in reducing power consumption and extending battery life for portable devices.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM6435ZWT6CX attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

EMIF ADDRESS BUS 22 AND DATA BUS 8 AVAILABLE

Address Bus Width:

13

Barrel Shifter:

NO

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

361

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6435ZWT6CX Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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