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TMS320C6713BGDP300

Texas Instruments

TMS320C6713BGDP300 by Texas Instruments

TMS320C6713BGDP300 by Texas Instruments is a 32-bit DSP with integrated cache, operating at a max clock frequency of 300 MHz. It features 65536 RAM words and has a package style of grid array. This DSP is commonly used in digital signal processing applications requiring high-speed data processing capabilities.

Median Price

$56.970

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 105 parts In-Stock

1+ parts

$47.050

100+ parts

$44.220

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$39.990

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105

$47.050

$44.220

$39.990

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Texas Instruments

USA . 7,508 parts In-Stock

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$49.358

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$43.874

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$32.260

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$49.358

$43.874

$32.260

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Arrow

USA . 39 parts In-Stock

1+ parts

$56.970

100+ parts

$43.420

1k+ parts

$42.900

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39

$56.970

$43.420

$42.900

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Verical

USA . 39 parts In-Stock

1+ parts

$56.970

100+ parts

$43.420

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$42.900

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39

$56.970

$43.420

$42.900

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DigiKey

USA . 15 parts In-Stock

1+ parts

$70.560

100+ parts

$54.237

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$51.851

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15

$70.560

$54.237

$51.851

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Distributors (In-Stock)

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DigiKey Marketplace

USA . 126 parts In-Stock

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$42.370

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$42.370

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Bristol Electronics

USA . 91 parts In-Stock

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$43.440

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$35.621

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91

$43.440

$35.621

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Digiode

USA . 2,778 parts In-Stock

1+ parts

$44.698

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2,778

$44.698

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$45.689

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50

$45.689

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Vyrian

USA . 4,237 parts In-Stock

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4,237

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Chip Stock

USA . 3,322 parts In-Stock

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Dan-Mar Components

USA . 91 parts In-Stock

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EZ Electronic Parts

Israel . 55 parts In-Stock

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Speed Components Ltd

Israel . 6 parts In-Stock

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6

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Prism Electronics

USA . 2 parts In-Stock

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2

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Inventory MP

USA . 1 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 937 parts In-Stock

1+ parts

$39.990

100+ parts

$38.990

1k+ parts

$38.790

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937

$39.990

$38.990

$38.790

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Ampacity Inc.

Singapore . 816 parts In-Stock

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$39.990

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816

$39.990

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Component Stockers USA

USA . 7,613 parts In-Stock

1+ parts

$41.970

100+ parts

$39.460

1k+ parts

$34.820

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7,613

$41.970

$39.460

$34.820

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Corphita

USA . 151 parts In-Stock

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$42.345

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$42.345

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Continental Prestige Electronics

USA . 5,103 parts In-Stock

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$45.689

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$44.776

5,103

$45.689

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$44.776

Parana Technologies

USA . 1,829 parts In-Stock

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$52.700

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$52.700

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DigiPath Technology Company

USA . 576 parts In-Stock

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$58.030

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$58.030

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ChromeModa Solutions

Germany . 5,418 parts In-Stock

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$59.214

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$48.555

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5,418

$59.214

$48.555

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IDEA Electronic Components Group

UK . 1,293 parts In-Stock

1+ parts

$59.214

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$56.253

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$53.293

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1,293

$59.214

$56.253

$53.293

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Corohmni

South Africa . 24 parts In-Stock

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$78.050

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Argo Parts USA

USA . 3,033 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,645 parts In-Stock

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Lixinc

USA . 1,242 parts In-Stock

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Perfect Parts

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Robosynatics

Brazil . 100 parts In-Stock

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S.R.D Solutions

India . 100 parts In-Stock

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Lucentia Tech

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Authorized Procurement Solutions

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Futuretech Components

Singapore . 68 parts In-Stock

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Computer Components Inc. - USA

USA . 24 parts In-Stock

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Overview

Unlock the potential of cutting-edge technology with the TMS320C6713BGDP300 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality digital signal processors for a wide range of applications. This powerful DSP offers unmatched performance and reliability, making it the perfect choice for your next project. Experience seamless integration, lightning-fast processing speeds, and advanced features that set this product apart from the competition. Trust Texas Instruments to provide the tools you need to succeed in today's fast-paced digital world.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the product lightweight and durable, ideal for portable devices.

Integrated Cache: YES

The integrated cache helps in accelerating data processing, making the product efficient and fast.

Surface Mount: YES

Surface mount technology allows for easy and compact PCB assembly, saving space in the design.

Maximum Supply Voltage: 1.47 V

With a maximum supply voltage of 1.47 V, this product is power-efficient and can help in reducing energy consumption.

Address Bus Width: 22

The wide address bus width of 22 helps in handling large amounts of data efficiently, making it suitable for processing complex signals.

Package Shape: SQUARE

The square package shape is space-saving and makes it easier to integrate into various electronic devices.

Bit Size: 32

The 32-bit size ensures high processing capabilities, making this product suitable for demanding DSP applications.

Power Supplies (V): 1.4,3.3

The availability of multiple power supply options provides flexibility in design and compatibility with different systems.

No. of Terminals: 272

The high number of terminals allows for versatile connectivity options, making it suitable for various applications.

Package Style (Meter): GRID ARRAY

The grid array package style provides high reliability in harsh environments and ensures good connection integrity.

Minimum Supply Voltage: 1.33 V

The low minimum supply voltage makes this product energy-efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 90 °C

With a maximum operating temperature of 90°C, this product can perform reliably in high-temperature environments.

No. of External Interrupts: 4

The availability of 4 external interrupts allows for efficient handling of real-time events in the system.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable performance in cold conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish provides good solderability and reliability in the assembly process.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy PCB layout and routing for efficient design.

Maximum Seated Height: 2.57 mm

The low maximum seated height allows for compact and slim device designs.

RAM Words: 65536

The large RAM capacity of 65536 words enables efficient data storage and processing for complex algorithms.

Width: 27 mm

The compact width of 27 mm makes this product suitable for space-constrained applications.

Boundary Scan: YES

The boundary scan feature helps in testing and diagnosing the product during manufacturing and maintenance.

External Data Bus Width: 32

The wide external data bus width of 32 enhances data transfer speed and processing efficiency.

Maximum Clock Frequency: 300 MHz

The high maximum clock frequency of 300 MHz enables fast data processing and real-time signal handling.

Peak Reflow Temperature °C: 220

The peak reflow temperature of 220°C ensures reliable soldering during the assembly process.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data flow and processing efficiency for complex signal processing tasks.

Length: 27 mm

The compact length of 27 mm allows for flexibility in PCB layout and design integration.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type ensures compatibility with various digital signal processing applications and peripherals.

No. of Timers: 2

The availability of 2 timers allows for efficient timing control and synchronization in signal processing tasks.

Technology: CMOS

The CMOS technology offers low power consumption and high-speed performance for energy-efficient processing.

Terminal Form: BALL

The ball terminal form provides secure and reliable connections in the assembly process.

Nominal Supply Voltage: 1.4 V

The nominal supply voltage of 1.4 V provides stable power delivery for consistent performance.

No. of DMA Channels: 16

The availability of 16 DMA channels enables efficient data transfer and processing without CPU intervention.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for high-density mounting and compact PCB designs.

Format: FLOATING POINT

The floating-point format allows for precise and accurate mathematical calculations in signal processing applications.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 ensures proper handling and storage of the product to maintain reliability.

Low Power Mode: YES

The low-power mode feature helps in optimizing power consumption for energy-efficient operation.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6713BGDP300 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

300 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B272

JESD-609 Code:

e0

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of External Interrupts:

4

No. of Terminals:

272

No. of Timers:

2

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA272,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

65536

Maximum Seated Height:

2.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.47 V

Minimum Supply Voltage:

1.33 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6713BGDP300 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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