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DSPIC33EP256MU814-E/PLVAO

Microchip Technology

DSPIC33EP256MU814-E/PLVAO by Microchip Technology

DSPIC33EP256MU814-E/PLVAO by Microchip is a 16-bit DSP with 28672 RAM words, operating at up to 60 MHz. Ideal for automotive applications, it features 9 timers, 15 DMA channels, and low power mode support. With a wide temperature range (-40 to 125 °C) and AEC-Q100 screening level, it's suitable for demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,390 parts In-Stock

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1,390

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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AZTECH Wire

Italy . 348 parts In-Stock

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$10.990

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348

$10.990

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Ampacity Inc.

Singapore . 251 parts In-Stock

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$21.000

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Marpe Global Electronics

Taiwan . 6,356 parts In-Stock

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Continental Prestige Electronics

USA . 5,427 parts In-Stock

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Argo Parts USA

USA . 4,770 parts In-Stock

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4,770

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QualityLine Systems

Poland . 4,483 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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XL Components Corporation

Australia . 147 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the DSPIC33EP256MU814-E/PLVAO by Microchip Technology. As a leader in the industry, Microchip brings you a top-of-the-line Digital Signal Processor that offers unparalleled performance and reliability. Designed for a wide range of applications, this processor boasts high-quality construction and innovative features that deliver exceptional value to customers. Experience seamless operation and enhanced efficiency with the DSPIC33EP256MU814-E/PLVAO, setting a new standard in digital signal processing technology. Elevate your projects with Microchip's superior solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy installation and integration into electronic devices.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage provides flexibility in power supply options for the product.

On Chip Data RAM Width: 8

Having a wider data RAM width allows for faster data processing and efficient performance.

Screening Level: AEC-Q100

This level of screening ensures high reliability and quality standards, ideal for automotive applications.

Package Shape: SQUARE

The compact square shape saves space and allows for efficient board layout designs.

Bit Size: 16

A 16-bit architecture provides enhanced computational capabilities and precision for signal processing tasks.

No. of Terminals: 144

Having a higher number of terminals allows for more connectivity options and functionalities.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a compact form factor, low profile design, and fine pitch for optimized performance and space-saving.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

No. of External Interrupts: 5

Having multiple external interrupts allows for efficient handling of external events and real-time responsiveness.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Quad terminal position offers stable connectivity and secure mounting on the circuit board.

Maximum Seated Height: 1.6 mm

The low seated height allows for a sleek and compact design, ideal for space-constrained applications.

RAM Words: 28672

Having a large RAM capacity allows for efficient storage and processing of data for complex applications.

Width: 20 mm

Compact width dimension enables easy integration and space-saving in electronic device designs.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging the product during the manufacturing process.

Maximum Clock Frequency: 60 MHz

A high clock frequency enables fast execution of instructions and real-time signal processing.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture allows for parallel processing and efficient data transfer within the chip.

Length: 20 mm

The compact length dimension contributes to a space-efficient design and easy integration in electronic devices.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature grade ensures reliable performance in automotive applications with temperature variations.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combining digital signal processor and controller functions in one IC offers versatile signal processing and control capabilities.

No. of Timers: 9

Having multiple timers allows for precise timing control and synchronization of various operations.

Technology: CMOS

CMOS technology provides low power consumption, high-speed operation, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

Gull wing terminal form offers reliable solder connections and secure mounting on the circuit board.

Maximum Supply Current: 320 mA

The high maximum supply current capability ensures the product can handle power-intensive tasks.

Nominal Supply Voltage: 3.3 V

Having a stable nominal supply voltage ensures consistent performance and compatibility with standard power sources.

No. of DMA Channels: 15

Having multiple DMA channels enables efficient data transfer between peripherals and memory, improving overall system performance.

ROM Programmability: FLASH

Flash-ROM programmability allows for flexible and easy updating of firmware and software applications.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density packaging and enables efficient routing of signals.

Format: FLOATING POINT

Floating-point format provides precise numeric representation and enhances accuracy in mathematical operations.

Low Power Mode: YES

Low power mode functionality helps in reducing power consumption during idle or low activity periods.

On Chip Program ROM Width: 8

Having a wide on-chip program ROM width enables storage of program instructions for efficient execution.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MU814-E/PLVAO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

Low Power Mode:

YES

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

144

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

RAM Words:

28672

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Trade Compliance

DSPIC33EP256MU814-E/PLVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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