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DSPIC33EP32MC204-I/PTVAO

Microchip Technology

DSPIC33EP32MC204-I/PTVAO by Microchip Technology

DSPIC33EP32MC204-I/PTVAO by Microchip Technology is a 16-bit digital signal processor with 4096 RAM words, operating at up to 60 MHz. It features 3 external interrupts, 5 timers, and 4 DMA channels. Ideal for industrial applications requiring high-speed processing in a compact package with low power consumption.

Median Price

$2.100

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.100

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10

$2.100

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Vyrian

USA . 422 parts In-Stock

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422

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,180 parts In-Stock

1+ parts

$2.100

100+ parts

-

1k+ parts

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$2.058

4,180

$2.100

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$2.058

Argo Parts USA

USA . 1,983 parts In-Stock

1+ parts

$2.100

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Advanced Electronics

New Zealand . 58 parts In-Stock

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$2.142

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$2.142

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$2.142

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58

$2.142

$2.142

$2.142

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AZTECH Wire

Italy . 756 parts In-Stock

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$7.615

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756

$7.615

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Ampacity Inc.

Singapore . 1,204 parts In-Stock

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$10.000

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1,204

$10.000

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Aztec Data Supply Inc.

USA . 1,570 parts In-Stock

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$21.960

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1,570

$21.960

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Semicontronic

India . 1,274 parts In-Stock

1+ parts

$26.000

100+ parts

$25.350

1k+ parts

$25.220

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1,274

$26.000

$25.350

$25.220

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Corohmni

South Africa . 317 parts In-Stock

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$32.357

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317

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LMD Electronica

Estonia . 4,380 parts In-Stock

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Montano Global Distributors

Canada . 3,320 parts In-Stock

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LOOK Integrated Logistics

Peru . 2,089 parts In-Stock

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NIA Electronics

USA . 2,002 parts In-Stock

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Ledger Components

France . 2,002 parts In-Stock

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Overview

Experience the power and precision of Microchip Technology's DSPIC33EP32MC204-I/PTVAO, a top-of-the-line Digital Signal Processor designed for high-performance applications. With a combination of cutting-edge technology and reliable manufacturing, this product offers customers unmatched value and benefits. From industrial automation to automotive systems, this versatile DSP ensures seamless operation and efficient processing at all times. Trust Microchip Technology to deliver exceptional quality and performance in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material makes this DSP lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage of 3.6 V provides flexibility in power supply options and compatibility with various systems.

On Chip Data RAM Width: 8

Having a wide on-chip data RAM width of 8 allows for efficient data processing and storage, improving overall performance.

Screening Level: AEC-Q100; TS 16949

Compliance with AEC-Q100 and TS 16949 standards ensures high quality, reliability, and automotive-grade performance for critical applications.

Package Shape: SQUARE

The square package shape provides a compact and space-saving design, making it suitable for tight spaces and miniaturized devices.

Bit Size: 16

With a 16-bit size, this DSP can handle complex and high-resolution signal processing tasks with precision and efficiency.

No. of Terminals: 44

Having 44 terminals offers versatile connectivity options and interfaces for integrating with other components and peripherals.

Package Style (Meter): FLATPACK, THIN PROFILE

The flatpack, thin profile package style enhances thermal performance and allows for efficient heat dissipation, ensuring optimal operation even under high temperature conditions.

Minimum Supply Voltage: 3 V

The low minimum supply voltage of 3 V conserves power consumption and extends the battery life of portable devices.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C enables reliable performance in harsh environments and industrial settings.

No. of External Interrupts: 3

Having 3 external interrupts allows for efficient handling of external events and real-time processing, enhancing system responsiveness.

Minimum Operating Temperature: -40 °C

The wide minimum operating temperature range of -40°C ensures reliable operation in extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and ensures reliable electrical connections for long-term performance.

Terminal Position: QUAD

The quad terminal position offers stable and secure connections, reducing signal interference and improving overall reliability.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2 mm allows for slim and compact device designs without sacrificing functionality or performance.

RAM Words: 4096

With 4096 RAM words, this DSP can efficiently store and process a large amount of data, enabling complex signal processing algorithms and tasks.

Width: 10 mm

The compact width of 10 mm facilitates space-saving integration into various electronic devices and systems.

Boundary Scan: YES

The boundary scan feature enables easy testing and debugging of the DSP during production and maintenance, saving time and effort in troubleshooting.

Maximum Clock Frequency: 60 MHz

With a high maximum clock frequency of 60 MHz, this DSP can handle fast signal processing tasks and real-time operations with efficiency.

Length: 10 mm

The compact length of 10 mm makes this DSP suitable for integration into space-constrained applications and devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with varying temperature conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combining digital signal processing and controller capabilities in one device offers versatile functionality and control for a wide range of applications.

No. of Timers: 5

Having 5 timers allows for precise timing control and synchronization of operations, enhancing the efficiency and performance of the system.

Technology: CMOS

Using CMOS technology provides low power consumption, high speed, and reliable operation, making this DSP suitable for battery-powered and energy-efficient applications.

Terminal Form: GULL WING

The gull wing terminal form offers secure and stable connections for reliable signal transmission and reduces the risk of signal loss or interference.

Maximum Supply Current: 55 mA

The low maximum supply current of 55 mA helps in minimizing power consumption and heat dissipation, ensuring energy efficiency and prolonging device lifespan.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V provides stable and efficient power supply for the DSP, ensuring consistent and reliable performance.

No. of DMA Channels: 4

Having 4 DMA channels allows for efficient and high-speed data transfer between peripherals and memory, optimizing overall system performance.

ROM Programmability: FLASH

Using flash ROM programmability offers flexibility and ease of updating firmware and configurations, enabling adaptability to changing requirements and environments.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for precise and secure mounting on the PCB, ensuring reliable electrical connections and signal integrity.

Format: FIXED POINT

The fixed-point format simplifies signal processing algorithms and calculations, improving computational efficiency and reducing processing time.

Low Power Mode: YES

The low-power mode feature helps in reducing power consumption during idle or standby periods, conserving energy and extending battery life.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 enables efficient storage and execution of program instructions, enhancing overall system performance and responsiveness.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP32MC204-I/PTVAO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

44

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP44,.47SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

RAM Words:

4096

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

55 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

DSPIC33EP32MC204-I/PTVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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