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DSPIC33CK64MP102-I/2N

Microchip Technology

DSPIC33CK64MP102-I/2N by Microchip Technology

DSPIC33CK64MP102-I/2N by Microchip Technology is a 16-bit digital signal processor with 8192 RAM words, operating at a max clock frequency of 64 MHz. It features 4 DMA channels and is suitable for industrial applications requiring high-speed processing and low power consumption. The chip's CMOS technology, flash ROM programmability, and multiple internal bus architecture make it ideal for digital signal processing tasks in various industries.

Median Price

$1.570

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 598 parts In-Stock

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$1.570

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$1.300

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598

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DigiKey

USA . 489 parts In-Stock

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$1.570

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$1.300

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489

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$1.300

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.682

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100

$2.682

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Vyrian

USA . 836 parts In-Stock

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836

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Distributors (Availability)

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Semicontronic

India . 850 parts In-Stock

1+ parts

$1.330

100+ parts

$1.297

1k+ parts

$1.290

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850

$1.330

$1.297

$1.290

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Ampacity Inc.

Singapore . 486 parts In-Stock

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$1.330

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486

$1.330

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Argo Parts USA

USA . 2,935 parts In-Stock

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$2.682

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2,935

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Netroflash

USA . 1,000 parts In-Stock

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$2.682

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$2.629

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1,000

$2.682

$2.629

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Continental Prestige Electronics

USA . 769 parts In-Stock

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$2.682

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$2.629

769

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$2.629

Advanced Electronics

New Zealand . 26 parts In-Stock

1+ parts

$2.734

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$2.734

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$2.734

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26

$2.734

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$2.734

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Corohmni

South Africa . 4,958 parts In-Stock

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$28.619

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$28.619

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Aztec Data Supply Inc.

USA . 14,082 parts In-Stock

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$73.210

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14,082

$73.210

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RGB Technical Solutions

Ukraine . 1,505 parts In-Stock

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Lixinc

USA . 1,206 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the DSPIC33CK64MP102-I/2N by Microchip Technology. As a leader in digital signal processors, Microchip Technology delivers unparalleled quality and reliability. Ideal for a range of applications, this versatile DSP offers customers exceptional value, benefits, and advantages. Say goodbye to compromise and hello to top-tier performance with the DSPIC33CK64MP102-I/2N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable electronic devices.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The various package styles provide flexibility in design and allow for efficient heat dissipation, enhancing performance and reliability.

Maximum Clock Frequency: 64 MHz

The high clock frequency enables fast processing speeds, making the product ideal for applications requiring real-time signal processing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, resulting in efficient operation and reliable performance.

ROM Programmability: FLASH

Flash programmability allows for easy firmware updates and customization, making the product versatile and adaptable to different requirements.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33CK64MP102-I/2N attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N28

Length:

6 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Serial I/Os:

3

No. of Terminals:

28

No. of Timers:

4

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.24SQ,25

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

8192

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

.55 mm

Maximum Supply Current:

35 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

DSPIC33CK64MP102-I/2N Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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