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DSPIC33EP256MU810T-I/PF

Microchip Technology

DSPIC33EP256MU810T-I/PF by Microchip Technology

DSPIC33EP256MU810T-I/PF by Microchip Technology is a 16-bit digital signal processor with 28672 RAM words, operating at up to 60 MHz. Ideal for industrial applications, it features 9 timers, 15 DMA channels, and low power mode for efficient performance in various control systems.

Median Price

$10.910

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,553 parts In-Stock

1+ parts

$10.910

100+ parts

$9.040

1k+ parts

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1,553

$10.910

$9.040

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DigiKey

USA . 474 parts In-Stock

1+ parts

$10.910

100+ parts

$9.040

1k+ parts

$9.040

10k+ parts

-

474

$10.910

$9.040

$9.040

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$9.860

100+ parts

-

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300

$9.860

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Vyrian

USA . 1,276 parts In-Stock

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-

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1,276

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,113 parts In-Stock

1+ parts

$7.560

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1,113

$7.560

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Semicontronic

India . 1,065 parts In-Stock

1+ parts

$7.560

100+ parts

$7.371

1k+ parts

$7.333

10k+ parts

-

1,065

$7.560

$7.371

$7.333

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Corohmni

South Africa . 796 parts In-Stock

1+ parts

$8.601

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796

$8.601

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Continental Prestige Electronics

USA . 3,075 parts In-Stock

1+ parts

$9.860

100+ parts

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10k+ parts

$9.663

3,075

$9.860

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$9.663

Netroflash

USA . 100 parts In-Stock

1+ parts

$9.860

100+ parts

$9.663

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100

$9.860

$9.663

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Aztec Data Supply Inc.

USA . 1,275 parts In-Stock

1+ parts

$64.120

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1,275

$64.120

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QUARKTWIN TECHNOLOGY LTD

USA . 13,247 parts In-Stock

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13,247

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Lixinc

USA . 7,612 parts In-Stock

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7,612

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RGB Technical Solutions

Ukraine . 2,602 parts In-Stock

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2,602

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Argo Parts USA

USA . 2,406 parts In-Stock

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2,406

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Overview

Unlock the power of advanced digital signal processing with the Microchip Technology DSPIC33EP256MU810T-I/PF. Designed for efficiency and performance, this cutting-edge DSP offers unparalleled quality and reliability. Whether you're working on industrial automation, motor control, or power management applications, this device delivers exceptional value with its high-speed processing capabilities and low power consumption. Trust Microchip Technology to provide you with the tools you need to bring your projects to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the DSP, making it suitable for a variety of operating conditions.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a wide range of systems.

Bit Size: 16

Offers high computational power and precision for processing digital signals efficiently.

Maximum Operating Temperature: 85 °C

Ensures reliable performance in industrial applications where higher temperatures may be encountered.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combining DSP and controller functionalities in one device provides versatility and efficiency in signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and robust against interference.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MU810T-I/PF attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

15

No. of External Interrupts:

5

No. of Serial I/Os:

0

No. of Terminals:

100

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

28672

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

320 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Trade Compliance

DSPIC33EP256MU810T-I/PF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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