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DSPIC33EP16GS202T-E/SSVAO

Microchip Technology

DSPIC33EP16GS202T-E/SSVAO by Microchip Technology

DSPIC33EP16GS202T-E/SSVAO by Microchip Technology is a 16-bit digital signal processor with a max clock frequency of 60 MHz. It operates in automotive-grade temperatures from -40 to 125 °C and has flash ROM programmability. This small outline package with 28 terminals is ideal for automotive applications requiring high-speed processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

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Vyrian

USA . 443 parts In-Stock

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Nova Conductors

Japan . 63 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 644 parts In-Stock

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$10.841

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Ampacity Inc.

Singapore . 1,191 parts In-Stock

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$30.000

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West Coast Incorporated

USA . 8,044 parts In-Stock

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Continental Prestige Electronics

USA . 3,240 parts In-Stock

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Argo Parts USA

USA . 847 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the Microchip Technology DSPIC33EP16GS202T-E/SSVAO Digital Signal Processor. Manufactured by a trusted industry leader, this high-quality product boasts a range of applications in various fields. With its advanced features and exceptional performance, customers can expect unparalleled value and benefits. Say goodbye to limitations and hello to endless possibilities with the DSPIC33EP16GS202T-E/SSVAO - your solution for all digital signal processing needs.

Feature Benefit Bullets

Package Body Material: GLASS

Glass package provides excellent insulation and protection for the diode, ensuring reliable performance and durability.

Surface Mount: YES

Allows for easy and convenient mounting on circuit boards, saving space and simplifying the assembly process.

Maximum Reverse Recovery Time: 0.005 us

Fast reverse recovery time ensures efficient switching operation, making this diode suitable for high-speed applications.

Maximum Reverse Current: 0.5 uA

Low reverse current minimizes power losses and improves overall efficiency of the circuit.

Minimum Breakdown Voltage: 100 V

High breakdown voltage rating provides robust protection against voltage spikes and overloads.

Maximum Forward Voltage (VF): 1.2 V

Low forward voltage drop results in minimal power loss and helps improve energy efficiency of the system.

Diode Element Material: SILICON

Silicon diodes are known for their high reliability and consistent performance, making them a preferred choice in various applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP16GS202T-E/SSVAO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

OPERATES UPTO 60MIPS; AEC-Q100 (PLANNED)

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

10.2 mm

No. of Terminals:

28

On Chip Program ROM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

2 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.3 mm

Trade Compliance

DSPIC33EP16GS202T-E/SSVAO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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