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DSPIC33EP128MC504T-I/TL

Microchip Technology

DSPIC33EP128MC504T-I/TL by Microchip Technology

DSPIC33EP128MC504T-I/TL by Microchip is a 16-bit DSP with max clock freq of 60MHz. Operating temp range -40 to 85°C, supply voltage 3-3.6V, and max supply current of 150mA. Ideal for industrial applications requiring high-speed signal processing in a compact square package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,135 parts In-Stock

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5,135

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Distributors (Availability)

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AZTECH Wire

Italy . 609 parts In-Stock

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$18.415

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609

$18.415

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Ampacity Inc.

Singapore . 1,522 parts In-Stock

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$20.000

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1,522

$20.000

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Semicontronic

India . 682 parts In-Stock

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$23.000

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$22.425

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$22.310

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682

$23.000

$22.425

$22.310

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LMD Electronica

Estonia . 7,276 parts In-Stock

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Continental Prestige Electronics

USA . 5,747 parts In-Stock

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LOOK Integrated Logistics

Peru . 2,652 parts In-Stock

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NIA Electronics

USA . 1,639 parts In-Stock

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Ledger Components

France . 1,639 parts In-Stock

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Lixinc

USA . 1,320 parts In-Stock

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Argo Parts USA

USA . 1,099 parts In-Stock

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Montano Global Distributors

Canada . 960 parts In-Stock

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Microchip USA

USA . 259 parts In-Stock

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Bastille Electronics

Australia . 63 parts In-Stock

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Overview

Experience unparalleled performance and efficiency with the DSPIC33EP128MC504T-I/TL by Microchip Technology. As a leading manufacturer in the industry, Microchip Technology delivers top-notch quality in their digital signal processors (DSPs) like no other. Unlock endless possibilities with this versatile product, suitable for a wide range of applications. From its compact size to its impressive clock frequency, this chip is designed to exceed your expectations. Trust Microchip Technology to provide you with cutting-edge technology that brings value, benefits, and advantages to your projects. Elevate your designs with the DSPIC33EP128MC504T-I/TL today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy and efficient mounting on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Support for a high maximum supply voltage allows for flexibility in power supply designs.

Package Shape: SQUARE

Square package shape can provide better thermal performance compared to other shapes.

Bit Size: 16

A 16-bit architecture allows for efficient processing of data with moderate complexity.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable operation of the DSP.

No. of Terminals: 44

Having 44 terminals allows for connectivity to various external components, expanding the functionality of the DSP.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Multiple package styles cater to different application requirements, ensuring compatibility and efficient heat dissipation.

Minimum Supply Voltage: 3 V

Support for a low minimum supply voltage enables operation in diverse power supply conditions.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures the DSP can function reliably in industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the DSP to operate in extreme cold conditions without performance degradation.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent corrosion resistance and ensures reliable electrical connections.

Terminal Position: QUAD

Quad terminal positioning facilitates easy connection to the PCB and simplifies assembly.

Maximum Seated Height: 1 mm

Low seated height saves space on the PCB and allows for more compact product designs.

Width: 6 mm

Compact width allows for efficient placement on the PCB along with other components.

Maximum Clock Frequency: 60 MHz

High clock frequency enables fast processing of data and real-time signal handling.

Length: 6 mm

Short length contributes to the compact footprint of the DSP on the PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature specifications ensure reliable operation in harsh manufacturing environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Versatile peripheral IC type supports various signal processing and control applications, enhancing the DSP's utility.

Technology: CMOS

CMOS technology offers low power consumption and high integration capabilities, making the DSP energy-efficient.

Terminal Form: NO LEAD

No-lead terminal form simplifies the manufacturing process and reduces environmental impact.

Maximum Supply Current: 150 mA

Moderate supply current requirement ensures efficient power usage and extends the product's battery life.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance of the DSP under normal operating conditions.

ROM Programmability: FLASH

ROM programmability via flash memory allows for easy firmware updates and customization of the DSP's functionalities.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density mounting on the PCB, saving valuable board space.

Format: FLOATING POINT

Floating-point format enhances the precision and range of calculations the DSP can perform, making it suitable for complex algorithms.

On Chip Program ROM Width: 24

Having a wide on-chip program ROM allows for storing more instructions and data, increasing the DSP's processing capabilities.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP128MC504T-I/TL attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

JESD-30 Code:

S-XQCC-N44

JESD-609 Code:

e4

Length:

6 mm

No. of Terminals:

44

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC44,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

6 mm

Trade Compliance

DSPIC33EP128MC504T-I/TL Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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