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OMAP5910JZZG2

Texas Instruments

OMAP5910JZZG2 by Texas Instruments

OMAP5910JZZG2 by Texas Instruments is a 16-bit DSP with 163840 RAM words, operating at 13 MHz. It features an integrated cache, 25-bit address bus width, and low power mode. Ideal for industrial applications requiring high-speed signal processing in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,823 parts In-Stock

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Digiode

USA . 1,948 parts In-Stock

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Nova Conductors

Japan . 700 parts In-Stock

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One Stop Electronics

USA . 1,564 parts In-Stock

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$2.000

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AZTECH Wire

Italy . 494 parts In-Stock

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$13.482

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Ampacity Inc.

Singapore . 609 parts In-Stock

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$18.000

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Parana Technologies

USA . 1,927 parts In-Stock

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$38.488

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$3,574.199

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$34.639

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$3,574.199

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DigiPath Technology Company

USA . 850 parts In-Stock

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$42.380

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$38.990

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ChromeModa Solutions

Germany . 1,837 parts In-Stock

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$43.245

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$35.461

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IDEA Electronic Components Group

UK . 1,469 parts In-Stock

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$43.245

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$41.083

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$38.920

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Corohmni

South Africa . 2,212 parts In-Stock

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Continental Prestige Electronics

USA . 3,397 parts In-Stock

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Argo Parts USA

USA . 3,077 parts In-Stock

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Corphita

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Microchip USA

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Bastille Electronics

Australia . 120 parts In-Stock

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Futuretech Components

Singapore . 102 parts In-Stock

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Overview

Discover the cutting-edge OMAP5910JZZG2 by Texas Instruments, a top-tier digital signal processor designed to elevate your projects to new heights. With Texas Instruments' renowned reputation for quality and reliability, this DSP ensures superior performance and efficiency in a variety of applications. Whether you're working on industrial automation, telecommunications, or consumer electronics, the OMAP5910JZZG2 provides unmatched value, benefits, and advantages that will take your designs to the next level. Experience the power of innovation with Texas Instruments today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for portable or rugged applications.

Integrated Cache: YES

Having an integrated cache improves the processing speed and efficiency of the DSP, making it suitable for real-time signal processing tasks.

Address Bus Width: 25

The 25-bit address bus width allows for efficient memory addressing and data transfer, enhancing the overall performance of the DSP.

Power Supplies (V): 1.6,1.8/2.75/3.3

Supporting multiple power supply voltages offers flexibility in designing electronic systems and ensures compatibility with various power sources.

RAM Words: 163840

With a large RAM capacity of 163840 words, the DSP can handle complex algorithms and store extensive data, making it suitable for demanding signal processing applications.

Maximum Clock Frequency: 13 MHz

The high maximum clock frequency of 13 MHz enables the DSP to perform rapid calculations and process signals efficiently, making it suitable for high-speed applications.

Technology: CMOS

The CMOS technology used in the DSP ensures low power consumption and high noise immunity, making it energy-efficient and reliable for various electronic systems.

Low Power Mode: YES

The availability of a low power mode allows the DSP to conserve energy during idle or low processing tasks, extending battery life in portable devices.

Technical Specifications

Digital Signal Processors (DSPs) OMAP5910JZZG2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 2.75V OR 3.3V SUPPLY

Address Bus Width:

25

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

13 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

6

No. of Terminals:

289

No. of Timers:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.6,1.8/2.75/3.3

Qualification:

Not Qualified

RAM Words:

163840

ROM Programmability:

MROM

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.675 V

Minimum Supply Voltage:

1.525 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

OMAP5910JZZG2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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