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OMAP5910JGDY2

Texas Instruments

OMAP5910JGDY2 by Texas Instruments

OMAP5910JGDY2 by Texas Instruments is a 16-bit DSP with integrated cache, 163840 RAM words, and 13 MHz clock frequency. Ideal for industrial applications requiring low power consumption, it features multiple internal bus architecture and 8 timers for efficient digital signal processing tasks.

Median Price

$75.380

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 19 parts In-Stock

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$70.940

100+ parts

$51.450

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19

$70.940

$51.450

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DigiKey

USA . 66 parts In-Stock

1+ parts

$79.820

100+ parts

$59.706

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$58.266

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66

$79.820

$59.706

$58.266

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Distributors (In-Stock)

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Digiode

USA . 3,084 parts In-Stock

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$51.348

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3,084

$51.348

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Vyrian

USA . 4,930 parts In-Stock

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4,930

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Chip Stock

USA . 2,544 parts In-Stock

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Nova Conductors

Japan . 64 parts In-Stock

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EMSNET

USA . 16 parts In-Stock

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Elcom Components

USA . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 323 parts In-Stock

1+ parts

$9.703

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323

$9.703

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Ampacity Inc.

Singapore . 57 parts In-Stock

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$45.940

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57

$45.940

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Corohmni

South Africa . 67 parts In-Stock

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$46.833

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67

$46.833

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Corphita

USA . 3,026 parts In-Stock

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$48.645

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$48.645

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Parana Technologies

USA . 1,183 parts In-Stock

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$56.315

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DigiPath Technology Company

USA . 1,260 parts In-Stock

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$62.010

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$62.010

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ChromeModa Solutions

Germany . 2,088 parts In-Stock

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$63.275

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$51.886

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$63.275

$51.886

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IDEA Electronic Components Group

UK . 548 parts In-Stock

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$63.275

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$60.111

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$56.948

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548

$63.275

$60.111

$56.948

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Microchip USA

USA . 3,155 parts In-Stock

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$124.430

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Lixinc

USA . 15,600 parts In-Stock

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Kepictronics

USA . 8,443 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,537 parts In-Stock

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Argo Parts USA

USA . 1,867 parts In-Stock

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Continental Prestige Electronics

USA . 1,103 parts In-Stock

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Perfect Parts

USA . 188 parts In-Stock

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Bastille Electronics

Australia . 84 parts In-Stock

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Overview

Discover the cutting-edge OMAP5910JGDY2 by Texas Instruments, a top-tier Digital Signal Processor that brings unparalleled quality and performance to your projects. With integrated cache and multiple power supply options, this DSP is designed to meet industrial standards with ease. From boundary scan capability to low power mode, this versatile processor excels in a variety of applications, offering customers unmatched value and efficiency. Elevate your designs with the OMAP5910JGDY2 and experience the benefits of Texas Instruments' superior technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP.

Integrated Cache: YES

Improves processing speed by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.675 V

Allows for efficient power usage and prevents damage from high voltage.

Address Bus Width: 25

Enables the processor to access a larger memory address space for complex computations.

Minimum Operating Temperature: -40 °C

Ensures the DSP can function in extreme cold environments without performance degradation.

Bit Size: 16

Provides a good balance between processing power and power efficiency for various applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Allows the DSP to handle a variety of signal processing tasks efficiently.

No. of DMA Channels: 6

Enables efficient data transfer between peripherals and memory without CPU intervention.

Technology: CMOS

Ensures low power consumption and high noise immunity for reliable operation.

Technical Specifications

Digital Signal Processors (DSPs) OMAP5910JGDY2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 2.75V OR 3.3V SUPPLY

Address Bus Width:

25

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

13 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e0

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of Terminals:

289

No. of Timers:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA289,17X17,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.6,1.8/2.75/3.3

Qualification:

Not Qualified

RAM Words:

163840

ROM Programmability:

MROM

Maximum Seated Height:

2.32 mm

Speed:

192 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.675 V

Minimum Supply Voltage:

1.525 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

19 mm

Peripheral IC Type:

Trade Compliance

OMAP5910JGDY2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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