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OMAP5910JZDY2

Texas Instruments

OMAP5910JZDY2 by Texas Instruments

OMAP5910JZDY2 by Texas Instruments is a 16-bit DSP with integrated cache, operating at a max frequency of 13 MHz. Ideal for industrial applications, it features an address bus width of 25 bits and a RAM capacity of 163840 words. With low power mode and boundary scan capabilities, this processor offers efficient performance in digital signal processing tasks.

Median Price

$46.770

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 34 parts In-Stock

1+ parts

$46.770

100+ parts

$40.350

1k+ parts

$40.350

10k+ parts

$40.350

34

$46.770

$40.350

$40.350

$40.350

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,009 parts In-Stock

1+ parts

$44.432

100+ parts

-

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3,009

$44.432

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$50.086

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10

$50.086

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Vyrian

USA . 8,534 parts In-Stock

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8,534

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Chip Stock

USA . 250 parts In-Stock

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250

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Distributors (Availability)

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AZTECH Wire

Italy . 862 parts In-Stock

1+ parts

$19.814

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862

$19.814

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Ampacity Inc.

Singapore . 34 parts In-Stock

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$39.750

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34

$39.750

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Corphita

USA . 883 parts In-Stock

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$42.093

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883

$42.093

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Aranea Global

USA . 2,000 parts In-Stock

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$49.084

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$47.121

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2,000

$49.084

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$47.121

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Continental Prestige Electronics

USA . 5,723 parts In-Stock

1+ parts

$50.086

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$49.084

5,723

$50.086

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$49.084

Parana Technologies

USA . 1,228 parts In-Stock

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$68.995

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1,228

$68.995

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ChromeModa Solutions

Germany . 6,863 parts In-Stock

1+ parts

$77.522

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$63.568

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6,863

$77.522

$63.568

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IDEA Electronic Components Group

UK . 776 parts In-Stock

1+ parts

$77.522

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$73.646

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$69.770

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776

$77.522

$73.646

$69.770

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Corohmni

South Africa . 2,413 parts In-Stock

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$80.161

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2,413

$80.161

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Semicontronic

India . 34 parts In-Stock

1+ parts

$86.520

100+ parts

$84.357

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$83.924

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34

$86.520

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$83.924

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Microchip USA

USA . 3,859 parts In-Stock

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$100.798

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$100.798

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QUARKTWIN TECHNOLOGY LTD

USA . 19,430 parts In-Stock

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Lixinc

USA . 6,073 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,956 parts In-Stock

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4,956

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Metaverse IC Inc.

Canada . 2,521 parts In-Stock

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DigiPath Technology Company

USA . 1,600 parts In-Stock

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$69.894

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$69.894

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Futuretech Components

Singapore . 500 parts In-Stock

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Argo Parts USA

USA . 302 parts In-Stock

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Overview

Experience the cutting-edge technology of the Texas Instruments OMAP5910JZDY2 Digital Signal Processor. This high-quality product offers unparalleled performance in a variety of applications, from communications to industrial automation. With its integrated cache and low power mode, this DSP provides efficient processing and extended battery life. Trust in the reliability and innovation of Texas Instruments to bring you the best in digital signal processing technology. Elevate your projects with the OMAP5910JZDY2 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and cost-effectiveness, making it suitable for various applications.

Integrated Cache: YES

Improves processing speed and efficiency, enhancing overall performance of the DSP.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards, saving time and effort.

Maximum Supply Voltage: 1.675 V

Ensures stable power supply to the DSP, preventing damage from voltage fluctuations.

Address Bus Width: 25

Allows for efficient communication with other components, enhancing system compatibility.

Package Shape: SQUARE

Offers a compact design for space-saving integration in electronic devices.

Bit Size: 16

Provides processing power for handling complex algorithms and calculations effectively.

Power Supplies (V): 1.6,1.8/2.75/3.3

Offers flexibility in power input options, suitable for different voltage requirements.

No. of Terminals: 289

Provides ample connection points for interfacing with external components, increasing versatility.

Package Style (Meter): GRID ARRAY

Enhances thermal dissipation and reliability, improving long-term performance.

Minimum Supply Voltage: 1.525 V

Allows for operation at lower voltage levels, reducing power consumption and heat generation.

Maximum Operating Temperature: 85 °C

Enables the DSP to function reliably in various environmental conditions, increasing its usability.

Minimum Operating Temperature: -40 °C

Maintains functionality in extreme temperature environments, ensuring consistent performance.

Terminal Finish: TIN SILVER COPPER

Enhances connectivity and conductivity, improving signal transmission efficiency.

Terminal Position: BOTTOM

Facilitates easy integration into existing circuitry, simplifying the installation process.

Technical Specifications

Digital Signal Processors (DSPs) OMAP5910JZDY2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 2.75V OR 3.3V SUPPLY

Address Bus Width:

25

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

13 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

19 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of Terminals:

289

No. of Timers:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA289,17X17,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.6,1.8/2.75/3.3

Qualification:

Not Qualified

RAM Words:

163840

ROM Programmability:

MROM

Maximum Seated Height:

2.32 mm

Speed:

192 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.675 V

Minimum Supply Voltage:

1.525 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

19 mm

Peripheral IC Type:

Trade Compliance

OMAP5910JZDY2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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