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OMAP5910JGZG2

Texas Instruments

OMAP5910JGZG2 by Texas Instruments

OMAP5910JGZG2 by Texas Instruments is a 16-bit DSP with integrated cache, operating at max 13 MHz. Suitable for industrial applications, it features 163840 RAM words and 25-bit address bus width. With low power mode and boundary scan capability, it offers versatile digital signal processing solutions.

Median Price

$38.960

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 375 parts In-Stock

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-

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$38.960

1k+ parts

$34.860

10k+ parts

$32.810

375

-

$38.960

$34.860

$32.810

DigiKey

USA . 375 parts In-Stock

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-

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375

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Digiode

USA . 2,413 parts In-Stock

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$41.126

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2,413

$41.126

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Vyrian

USA . 149 parts In-Stock

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149

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Semi Source

USA . 118 parts In-Stock

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Prism Electronics

USA . 6 parts In-Stock

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Legend Electronics Inc.

USA . 5 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 405 parts In-Stock

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$18.800

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$18.800

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Parana Technologies

USA . 2,046 parts In-Stock

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$21.950

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$22.466

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$21.950

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Corohmni

South Africa . 3,107 parts In-Stock

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$23.021

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IDEA Electronic Components Group

UK . 2,258 parts In-Stock

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$24.663

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$23.430

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$22.197

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2,258

$24.663

$23.430

$22.197

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ChromeModa Solutions

Germany . 1,677 parts In-Stock

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$24.663

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$20.224

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$20.224

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Ampacity Inc.

Singapore . 216 parts In-Stock

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$36.800

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Corphita

USA . 1,205 parts In-Stock

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$38.961

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Continental Prestige Electronics

USA . 6,781 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,732 parts In-Stock

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Argo Parts USA

USA . 2,454 parts In-Stock

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DigiPath Technology Company

USA . 1,815 parts In-Stock

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$22.236

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Bastille Electronics

Australia . 450 parts In-Stock

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Microchip USA

USA . 362 parts In-Stock

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Kepictronics

USA . 150 parts In-Stock

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Overview

Elevate your digital signal processing capabilities with the OMAP5910JGZG2 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality products that are highly reliable and efficient. The OMAP5910JGZG2 is perfect for a wide range of applications in the DSP category, offering customers unparalleled value and benefits. With integrated cache, low power mode, and multiple DMA channels, this product provides exceptional performance and versatility. Upgrade your projects with the OMAP5910JGZG2 and experience superior results like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for portable devices.

Integrated Cache: YES

The integrated cache enhances processing speed and efficiency, making this DSP suitable for complex signal processing tasks.

Surface Mount: YES

The surface mount design allows for easy installation and space-saving on PCBs, perfect for compact electronic applications.

Maximum Supply Voltage: 1.675 V

The low maximum supply voltage ensures energy efficiency and helps in preventing overheating, increasing the product's reliability.

Address Bus Width: 25

The wide address bus width enables the DSP to access a large memory space quickly, improving overall performance and versatility.

Package Shape: SQUARE

The square package shape optimizes space utilization and facilitates easier placement on circuit boards, ideal for densely populated systems.

Bit Size: 16

The 16-bit architecture supports fast data processing and accuracy, making this DSP suitable for real-time signal processing applications.

Power Supplies (V): 1.6,1.8/2.75/3.3

The multiple power supply options offer flexibility in design and compatibility with various voltage requirements, ensuring versatility in different systems.

No. of Terminals: 289

The high number of terminals allows for numerous connectivity options and peripherals, making this DSP adaptable for a wide range of applications.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The advanced package style enhances thermal performance, reduces signal interference, and facilitates high-speed communication, making it a reliable choice for demanding applications.

Minimum Supply Voltage: 1.525 V

The low minimum supply voltage provides energy efficiency and extends battery life in portable devices, making this DSP a cost-effective solution.

Technical Specifications

Digital Signal Processors (DSPs) OMAP5910JGZG2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 2.75V OR 3.3V SUPPLY

Address Bus Width:

25

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

13 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e0

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

6

No. of Terminals:

289

No. of Timers:

8

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.6,1.8/2.75/3.3

Qualification:

Not Qualified

RAM Words:

163840

ROM Programmability:

MROM

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.675 V

Minimum Supply Voltage:

1.525 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

12 mm

Peripheral IC Type:

Trade Compliance

OMAP5910JGZG2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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