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ADSP-BF561SBBCZ-5A

Analog Devices

ADSP-BF561SBBCZ-5A by Analog Devices

ADSP-BF561SBBCZ-5A by Analog Devices is a 32-bit DSP with a max clock frequency of 500 MHz. It operates in industrial temperatures from -40 to 85°C and features low power mode for energy efficiency. Ideal for digital signal processing applications requiring high-speed performance in a compact package.

Median Price

$49.780

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Analog Devices Inc

USA . 420 parts In-Stock

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$58.520

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$43.803

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Verical

USA . 377 parts In-Stock

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$41.039

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Bristol Electronics

USA . 7 parts In-Stock

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$35.006

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Vyrian

USA . 8,730 parts In-Stock

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VNN

France . 2,435 parts In-Stock

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Digiode

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Chip Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Cogito LLC

Ukraine . 21 parts In-Stock

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Sea View Technologies

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ACDS - Activité Composants Distribution Service

France . 7 parts In-Stock

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Dan-Mar Components

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AZTECH Wire

Italy . 277 parts In-Stock

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$12.593

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Corohmni

South Africa . 362 parts In-Stock

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Semicontronic

India . 110 parts In-Stock

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$39.800

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$38.805

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$38.606

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Ampacity Inc.

Singapore . 39 parts In-Stock

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$40.060

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Vigor

Singapore . 364 parts In-Stock

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Parana Technologies

USA . 2,179 parts In-Stock

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$41.793

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IDEA Electronic Components Group

UK . 2,083 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,707 parts In-Stock

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DigiPath Technology Company

USA . 1,774 parts In-Stock

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Lixinc

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Argo Parts USA

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Microchip USA

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Continental Prestige Electronics

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RC Electronics

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Bastille Electronics

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Corphita

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Overview

Unlock the power of cutting-edge technology with the Analog Devices ADSP-BF561SBBCZ-5A Digital Signal Processor. Manufactured by industry leader Analog Devices, this innovative product is at the forefront of DSP technology, offering unparalleled performance and reliability. Ideal for a wide range of applications, from audio processing to industrial automation, this DSP delivers exceptional value and benefits to customers. Experience the advantages of high-speed data processing, low power consumption, and seamless integration, all in a compact and durable package. Elevate your projects with the ADSP-BF561SBBCZ-5A and revolutionize your digital signal processing capabilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides a good balance of durability and cost-effectiveness for the product.

Surface Mount: YES

Surface mount capability makes the product easy to integrate into various electronic designs.

Maximum Supply Voltage: 1.375 V

Allows for efficient power management within the specified voltage range.

Address Bus Width: 23

Enables the processor to efficiently handle memory addressing tasks in the system.

Package Shape: SQUARE

Square package shape allows for space-saving and efficient PCB design.

Bit Size: 32

A 32-bit architecture provides high processing power and efficiency for digital signal processing tasks.

Power Supplies (V): 1.2,2.5/3.3

Multiple power supply options allow for flexible integration into different power systems.

No. of Terminals: 256

A high number of terminals enable connectivity with various other components in the system.

Package Style (Meter): GRID ARRAY

Grid array package style offers robust mechanical strength and reliability for the product.

Minimum Supply Voltage: 0.8 V

The low minimum supply voltage enables efficient power usage and performance optimization.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in a wide range of temperature environments.

Terminal Finish: TIN SILVER COPPER

Quality terminal finish ensures good electrical conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy PCB assembly and integration.

Maximum Seated Height: 1.9 mm

Low maximum seated height allows for compact and slim product designs.

Width: 17 mm

The compact width dimension enables space-efficient PCB layout and system integration.

Boundary Scan: YES

Boundary scan capability enhances testing and debugging processes during product development and maintenance.

External Data Bus Width: 32

A 32-bit external data bus width enhances data transfer speed and efficiency for the processor.

Maximum Clock Frequency: 500 MHz

High maximum clock frequency enables fast data processing and signal handling capabilities.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure and reliable soldering of the component onto the PCB.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture improves data flow and processing efficiency within the processor.

Length: 17 mm

Compact length size allows for space-efficient PCB layout and system integration.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in demanding industrial environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Dedicated digital signal processor peripheral type ensures optimized signal processing and efficient system operation.

Technology: CMOS

CMOS technology offers low power consumption and high integration capabilities for the product.

Terminal Form: BALL

Ball terminal form provides secure and reliable electrical connections for the product.

Nominal Supply Voltage: 1.25 V

Stable nominal supply voltage ensures consistent and efficient power usage for the processor.

Terminal Pitch: 1 mm

Fine terminal pitch allows for high-density PCB designs and efficient signal routing.

Format: FIXED POINT

Fixed-point format improves computational accuracy and efficiency for digital signal processing tasks.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage procedures.

Speed: 500 rpm

High speed capability ensures fast data processing and signal handling for the processor.

Low Power Mode: YES

Low power mode option allows for energy-efficient operation and extended battery life in portable devices.

Barrel Shifter: YES

Barrel shifter feature enhances data manipulation and processing capabilities within the processor.

Technical Specifications

Digital Signal Processors (DSPs) ADSP-BF561SBBCZ-5A attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Analog Devices

Specs

Additional Features:

ALSO OPERATES AT 2.5 OR 3.3 V NOMINAL SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

500 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,25

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.9 mm

Speed:

500 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.375 V

Minimum Supply Voltage:

.8 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

17 mm

Peripheral IC Type:

Trade Compliance

ADSP-BF561SBBCZ-5A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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