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TMS320LF2406APZS

Texas Instruments

TMS320LF2406APZS by Texas Instruments

TMS320LF2406APZS by Texas Instruments is a 16-bit DSP with 3.3V supplies, 20MHz clock, and 544 RAM words. Ideal for automotive applications, it features FLASH ROM, PWM channels, and low power mode for efficient signal processing in compact designs.

Median Price

$26.930

Lifecycle Status

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9

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1k+

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DigiKey

USA . 317 parts In-Stock

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$26.930

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$19.042

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$17.911

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$26.930

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Mouser Electronics

USA . 133 parts In-Stock

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$26.930

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$19.040

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$17.910

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$26.930

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$17.910

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Nova Conductors

Japan . 600 parts In-Stock

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$16.749

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Digiode

USA . 2,759 parts In-Stock

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Vyrian

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Chip Stock

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TME

Poland . 905 parts In-Stock

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$21.812

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LWI Electronics Inc

India . 5 parts In-Stock

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Cyclops Electronics Ltd

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AZTECH Wire

Italy . 349 parts In-Stock

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$16.074

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Continental Prestige Electronics

USA . 5,449 parts In-Stock

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$16.749

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Netroflash

USA . 500 parts In-Stock

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$16.749

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$15.911

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$15.576

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$16.749

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$15.911

$15.576

Semicontronic

India . 253 parts In-Stock

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$18.110

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$17.657

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$17.567

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Ampacity Inc.

Singapore . 94 parts In-Stock

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$18.110

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Corphita

USA . 981 parts In-Stock

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Corohmni

South Africa . 376 parts In-Stock

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$52.888

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$48.128

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$43.368

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Parana Technologies

USA . 1,076 parts In-Stock

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$62.280

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DigiPath Technology Company

USA . 307 parts In-Stock

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$68.578

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$63.092

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ChromeModa Solutions

Germany . 5,220 parts In-Stock

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$69.978

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IDEA Electronic Components Group

UK . 988 parts In-Stock

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$66.479

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iodParts Technologies Inc.

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Lixinc

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Perfect Parts

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Futuretech Components

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Argo Parts USA

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Kepictronics

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Robosynatics

Brazil . 250 parts In-Stock

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Lucentia Tech

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Overview

Unlock the power of cutting-edge technology with the TMS320LF2406APZS by Texas Instruments. Designed for optimal performance in digital signal processing applications, this DSP offers unmatched quality and reliability. With Texas Instruments' reputation for excellence, you can trust that this product will exceed your expectations. Whether you're working on automotive systems, industrial control, or audio processing, this DSP provides value, efficiency, and flexibility like no other. Elevate your projects to new heights with the TMS320LF2406APZS and experience the advantage of top-tier technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides good thermal insulation and protection for the DSP, making it durable and reliable for long-term use.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for more flexibility and compatibility with different power sources.

RAM Words: 544

Large RAM capacity allows for efficient processing and storage of data, enabling complex signal processing tasks.

Maximum Clock Frequency: 20 MHz

High clock frequency enables fast and efficient signal processing, making the DSP suitable for real-time applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable in various environments.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LF2406APZS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

16

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

0

No. of External Interrupts:

5

No. of Terminals:

100

No. of Timers:

5

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

544

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

70 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

TMS320LF2406APZS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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