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OMAP5910JGDY1

Texas Instruments

OMAP5910JGDY1 by Texas Instruments

OMAP5910JGDY1 by Texas Instruments is a 16-bit DSP with 24-bit address bus width, operating at max 13 MHz clock frequency. Ideal for industrial applications, it features low power mode and CMOS technology. With 163840 RAM words and boundary scan capability, it offers versatile digital signal processing solutions.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 6,554 parts In-Stock

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Digiode

USA . 638 parts In-Stock

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Nova Conductors

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AZTECH Wire

Italy . 736 parts In-Stock

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$12.156

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One Stop Electronics

USA . 166 parts In-Stock

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$15.000

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Ampacity Inc.

Singapore . 1,494 parts In-Stock

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Parana Technologies

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ChromeModa Solutions

Germany . 6,123 parts In-Stock

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$49.108

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IDEA Electronic Components Group

UK . 2,102 parts In-Stock

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Corohmni

South Africa . 10 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,131 parts In-Stock

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DigiPath Technology Company

USA . 1,401 parts In-Stock

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Argo Parts USA

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Corphita

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Kepictronics

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Aranea Global

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Continental Prestige Electronics

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Overview

Looking for a reliable digital signal processor (DSP) that delivers top-notch performance? Look no further than the OMAP5910JGDY1 by Texas Instruments! With its high-quality construction and cutting-edge technology, this DSP is perfect for a wide range of applications. Whether you need it for industrial automation, telecommunications, or consumer electronics, this product offers unmatched value and benefits. Trust Texas Instruments to provide you with the best in DSP technology, and experience the advantages that the OMAP5910JGDY1 can bring to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the digital signal processor, ensuring a longer lifespan.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation onto circuit boards, saving time and effort in manufacturing processes.

Maximum Supply Voltage: 1.675 V

Operating at a maximum supply voltage of 1.675 V ensures energy efficiency and helps prevent overheating or damage to the digital signal processor.

Address Bus Width: 24

A wide address bus width of 24 allows for efficient data processing and handling of large amounts of information at once.

Package Shape: SQUARE

The square package shape makes it easy to integrate the digital signal processor into various electronic devices and systems.

Bit Size: 16

With a bit size of 16, this digital signal processor is capable of handling complex operations and calculations efficiently.

Power Supplies (V): 1.6,1.8/2.75/3.3

Having multiple power supply options allows for flexibility in voltage input, making it compatible with a variety of systems and applications.

No. of Terminals: 289

The high number of terminals provides ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): GRID ARRAY

The grid array package style offers a compact and efficient design, optimizing space utilization on circuit boards.

Minimum Supply Voltage: 1.525 V

Operating at a minimum supply voltage of 1.525 V ensures reliable performance even under low power conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this digital signal processor is suitable for industrial applications with demanding environmental conditions.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C ensures that the digital signal processor can function in extreme cold environments without performance issues.

Terminal Position: BOTTOM

Bottom terminal position allows for secure and stable mounting onto circuit boards, preventing disconnection or damage during operation.

Maximum Seated Height: 2.32 mm

The low maximum seated height of 2.32 mm minimizes the overall profile of the digital signal processor, making it suitable for compact electronic devices.

RAM Words: 163840

With a large RAM capacity of 163840 words, this digital signal processor can efficiently store and retrieve data during processing tasks.

Width: 19 mm

The 19 mm width provides a balance between compact size and functionality, making it versatile for different applications.

Boundary Scan: YES

Boundary scan capability allows for efficient testing and debugging of the digital signal processor during manufacturing and maintenance processes.

External Data Bus Width: 16

The 16-bit external data bus width enables fast data transfer and communication between the digital signal processor and external devices or peripherals.

Maximum Clock Frequency: 13 MHz

Operating at a maximum clock frequency of 13 MHz ensures fast and efficient processing of data and instructions.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and communication within the digital signal processor, optimizing performance and efficiency.

Length: 19 mm

The 19 mm length provides a compact form factor, making it easy to integrate the digital signal processor into electronic devices with limited space.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade temperature conditions, this digital signal processor is robust and reliable for use in harsh environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

The mixed peripheral IC type offers versatile functionality and compatibility with various digital signal processing tasks and applications.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed performance, making it energy efficient and reliable for extended operation.

Terminal Form: BALL

Ball terminal form provides secure connections and easy soldering onto circuit boards, ensuring stable and reliable operation.

Nominal Supply Voltage: 1.6 V

Operating at a nominal supply voltage of 1.6 V ensures consistent and stable performance, enhancing reliability in various operating conditions.

Terminal Pitch: 1 mm

With a terminal pitch of 1 mm, this digital signal processor offers precise and reliable connectivity options for seamless integration into electronic systems.

Format: FIXED POINT

Fixed-point formatting allows for efficient and accurate calculations, making this digital signal processor suitable for a wide range of digital signal processing tasks.

Low Power Mode: YES

Low power mode capability enables energy-saving operation and extended battery life, making this digital signal processor ideal for portable and battery-powered devices.

Technical Specifications

Digital Signal Processors (DSPs) OMAP5910JGDY1 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

13 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B289

Length:

19 mm

Low Power Mode:

YES

No. of Terminals:

289

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA289,17X17,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.6,1.8/2.75/3.3

Qualification:

Not Qualified

RAM Words:

163840

Maximum Seated Height:

2.32 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.675 V

Minimum Supply Voltage:

1.525 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

19 mm

Peripheral IC Type:

Trade Compliance

OMAP5910JGDY1 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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