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OMAP5910JZVL2

Texas Instruments

OMAP5910JZVL2 by Texas Instruments

OMAP5910JZVL2 by Texas Instruments is a 16-bit DSP with integrated cache and 16-bit external data bus width. It operates at a max clock frequency of 13 MHz, suitable for industrial applications requiring low power consumption and fixed-point format processing. The package style is grid array with thin profile, making it ideal for compact designs in digital signal processing systems.

Median Price

$55.330

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 10 parts In-Stock

1+ parts

$55.330

100+ parts

$39.090

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-

10k+ parts

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10

$55.330

$39.090

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Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$42.440

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500

$42.440

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Vyrian

USA . 2,878 parts In-Stock

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2,878

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Digiode

USA . 226 parts In-Stock

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226

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Distributors (Availability)

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AZTECH Wire

Italy . 685 parts In-Stock

1+ parts

$8.445

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685

$8.445

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One Stop Electronics

USA . 1,155 parts In-Stock

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$22.000

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$22.000

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Semicontronic

India . 665 parts In-Stock

1+ parts

$25.000

100+ parts

$24.375

1k+ parts

$24.250

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665

$25.000

$24.375

$24.250

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Ampacity Inc.

Singapore . 892 parts In-Stock

1+ parts

$34.000

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$34.000

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Parana Technologies

USA . 994 parts In-Stock

1+ parts

$39.409

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994

$39.409

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Continental Prestige Electronics

USA . 888 parts In-Stock

1+ parts

$42.440

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$41.591

888

$42.440

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$41.591

Netroflash

USA . 50 parts In-Stock

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$42.440

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$42.440

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Corohmni

South Africa . 156 parts In-Stock

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$42.873

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156

$42.873

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DigiPath Technology Company

USA . 468 parts In-Stock

1+ parts

$43.394

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468

$43.394

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ChromeModa Solutions

Germany . 6,608 parts In-Stock

1+ parts

$44.280

100+ parts

$36.310

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6,608

$44.280

$36.310

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IDEA Electronic Components Group

UK . 1,031 parts In-Stock

1+ parts

$44.280

100+ parts

$42.066

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$39.852

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1,031

$44.280

$42.066

$39.852

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QUARKTWIN TECHNOLOGY LTD

USA . 26,040 parts In-Stock

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Argo Parts USA

USA . 2,504 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Corphita

USA . 566 parts In-Stock

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566

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Overview

Unlock the potential of cutting-edge technology with the Texas Instruments OMAP5910JZVL2 Digital Signal Processor. Designed with precision and reliability in mind, this DSP offers unparalleled performance for a wide range of applications. From industrial automation to consumer electronics, the OMAP5910JZVL2 delivers high-speed processing and low power consumption, ensuring optimal efficiency and functionality. Trust in Texas Instruments' reputation for quality and innovation, and elevate your products to new heights with the OMAP5910JZVL2 at the core.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable applications.

Integrated Cache: YES

The integrated cache improves the processing speed and efficiency of the DSP, making it suitable for high-performance tasks.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on electronic circuit boards.

Maximum Supply Voltage: 1.675 V

The high maximum supply voltage ensures stable and reliable performance under various operating conditions.

On Chip Data RAM Width: 16

The wide on-chip data RAM width provides ample storage for data processing, enabling complex algorithms to be executed efficiently.

Address Bus Width: 25

The large address bus width allows for a more extensive memory range, making the DSP suitable for applications requiring vast data storage.

Package Shape: SQUARE

The square package shape facilitates easy placement and soldering on a circuit board, optimizing space utilization.

Bit Size: 16

The 16-bit size of the DSP enhances processing speed and precision, making it suitable for real-time signal processing applications.

No. of Terminals: 289

With a high number of terminals, the DSP offers greater connectivity options, enabling integration with various external devices.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The grid array, thin profile, and fine pitch package style provides a compact form factor, ideal for compact electronic designs.

Technical Specifications

Digital Signal Processors (DSPs) OMAP5910JZVL2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

25

Barrel Shifter:

NO

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

13 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B289

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

15

No. of Terminals:

289

No. of Timers:

7

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA289,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

81920

ROM Programmability:

MROM

Maximum Seated Height:

1.2 mm

Speed:

192 rpm

Maximum Supply Voltage:

1.675 V

Minimum Supply Voltage:

1.525 V

Nominal Supply Voltage:

1.6 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

OMAP5910JZVL2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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