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DSPIC33EV256GM102-I/SO

Microchip Technology

DSPIC33EV256GM102-I/SO by Microchip Technology

DSPIC33EV256GM102-I/SO by Microchip Technology is a 16-bit DSP with 262144 ROM words and 16384 RAM words. It features 11-Ch 12-Bit ADC channels, 4 DMA channels, and PWM capabilities. Ideal for industrial applications requiring high-speed processing, low power mode, and multiple connectivity options like CAN, I2C, SPI(2), and UART(2).

Median Price

$4.810

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip Technology

USA . 540 parts In-Stock

1+ parts

$4.810

100+ parts

$4.000

1k+ parts

$3.700

10k+ parts

$3.500

540

$4.810

$4.000

$3.700

$3.500

DigiKey

USA . 421 parts In-Stock

1+ parts

$4.810

100+ parts

$4.000

1k+ parts

-

10k+ parts

-

421

$4.810

$4.000

-

-

Mouser Electronics

USA . 390 parts In-Stock

1+ parts

$4.810

100+ parts

$4.420

1k+ parts

$4.000

10k+ parts

-

390

$4.810

$4.420

$4.000

-

Master Electronics

USA . 1,053 parts In-Stock

1+ parts

-

100+ parts

$3.520

1k+ parts

$3.350

10k+ parts

$3.300

1,053

-

$3.520

$3.350

$3.300

Verical

USA . 1,053 parts In-Stock

1+ parts

-

100+ parts

$4.417

1k+ parts

$3.993

10k+ parts

-

1,053

-

$4.417

$3.993

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$4.472

100+ parts

-

1k+ parts

-

10k+ parts

-

50

$4.472

-

-

-

NAC Semi

USA . 459 parts In-Stock

1+ parts

$5.030

100+ parts

$4.560

1k+ parts

$4.170

10k+ parts

-

459

$5.030

$4.560

$4.170

-

TME

Poland . 4 parts In-Stock

1+ parts

$7.130

100+ parts

-

1k+ parts

-

10k+ parts

-

4

$7.130

-

-

-

IBS Electronics

USA . 1,053 parts In-Stock

1+ parts

-

100+ parts

$4.937

1k+ parts

$4.698

10k+ parts

$4.628

1,053

-

$4.937

$4.698

$4.628

Vyrian

USA . 819 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

819

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 538 parts In-Stock

1+ parts

$3.580

100+ parts

-

1k+ parts

-

10k+ parts

-

538

$3.580

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$4.382

100+ parts

-

1k+ parts

$4.207

10k+ parts

-

2,000

$4.382

-

$4.207

-

Continental Prestige Electronics

USA . 6,651 parts In-Stock

1+ parts

$4.472

100+ parts

-

1k+ parts

-

10k+ parts

$4.382

6,651

$4.472

-

-

$4.382

Argo Parts USA

USA . 3,358 parts In-Stock

1+ parts

$4.472

100+ parts

-

1k+ parts

-

10k+ parts

-

3,358

$4.472

-

-

-

Semicontronic

India . 842 parts In-Stock

1+ parts

$7.790

100+ parts

$7.595

1k+ parts

$7.556

10k+ parts

-

842

$7.790

$7.595

$7.556

-

Corohmni

South Africa . 4,867 parts In-Stock

1+ parts

$31.307

100+ parts

-

1k+ parts

-

10k+ parts

-

4,867

$31.307

-

-

-

Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$32.490

100+ parts

$30.866

1k+ parts

$30.866

10k+ parts

-

2,000

$32.490

$30.866

$30.866

-

Aztec Data Supply Inc.

USA . 842 parts In-Stock

1+ parts

$58.600

100+ parts

-

1k+ parts

-

10k+ parts

-

842

$58.600

-

-

-

Lixinc

USA . 18,954 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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18,954

-

-

-

-

Marpe Global Electronics

Taiwan . 968 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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968

-

-

-

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QualityLine Systems

Poland . 968 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

968

-

-

-

-

XL Components Corporation

Australia . 968 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

968

-

-

-

-

Overview

Experience the next level of performance with the DSPIC33EV256GM102-I/SO by Microchip Technology. As a leader in digital signal processors, Microchip Technology brings you a product that offers unmatched quality and reliability. Ideal for a wide range of applications, this product delivers exceptional value with its advanced features and capabilities. From its low power mode to its numerous connectivity options, the DSPIC33EV256GM102-I/SO is designed to meet your needs and exceed your expectations. Upgrade your projects today with this high-performance digital signal processor!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the DSP, making it a reliable choice for long-term use.

Maximum Supply Voltage: 5.5 V

Allows for a wide range of voltage input, providing flexibility in power supply options.

Bit Size: 16

With a 16-bit size, this DSP can handle and process data efficiently and accurately.

Maximum Clock Frequency: 40 MHz

The high clock frequency enables fast processing speed, making it suitable for demanding applications.

Connectivity: CAN, I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

Offers a wide range of connectivity options, allowing for seamless integration with various devices and systems.

Analog To Digital Convertors: 11-Ch 12-Bit

The multiple ADC channels with high resolution support enable accurate conversion of analog signals to digital data.

Internal Bus Architecture: MULTIPLE

The multiple bus architecture enhances data transfer efficiency within the DSP, improving overall performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combines DSP and controller functionalities in one package, offering versatility and flexibility in application usage.

Speed: 40 rpm

The high processing speed of 40 rpm ensures quick response times and efficient operation in real-time applications.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EV256GM102-I/SO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of I/O Lines:

21

No. of Terminals:

28

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Speed:

40 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Data EEPROM Size:

0

Connectivity:

CAN, I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(4), DMA(4), POR, PWM(6), TIMER(7), WDT

Analog To Digital Convertors:

11-Ch 12-Bit

Trade Compliance

DSPIC33EV256GM102-I/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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