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DSPIC30F2010-20I/SO

Microchip Technology

DSPIC30F2010-20I/SO by Microchip Technology

DSPIC30F2010-20I/SO by Microchip Technology is a 16-bit digital signal processor with 5.5V max supply voltage, 40MHz clock frequency, and 512 RAM words. Ideal for industrial applications requiring high-speed processing, it features 6-Ch 10-Bit ADC channels, I2C/SPI/UART connectivity, and low power mode for efficient operation.

Median Price

$4.850

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 253 parts In-Stock

1+ parts

$4.850

100+ parts

$4.250

1k+ parts

-

10k+ parts

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253

$4.850

$4.250

-

-

Microchip Technology

USA . 27 parts In-Stock

1+ parts

$4.850

100+ parts

$4.000

1k+ parts

$3.670

10k+ parts

$3.500

27

$4.850

$4.000

$3.670

$3.500

Future Electronics

Canada . 2,403 parts In-Stock

1+ parts

-

100+ parts

$4.340

1k+ parts

$4.250

10k+ parts

-

2,403

-

$4.340

$4.250

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Arrow

USA . 135 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$4.018

10k+ parts

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135

-

-

$4.018

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EBV Elektronik

Germany . 81 parts In-Stock

1+ parts

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81

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Verical

USA . 24 parts In-Stock

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-

100+ parts

$9.714

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-

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24

-

$9.714

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 81 parts In-Stock

1+ parts

$5.100

100+ parts

-

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81

$5.100

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Vyrian

USA . 6,255 parts In-Stock

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-

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6,255

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Chip Stock

USA . 4,192 parts In-Stock

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4,192

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IBS Electronics

USA . 2,403 parts In-Stock

1+ parts

-

100+ parts

$5.834

1k+ parts

$5.792

10k+ parts

-

2,403

-

$5.834

$5.792

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Cyclops Electronics Ltd

UK . 2,000 parts In-Stock

1+ parts

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2,000

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NAC Semi

USA . 54 parts In-Stock

1+ parts

-

100+ parts

$22.580

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54

-

$22.580

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LIBRA Elektronik GmbH

Germany . 27 parts In-Stock

1+ parts

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27

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Ashlea Components Ltd

UK . 17 parts In-Stock

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17

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 366 parts In-Stock

1+ parts

$3.420

100+ parts

$3.334

1k+ parts

$3.317

10k+ parts

-

366

$3.420

$3.334

$3.317

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Corohmni

South Africa . 5,152 parts In-Stock

1+ parts

$4.381

100+ parts

-

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5,152

$4.381

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$4.512

100+ parts

$4.287

1k+ parts

$4.287

10k+ parts

-

2,500

$4.512

$4.287

$4.287

-

Continental Prestige Electronics

USA . 5,969 parts In-Stock

1+ parts

$4.780

100+ parts

-

1k+ parts

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10k+ parts

$4.684

5,969

$4.780

-

-

$4.684

Netroflash

USA . 50 parts In-Stock

1+ parts

$5.100

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-

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50

$5.100

-

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Ampacity Inc.

Singapore . 123 parts In-Stock

1+ parts

$7.430

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123

$7.430

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Aztec Data Supply Inc.

USA . 4,441 parts In-Stock

1+ parts

$25.270

100+ parts

-

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4,441

$25.270

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Lixinc

USA . 17,633 parts In-Stock

1+ parts

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17,633

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QUARKTWIN TECHNOLOGY LTD

USA . 14,017 parts In-Stock

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14,017

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Fulton Briggs Corp.

USA . 8,214 parts In-Stock

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8,214

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Eastek

USA . 7,668 parts In-Stock

1+ parts

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100+ parts

$6.830

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7,668

-

$6.830

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A-Z Elektronik GmbH

Germany . 6,971 parts In-Stock

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6,971

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Alle Elektronik GmbH

Germany . 4,647 parts In-Stock

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4,647

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Perfect Parts

USA . 1,724 parts In-Stock

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1,724

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Argo Parts USA

USA . 624 parts In-Stock

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624

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GreenTree Electronics

Israel . 27 parts In-Stock

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27

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Overview

Unlock the power of digital signal processing with the DSPIC30F2010-20I/SO from Microchip Technology. Designed for industrial applications, this high-quality DSP offers exceptional performance and reliability. With features like multiple timers, PWM channels, and connectivity options like I2C and SPI, this versatile device is perfect for a wide range of projects. Experience the seamless operation and efficiency that this DSP provides, making it a valuable tool for any engineer or developer looking to take their designs to the next level. Elevate your projects with the DSPIC30F2010-20I/SO today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and offers good protection for the components inside, making it a practical choice.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and effort during production.

Maximum Supply Voltage: 5.5 V

Provides flexibility in power input options, accommodating a wide range of applications.

On Chip Data RAM Width: 8

Allows for efficient data processing and storage, enhancing the performance of the DSP.

Screening Level: TS 16949

Indicates that the product meets high-quality standards, ensuring reliability and durability.

Package Shape: RECTANGULAR

Offers versatility in PCB layout and design, making it easier to integrate into various systems.

Bit Size: 16

Provides the necessary processing power for handling complex algorithms and calculations.

Power Supplies (V): 3/5

Offers multiple power supply options, allowing for compatibility with different systems and environments.

No. of Terminals: 28

Provides sufficient connectivity options for interfacing with other components and peripherals.

Package Style (Meter): SMALL OUTLINE

Compact and space-saving design, ideal for applications where size is a constraint.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F2010-20I/SO attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e3

Length:

17.9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of External Interrupts:

3

No. of I/O Lines:

20

No. of Serial I/Os:

2

No. of Terminals:

28

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Power Supplies (V):

3/5

Qualification:

Not Qualified

RAM Bytes:

512

RAM Words:

512

ROM Words:

4096

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

2.65 mm

Speed:

20 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Peripheral IC Type:

Data EEPROM Size:

1K

Connectivity:

I2C, SPI, UART

Peripherals:

BOD, POR, PWM(8), QEI, TIMER(3), WDT

Analog To Digital Convertors:

6-Ch 10-Bit

Trade Compliance

DSPIC30F2010-20I/SO Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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