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TMS320F2809NMFS

Texas Instruments

TMS320F2809NMFS by Texas Instruments

TMS320F2809NMFS by Texas Instruments is a 32-bit DSP with 100 terminals, operating at up to 100 MHz. Ideal for automotive applications, it features low power mode, flash ROM programmability, and 13 timers for efficient digital signal processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,413 parts In-Stock

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5,413

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Digiode

USA . 2,858 parts In-Stock

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2,858

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Nova Conductors

Japan . 52 parts In-Stock

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52

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Distributors (Availability)

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One Stop Electronics

USA . 520 parts In-Stock

1+ parts

$11.000

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520

$11.000

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AZTECH Wire

Italy . 318 parts In-Stock

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$18.742

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318

$18.742

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Ampacity Inc.

Singapore . 956 parts In-Stock

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$19.000

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956

$19.000

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Parana Technologies

USA . 2,251 parts In-Stock

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$19.940

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$1,851.773

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$17.946

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2,251

$19.940

$1,851.773

$17.946

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Semicontronic

India . 884 parts In-Stock

1+ parts

$21.000

100+ parts

$20.475

1k+ parts

$20.370

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884

$21.000

$20.475

$20.370

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DigiPath Technology Company

USA . 1,834 parts In-Stock

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$21.957

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$20.200

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1,834

$21.957

$20.200

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ChromeModa Solutions

Germany . 6,359 parts In-Stock

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$22.405

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$18.372

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6,359

$22.405

$18.372

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IDEA Electronic Components Group

UK . 670 parts In-Stock

1+ parts

$22.405

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$21.285

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$20.164

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670

$22.405

$21.285

$20.164

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Corohmni

South Africa . 2,368 parts In-Stock

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$43.282

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2,368

$43.282

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Robosynatics

Brazil . 950 parts In-Stock

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Lucentia Tech

USA . 950 parts In-Stock

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Corphita

USA . 784 parts In-Stock

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784

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Bastille Electronics

Australia . 450 parts In-Stock

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Argo Parts USA

USA . 213 parts In-Stock

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Continental Prestige Electronics

USA . 86 parts In-Stock

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Overview

Unleash the power of innovation with the TMS320F2809NMFS by Texas Instruments, a cutting-edge Digital Signal Processor designed to take your projects to new heights. With Texas Instruments' reputation for excellence in manufacturing, this DSP offers unparalleled performance and reliability. Ideal for a wide range of applications, this product delivers exceptional value, benefits, and advantages to customers looking to stay ahead of the curve. Upgrade your designs today and experience the difference with the TMS320F2809NMFS.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material for long-lasting performance.

Surface Mount: YES

Easy installation and space-saving design.

Maximum Supply Voltage: 1.89 V

Efficient power usage for reduced energy consumption.

On Chip Data RAM Width: 16

Fast data processing for quick response times.

Package Shape: SQUARE

Compact design for versatile placement options.

Bit Size: 32

High processing capability for complex tasks.

No. of Terminals: 100

Versatile connectivity options for various applications.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

Advanced packaging for enhanced performance.

Minimum Supply Voltage: 1.71 V

Reliable power supply for uninterrupted operation.

Maximum Operating Temperature: 125 °C

Withstands high temperatures for durability.

No. of External Interrupts: 3

Improved efficiency with external event handling.

Minimum Operating Temperature: -40 °C

Operates in extreme cold environments.

Terminal Finish: TIN SILVER COPPER

Reliable terminal finish for secure connections.

Terminal Position: BOTTOM

Easy access for quick installations.

Maximum Seated Height: 1.4 mm

Low profile design for compact spaces.

RAM Words: 18432

Large memory capacity for extensive data storage.

Width: 10 mm

Compact size for easy integration into various systems.

Boundary Scan: YES

Enhanced testing capabilities for increased reliability.

Maximum Clock Frequency: 100 MHz

High-speed processing for efficiency.

Maximum Time At Peak Reflow Temperature: 30s

Ensures proper reflow process for reliability.

Peak Reflow Temperature: 260C

Handles high temperatures for robust performance.

Internal Bus Architecture: MULTIPLE

Efficient data transfer within the processor.

Length: 10 mm

Compact dimensions for space-constrained applications.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for reliability.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile IC for various signal processing needs.

No. of Timers: 13

Multiple timer options for precise timing functions.

Technology: CMOS

Reliable technology for efficient performance.

Terminal Form: BALL

Secure terminal form for stable connections.

Maximum Supply Current: 230 mA

Low power consumption for energy efficiency.

Nominal Supply Voltage: 1.8 V

Stable voltage supply for consistent operation.

ROM Programmability: FLASH

Programmable ROM for flexibility in data storage.

Terminal Pitch: 0.8 mm

Fine pitch for precise terminal placement.

Format: FIXED POINT

Fixed point format for accurate data processing.

Moisture Sensitivity Level (MSL): 3

Handles moisture exposure for reliable operation.

Low Power Mode: YES

Energy-saving mode for efficient power usage.

On Chip Program ROM Width: 16

Wide program ROM for versatile programming options.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2809NMFS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

0

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B100

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

100

No. of Timers:

13

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA100,10X10,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

18432

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

TMS320F2809NMFS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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