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TMS320C6678ACYP25

Texas Instruments

TMS320C6678ACYP25 by Texas Instruments

TMS320C6678ACYP25 by Texas Instruments is a 32-bit DSP with integrated cache, operating at 312.5 MHz. With 841 terminals and 80 DMA channels, it's ideal for digital signal processing applications requiring high-speed data processing and low power consumption. The package style is grid array with fine pitch, suitable for compact designs in various electronic systems.

Median Price

$383.774

Lifecycle Status

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8

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Texas Instruments

USA . 533 parts In-Stock

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DigiKey

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Digiode

USA . 1,833 parts In-Stock

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Nova Conductors

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Vyrian

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Bristol Electronics

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AZTECH Wire

Italy . 409 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

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$83.022

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$76.380

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ChromeModa Solutions

Germany . 5,277 parts In-Stock

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IDEA Electronic Components Group

UK . 940 parts In-Stock

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Semicontronic

India . 284 parts In-Stock

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Ampacity Inc.

Singapore . 183 parts In-Stock

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Corphita

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Continental Prestige Electronics

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Corohmni

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iBuyXS LLC

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Advanced Electronics

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Lixinc

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iodParts Technologies Inc.

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Overview

Experience unparalleled performance and efficiency with the TMS320C6678ACYP25 by Texas Instruments, a leading manufacturer in digital signal processors. This cutting-edge DSP offers seamless integration, high-speed processing, and versatile applications in various industries. Unlock the full potential of your projects with its integrated cache, advanced technology, and low power mode, providing you with a competitive edge in today's fast-paced market. Invest in quality, reliability, and innovation with Texas Instruments - elevate your solutions with the TMS320C6678ACYP25.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable devices.

Integrated Cache: YES

Having an integrated cache helps in improving performance by providing faster access to frequently used data.

Maximum Supply Voltage: 1.05 V

Operating at a low maximum supply voltage helps in reducing power consumption and heat generation.

Address Bus Width: 24

A wider address bus allows for larger memory addressing capabilities, enabling processing of more complex algorithms.

Bit Size: 32

A 32-bit architecture allows for higher precision and performance in processing digital signals.

Power Supplies (V): 1,1.5,1.8

Support for multiple power supply voltages offers flexibility in designing systems with varying power requirements.

No. of Terminals: 841

Having a high number of terminals allows for increased connectivity and functionality in the device.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a specialized digital signal processor ensures optimized performance for signal processing tasks.

Maximum Clock Frequency: 312.5 MHz

A high maximum clock frequency enables fast data processing and execution of instructions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and scalability for efficient circuit design.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6678ACYP25 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

312.5 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B841

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

80

No. of Terminals:

841

No. of Timers:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6678ACYP25 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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