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DSPIC30F6014AT-20E/PT

Microchip Technology

DSPIC30F6014AT-20E/PT by Microchip Technology

DSPIC30F6014AT-20E/PT by Microchip Technology is a 16-bit digital signal processor (DSP) with a max clock frequency of 40 MHz. It is commonly used in automotive applications due to its temperature grade and flash ROM programmability.

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Lifecycle Status

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3

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1k+

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Vyrian

USA . 3,959 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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Prism Electronics

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AZTECH Wire

Italy . 742 parts In-Stock

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$7.154

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Ampacity Inc.

Singapore . 1,587 parts In-Stock

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$19.000

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Semicontronic

India . 241 parts In-Stock

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$29.000

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$28.275

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$28.130

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$28.130

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$65.049

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$61.796

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$61.796

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Aztec Data Supply Inc.

USA . 100 parts In-Stock

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$67.930

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Corohmni

South Africa . 323 parts In-Stock

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Continental Prestige Electronics

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RGB Technical Solutions

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Argo Parts USA

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Microchip USA

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Overview

Discover the power of the DSPIC30F6014AT-20E/PT by Microchip Technology. As a leading manufacturer in digital signal processors, Microchip Technology has created a product that delivers exceptional quality and performance. Designed for a wide range of applications, this product offers customers value, benefits, and advantages like no other. With its advanced technology and innovative features, the DSPIC30F6014AT-20E/PT is a game-changer in the industry. Experience seamless operation, reliable functionality, and unparalleled efficiency. Embrace the future with Microchip Technology and unlock the potential of the DSPIC30F6014AT-20E/PT today.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the DSP, making it a reliable choice for various applications.

Surface Mount:

YES - The surface mount feature offers easy and convenient installation, enhancing the efficiency of the DSP's integration into electronic devices.

Maximum Supply Voltage:

5.5 V - With a high maximum supply voltage, this DSP can handle demanding tasks and power requirements, providing reliable performance in complex signal processing applications.

Package Shape:

SQUARE - The square-shaped package allows for efficient use of space, making it suitable for compact devices where size is a concern.

Bit Size:

16 - The 16-bit architecture enables precise and accurate signal processing, ensuring high-quality output and improved performance.

Power Supplies (V):

3/5 - With compatibility for both 3V and 5V power supplies, this DSP offers flexibility in various electronic systems, accommodating different power requirements.

No. of Terminals:

80 - The ample number of terminals allows for versatile connectivity options, facilitating seamless integration with other components and peripheral devices.

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH - The combination of a flatpack, thin profile, and fine pitch design enables a compact form factor, making this DSP suitable for space-constrained applications.

Minimum Supply Voltage:

4.5 V - The low minimum supply voltage ensures efficient power consumption and compatibility with low-power devices or battery-operated systems.

Maximum Operating Temperature:

125 °C - The high maximum operating temperature capability makes this DSP suitable for demanding environments where temperature fluctuations or high heat levels are present.

Minimum Operating Temperature:

40 °C - The DSP's capability to operate in extremely low temperatures enables its use in various climates and environments, ensuring reliability and performance in harsh conditions.

Terminal Finish:

MATTE TIN - The matte tin finish provides excellent solderability and corrosion resistance, enhancing the longevity and reliability of the DSP.

Terminal Position:

QUAD - The quad terminal position offers secure electrical connections and stability, ensuring stable signal processing under various conditions.

Maximum Seated Height:

1.2 mm - With a low seated height, this DSP can be integrated into thin and compact devices, maintaining overall design aesthetics.

Width:

12 mm - The 12mm width allows for easy integration and compatibility with standard electronic layouts, simplifying design and manufacturing processes.

Maximum Clock Frequency:

40 MHz - The high clock frequency provides fast and efficient signal processing capabilities, reducing latency and enhancing real-time applications' performance.

Maximum Time At Peak Reflow Temperature (s):

40 - The ability to withstand peak reflow temperatures for up to 40 seconds ensures robust solder joint reliability during production or rework processes.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature tolerance enables compatibility with lead-free soldering processes, ensuring compliance with modern environmental regulations.

Length:

12 mm - The 12mm length offers compactness and compatibility with various electronic form factors, making it suitable for space-constrained designs.

Temperature Grade:

AUTOMOTIVE - Designed and rated for automotive applications, this DSP meets the stringent requirements for temperature, reliability, and performance in the automotive industry.

Peripheral IC Type:

DIGITAL SIGNAL PROCESSOR, CONTROLLER - This DSP not only processes digital signals but also incorporates controller functionality, providing a comprehensive solution for signal processing tasks.

Technology:

CMOS - The CMOS technology employed in this DSP offers low power consumption, reduced noise, and improved reliability, making it an efficient and reliable choice for a variety of applications.

Terminal Form:

GULL WING - The gull-wing terminal form provides easy and reliable soldering, ensuring secure connections and stable signal transmission.

Maximum Supply Current:

180 mA - With a high maximum supply current, this DSP can effectively handle power-hungry operations, making it suitable for applications with demanding processing requirements.

Nominal Supply Voltage:

5 V - The nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate into various electronic systems.

ROM Programmability:

FLASH - The flash ROM programmability offers flexibility in firmware updates and customizability for specific application requirements, ensuring adaptability and longevity.

Terminal Pitch:

0.5 mm - The small terminal pitch of 0.5mm allows for high-density circuit board designs, enabling compact and space-efficient electronic systems.

Format:

FIXED POINT - The fixed-point format ensures precise calculations and efficient use of resources, optimizing the DSP's performance in numerical processing tasks.

Moisture Sensitivity Level (MSL):

3 - The MSL 3 rating indicates that this DSP has a moderate moisture sensitivity, making it suitable for environments with controlled humidity levels.

On Chip Program ROM Width:

24 - With a wide on-chip program ROM width of 24 bits, this DSP can accommodate a large amount of program code, enabling complex signal processing algorithms and tasks.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F6014AT-20E/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY AT 15 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

80

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

180 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

12 mm

Trade Compliance

DSPIC30F6014AT-20E/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

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Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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