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DSPIC30F6013A-20E/PF

Microchip Technology

DSPIC30F6013A-20E/PF by Microchip Technology

DSPIC30F6013A-20E/PF by Microchip is a 16-bit DSP with max clock freq of 40MHz, operating temp range -40 to 125°C. Ideal for automotive applications, it features flash ROM programmability, operates at supply voltages of 4.5-5.5V, and has a package style of flatpack thin profile.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,634 parts In-Stock

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8,634

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Nova Conductors

Japan . 63 parts In-Stock

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63

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Distributors (Availability)

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Semicontronic

India . 688 parts In-Stock

1+ parts

$9.000

100+ parts

$8.775

1k+ parts

$8.730

10k+ parts

-

688

$9.000

$8.775

$8.730

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Ampacity Inc.

Singapore . 1,552 parts In-Stock

1+ parts

$12.000

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$12.000

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AZTECH Wire

Italy . 800 parts In-Stock

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$12.060

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800

$12.060

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Corohmni

South Africa . 388 parts In-Stock

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$12.970

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388

$12.970

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Advanced Electronics

New Zealand . 53 parts In-Stock

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$13.359

100+ parts

$12.691

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$12.691

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53

$13.359

$12.691

$12.691

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Aztec Data Supply Inc.

USA . 345 parts In-Stock

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$34.310

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345

$34.310

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Lixinc

USA . 16,787 parts In-Stock

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Fulton Briggs Corp.

USA . 4,919 parts In-Stock

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Argo Parts USA

USA . 2,117 parts In-Stock

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Continental Prestige Electronics

USA . 1,808 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Experience next-level performance and reliability with the DSPIC30F6013A-20E/PF by Microchip Technology. As a leader in the industry, Microchip Technology delivers top-of-the-line Digital Signal Processors that are perfect for a wide range of applications. This product offers exceptional value, benefits, and advantages to customers looking for high-quality solutions. With its cutting-edge technology and innovative features, the DSPIC30F6013A-20E/PF is a game-changer in the world of digital signal processing. Elevate your projects with this powerful and versatile device today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for use in a variety of applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power supply options, enabling the product to work reliably in different voltage environments.

Bit Size: 16

A 16-bit architecture provides good processing power and accuracy for handling complex digital signal processing tasks efficiently.

Power Supplies (V): 3/5

Support for both 3V and 5V power supplies offers compatibility with a wide range of existing systems and makes integration easier.

No. of Terminals: 80

The high number of terminals allows for more connections and interfaces, enabling the product to interact with various external components.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures that the product can operate even in low-power scenarios, making it versatile and reliable.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature tolerance makes the product suitable for use in harsh environments or automotive applications where temperature fluctuations are common.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function in cold conditions without issues, enhancing its reliability in various environments.

Terminal Finish: Matte Tin (Sn)

The matte tin finish provides good solderability and corrosion resistance, ensuring a secure and long-lasting connection on the terminals.

Terminal Position: QUAD

The quad terminal position offers a stable mounting base and improves the overall mechanical strength and reliability of the product.

Maximum Seated Height: 1.2 mm

The low seated height allows for a compact and streamlined design, making the product suitable for applications where space is limited.

Width: 14 mm

The moderate width provides a good balance between compactness and ease of handling during installation and maintenance.

Maximum Clock Frequency: 40 MHz

A high maximum clock frequency enables fast processing speeds, making the product efficient in handling real-time signal processing tasks.

Maximum Time At Peak Reflow Temperature (s): 40

The product can withstand peak reflow temperatures for a sufficient duration, ensuring reliable soldering during assembly processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for secure and effective soldering of the terminals, ensuring a durable connection.

Length: 14 mm

The moderate length of the package provides good balance in terms of space utilization and ease of integration into circuit designs.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures that the product can withstand the temperature fluctuations and harsh conditions typically found in automotive applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

The integration of digital signal processing and controller capabilities in one chip offers versatility and flexibility in handling various tasks, making the product a versatile choice.

Technology: CMOS

The CMOS technology used in the product provides low power consumption and high noise immunity, enhancing the efficiency and reliability of the digital signal processing tasks.

Terminal Form: GULL WING

The gull wing terminal form offers a reliable and stable connection, reducing the risk of intermittent contact or electrical failures.

Maximum Supply Current: 250 mA

The moderate maximum supply current requirement ensures efficient power usage and compatibility with a wide range of power supply options.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a common standard in many systems, ensuring compatibility and ease of integration with existing setups.

ROM Programmability: FLASH

The use of flash ROM allows for flexible and easy reprogramming of the memory, enabling quick updates or changes to the software as needed.

Terminal Pitch: 0.65 mm

The small terminal pitch provides high-density mounting capabilities, allowing for more terminals in a compact space and enabling efficient circuit designs.

Format: FIXED POINT

The fixed-point format is suitable for a wide range of signal processing applications where precision and efficiency are crucial.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 indicates that the product has a moderate sensitivity to moisture, making it suitable for most indoor and controlled environments.

On Chip Program ROM Width: 24

The 24-bit width of the on-chip program ROM provides ample storage space for program data, allowing for complex algorithms and processing tasks to be executed efficiently.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F6013A-20E/PF attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 3V MINIMUM SUPPLY AT 15 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

80

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

250 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Trade Compliance

DSPIC30F6013A-20E/PF Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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