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DSPIC33CK32MC102-H/M6

Microchip Technology

DSPIC33CK32MC102-H/M6 by Microchip Technology

DSPIC33CK32MC102-H/M6 by Microchip Technology is a 16-bit DSP with 64 MHz clock frequency, 8192 RAM words, and 3 timers. Ideal for automotive applications, it features a low power mode, flash ROM programmability, and AEC-Q100 screening level.

Median Price

$1.620

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.620

100+ parts

-

1k+ parts

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100

$1.620

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Vyrian

USA . 553 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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553

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 741 parts In-Stock

1+ parts

$1.620

100+ parts

-

1k+ parts

-

10k+ parts

$1.588

741

$1.620

-

-

$1.588

Argo Parts USA

USA . 42 parts In-Stock

1+ parts

$1.620

100+ parts

-

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42

$1.620

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$1.652

100+ parts

$1.652

1k+ parts

$1.652

10k+ parts

-

2,500

$1.652

$1.652

$1.652

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AZTECH Wire

Italy . 218 parts In-Stock

1+ parts

$12.286

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-

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218

$12.286

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Aztec Data Supply Inc.

USA . 1,439 parts In-Stock

1+ parts

$25.340

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1,439

$25.340

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Ampacity Inc.

Singapore . 1,018 parts In-Stock

1+ parts

$32.000

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1,018

$32.000

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Semicontronic

India . 1,219 parts In-Stock

1+ parts

$34.000

100+ parts

$33.150

1k+ parts

$32.980

10k+ parts

-

1,219

$34.000

$33.150

$32.980

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Corohmni

South Africa . 5,182 parts In-Stock

1+ parts

$62.538

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5,182

$62.538

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Marpe Global Electronics

Taiwan . 2,524 parts In-Stock

1+ parts

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2,524

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QualityLine Systems

Poland . 2,524 parts In-Stock

1+ parts

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2,524

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XL Components Corporation

Australia . 2,524 parts In-Stock

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2,524

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Overview

Unlock the power of advanced digital signal processing with the Microchip Technology DSPIC33CK32MC102-H/M6. As a trusted leader in the industry, Microchip delivers exceptional quality and reliability in all their products. This cutting-edge DSP offers unparalleled performance for a wide range of applications, from automotive to industrial control. With integrated cache, low power mode, and high clock frequency, this DSP provides tremendous value and benefits to customers seeking superior processing capabilities. Experience the advantages of Microchip's innovation with the DSPIC33CK32MC102-H/M6.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, making it suitable for various applications.

Integrated Cache: YES

Having an integrated cache improves processing speed and efficiency, enhancing overall performance of the DSP.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power input, accommodating different power sources.

On Chip Data RAM Width: 8

A wider data RAM width allows for handling larger amounts of data simultaneously, improving processing capabilities.

Screening Level: AEC-Q100

This automotive-grade screening level ensures reliability and quality, making it suitable for automotive applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature enables the DSP to function in harsh environmental conditions without overheating.

ROM Programmability: FLASH

The FLASH ROM programmability allows for easy updating and reprogramming of software, enhancing flexibility.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33CK32MC102-H/M6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N28

Length:

4 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Serial I/Os:

3

No. of Terminals:

28

No. of Timers:

3

On Chip Data RAM Width:

8

On Chip Program ROM Width:

24

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.16SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

RAM Words:

8192

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

.6 mm

Maximum Supply Current:

29.6 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

DSPIC33CK32MC102-H/M6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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