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TMS32C6205DZWTA200

Texas Instruments

TMS32C6205DZWTA200 by Texas Instruments

TMS32C6205DZWTA200 by Texas Instruments is a 32-bit DSP with integrated cache, 32-bit external data bus width, and max clock frequency of 200 MHz. Ideal for industrial applications requiring low power mode, it features flash ROM programmability and multiple internal bus architecture.

Median Price

$20.552

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 55 parts In-Stock

1+ parts

$20.552

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55

$20.552

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Vyrian

USA . 8,303 parts In-Stock

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Digiode

USA . 1,175 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,241 parts In-Stock

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$8.000

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$8.000

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AZTECH Wire

Italy . 819 parts In-Stock

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$9.035

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819

$9.035

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Parana Technologies

USA . 1,468 parts In-Stock

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$13.961

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$14.436

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1,468

$13.961

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$14.436

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Ampacity Inc.

Singapore . 1,155 parts In-Stock

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$14.000

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DigiPath Technology Company

USA . 1,634 parts In-Stock

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$15.372

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ChromeModa Solutions

Germany . 5,312 parts In-Stock

1+ parts

$15.686

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$12.863

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$12.863

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IDEA Electronic Components Group

UK . 1,571 parts In-Stock

1+ parts

$15.686

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$14.902

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$14.117

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Corohmni

South Africa . 1,941 parts In-Stock

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$19.082

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Continental Prestige Electronics

USA . 163 parts In-Stock

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$20.552

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$20.141

163

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$20.141

Microchip USA

USA . 1,603 parts In-Stock

1+ parts

$153.190

100+ parts

$150.530

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$149.200

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$147.860

1,603

$153.190

$150.530

$149.200

$147.860

QUARKTWIN TECHNOLOGY LTD

USA . 10,832 parts In-Stock

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Corphita

USA . 4,217 parts In-Stock

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Argo Parts USA

USA . 2,456 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$20.141

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$19.525

10k+ parts

$19.114

2,000

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$20.141

$19.525

$19.114

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the TMS32C6205DZWTA200 by Texas Instruments, a top-of-the-line digital signal processor designed to deliver unparalleled performance. With Texas Instruments' reputation for excellence in engineering, this DSP promises reliability and innovation in every application. From audio processing to telecommunications, this versatile product offers customers value, efficiency, and a competitive edge in today's fast-paced market. Elevate your projects with the TMS32C6205DZWTA200 and experience the difference that quality technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the DSP, ensuring reliability in different operating conditions.

Integrated Cache: YES

The integrated cache helps in improving the processing speed and efficiency of the DSP by storing frequently accessed data and instructions.

Maximum Supply Voltage: 1.57 V

The higher maximum supply voltage allows for more stable performance and better handling of power fluctuations.

On Chip Data RAM Width: 8

Having a wider data RAM width enables the DSP to process larger amounts of data simultaneously, leading to faster computations.

Address Bus Width: 32

A wider address bus width allows the DSP to access a larger memory space, enabling complex algorithms and processing tasks to be handled efficiently.

Package Shape: SQUARE

The square package shape allows for easier and more efficient placement on circuit boards, optimizing space utilization and simplifying the design layout.

Bit Size: 32

Having a 32-bit architecture enables the DSP to handle large data sets and perform complex mathematical operations with higher precision and accuracy.

No. of Terminals: 288

The high number of terminals provides ample connectivity options, allowing for integration with various peripherals and devices for versatile applications.

Package Style: GRID ARRAY, LOW PROFILE, FINE PITCH

This package style offers a compact form factor with efficient heat dissipation properties, ideal for space-constrained and high-performance applications.

Minimum Supply Voltage: 1.43 V

The lower minimum supply voltage helps in reducing power consumption and extends the battery life of devices powered by the DSP.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature, the DSP can withstand harsh environmental conditions and maintain stable performance under extreme heat.

Technical Specifications

Digital Signal Processors (DSPs) TMS32C6205DZWTA200 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B288

JESD-609 Code:

e1

Length:

16 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

288

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA288,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.4 mm

Maximum Supply Current:

290 mA

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16 mm

Peripheral IC Type:

Trade Compliance

TMS32C6205DZWTA200 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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