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DSPIC30F2011-20I/P

Microchip Technology

DSPIC30F2011-20I/P by Microchip Technology

DSPIC30F2011-20I/P by Microchip is a 16-bit DSP with max clock freq of 40MHz. Operating temp range -40 to 85 °C, supply voltage 4.5-5.5V. Ideal for industrial applications requiring digital signal processing and control tasks in compact designs.

Median Price

$3.204

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 500 parts In-Stock

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$4.220

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500

$4.220

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Verical

USA . 500 parts In-Stock

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-

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$2.188

1k+ parts

$2.163

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500

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$2.188

$2.163

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Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$4.399

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300

$4.399

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Vyrian

USA . 2,876 parts In-Stock

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Connector Distribution Corp

USA . 100 parts In-Stock

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100

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Right Parts Inc.

USA . 100 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 644 parts In-Stock

1+ parts

$1.860

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644

$1.860

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Semicontronic

India . 578 parts In-Stock

1+ parts

$1.860

100+ parts

$1.814

1k+ parts

$1.804

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578

$1.860

$1.814

$1.804

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Continental Prestige Electronics

USA . 4,261 parts In-Stock

1+ parts

$4.399

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$4.311

4,261

$4.399

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$4.311

Argo Parts USA

USA . 219 parts In-Stock

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$4.399

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$4.399

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Netroflash

USA . 50 parts In-Stock

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$4.399

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$4.311

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$4.311

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Andel Nordic

Denmark . 224 parts In-Stock

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$10.820

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$10.387

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$10.387

224

$10.820

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$10.387

$10.387

AZTECH Wire

Italy . 853 parts In-Stock

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$19.390

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Lixinc

USA . 9,515 parts In-Stock

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QualityLine Systems

Poland . 7,673 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,339 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,226 parts In-Stock

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XL Components Corporation

Australia . 2,541 parts In-Stock

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Marpe Global Electronics

Taiwan . 1,073 parts In-Stock

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Overview

Elevate your digital signal processing capabilities with the cutting-edge DSPIC30F2011-20I/P by Microchip Technology. Designed with precision and reliability in mind, this digital signal processor offers unparalleled performance in a compact package. Whether you're working on industrial automation, motor control, or consumer electronics, this DSP provides the power and efficiency you need to bring your projects to life. Trust Microchip's expertise and unlock endless possibilities with the DSPIC30F2011-20I/P. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the DSP, making it suitable for various operating conditions.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this DSP can handle a wide range of power inputs, providing flexibility in different applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement and installation of the DSP in electronic systems.

Bit Size: 16

The 16-bit size allows for fast and efficient processing of digital signals, making this DSP suitable for real-time applications.

No. of Terminals: 18

With 18 terminals, this DSP can easily connect to other components in a circuit for seamless integration.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency enables quick processing of signals, making this DSP suitable for high-speed applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making this DSP suitable for industrial applications.

ROM Programmability: FLASH

The flash programmability of the ROM allows for easy updates and modifications to the program, enhancing the flexibility and adaptability of this DSP.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F2011-20I/P attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

ALSO OPERATES AT 2.5V SUPPLY AT 7.5MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

R-PDIP-T18

JESD-609 Code:

e3

Length:

22.86 mm

No. of Terminals:

18

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP18,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3/5

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

4.32 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

DSPIC30F2011-20I/P Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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