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DSPIC33CK512MP606-H/PT

Microchip Technology

DSPIC33CK512MP606-H/PT by Microchip Technology

DSPIC33CK512MP606-H/PT by Microchip Technology is a 16-bit DSP with 64 MHz clock frequency, 3.6 V max supply voltage, and 65536 RAM words. Ideal for digital signal processing applications in automotive electronics due to AEC-Q100 screening level and low power mode support.

Median Price

$5.240

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 750 parts In-Stock

1+ parts

$5.240

100+ parts

-

1k+ parts

-

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750

$5.240

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-

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Vyrian

USA . 319 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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319

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 759 parts In-Stock

1+ parts

$3.000

100+ parts

$2.925

1k+ parts

$2.910

10k+ parts

-

759

$3.000

$2.925

$2.910

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$5.135

100+ parts

-

1k+ parts

$4.930

10k+ parts

-

100

$5.135

-

$4.930

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Continental Prestige Electronics

USA . 4,246 parts In-Stock

1+ parts

$5.240

100+ parts

-

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10k+ parts

$5.135

4,246

$5.240

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-

$5.135

Ampacity Inc.

Singapore . 1,431 parts In-Stock

1+ parts

$10.000

100+ parts

-

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1,431

$10.000

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AZTECH Wire

Italy . 857 parts In-Stock

1+ parts

$18.044

100+ parts

-

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857

$18.044

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-

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Aztec Data Supply Inc.

USA . 236 parts In-Stock

1+ parts

$19.110

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-

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236

$19.110

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Corohmni

South Africa . 105 parts In-Stock

1+ parts

$59.982

100+ parts

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105

$59.982

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RGB Technical Solutions

Ukraine . 4,034 parts In-Stock

1+ parts

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100+ parts

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4,034

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Argo Parts USA

USA . 1,741 parts In-Stock

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1,741

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Overview

Enhance your digital signal processing capabilities with the Microchip Technology DSPIC33CK512MP606-H/PT. Manufactured by industry leader Microchip Technology, this high-quality digital signal processor offers unparalleled performance and reliability in a compact package. Ideal for a wide range of applications, this DSP provides customers with superior value, benefits, and advantages. Upgrade your projects with the cutting-edge technology of the DSPIC33CK512MP606-H/PT and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs, offering flexibility in power supply options.

On Chip Data RAM Width: 8

Provides sufficient memory for data processing tasks.

Package Shape: SQUARE

Optimizes space utilization on the circuit board.

Bit Size: 16

Offers higher precision in data processing operations.

Maximum Operating Temperature: 150 °C

Can operate efficiently even in high-temperature environments.

RAM Words: 65536

Offers ample memory for storing program instructions and data.

Maximum Clock Frequency: 64 MHz

Enables fast data processing and response times.

Technology: CMOS

Provides low power consumption and high noise immunity.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33CK512MP606-H/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

64 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

Low Power Mode:

YES

No. of DMA Channels:

8

No. of External Interrupts:

4

No. of Terminals:

64

No. of Timers:

1

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

RAM Words:

65536

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

42 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

DSPIC33CK512MP606-H/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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