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DSPIC33EV256GM106-H/MR

Microchip Technology

DSPIC33EV256GM106-H/MR by Microchip Technology

DSPIC33EV256GM106-H/MR by Microchip Technology is a 16-bit digital signal processor with 36-Ch 12-Bit ADC channels and 7 timers. It operates at a max clock frequency of 40 MHz, suitable for automotive applications due to its AEC-Q100 screening level and -40 to 150°C temperature range. With low power mode, CAN, I2C, SPI connectivity options, it's ideal for automotive control systems.

Median Price

$5.420

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 91 parts In-Stock

1+ parts

$5.420

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91

$5.420

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Vyrian

USA . 285 parts In-Stock

1+ parts

-

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285

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,675 parts In-Stock

1+ parts

$5.420

100+ parts

-

1k+ parts

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10k+ parts

$5.312

2,675

$5.420

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$5.312

Netroflash

USA . 50 parts In-Stock

1+ parts

$5.420

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$5.312

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50

$5.420

$5.312

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Advanced Electronics

New Zealand . 30 parts In-Stock

1+ parts

$6.287

100+ parts

$5.784

1k+ parts

$5.420

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-

30

$6.287

$5.784

$5.420

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AZTECH Wire

Italy . 254 parts In-Stock

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$8.502

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254

$8.502

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Semicontronic

India . 702 parts In-Stock

1+ parts

$22.000

100+ parts

$21.450

1k+ parts

$21.340

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702

$22.000

$21.450

$21.340

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Aztec Data Supply Inc.

USA . 1,985 parts In-Stock

1+ parts

$31.630

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1,985

$31.630

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Corohmni

South Africa . 868 parts In-Stock

1+ parts

$80.331

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868

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QualityLine Systems

Poland . 2,700 parts In-Stock

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2,700

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Argo Parts USA

USA . 1,329 parts In-Stock

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Marpe Global Electronics

Taiwan . 183 parts In-Stock

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XL Components Corporation

Australia . 163 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the DSPIC33EV256GM106-H/MR by Microchip Technology. This high-quality Digital Signal Processor offers unparalleled performance and reliability, making it ideal for a wide range of applications in automotive and industrial settings. With its advanced features and innovative design, this product delivers exceptional value and benefits to customers looking to take their projects to the next level. Experience the advantages of Microchip Technology and elevate your work to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Being made of plastic/epoxy makes this product lightweight and durable, ideal for applications that require portability and reliability.

Maximum Supply Voltage: 5.5 V

Having a high maximum supply voltage allows for flexibility in the power supply options, enabling compatibility with various systems.

Bit Size: 16

A 16-bit size ensures that this DSP can handle complex calculations and processing tasks efficiently, making it suitable for demanding applications.

Maximum Clock Frequency: 40 MHz

With a high maximum clock frequency, this DSP can operate at fast speeds, enabling real-time processing of data and ensuring responsive performance.

Connectivity: CAN, I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

The multiple connectivity options allow for seamless integration with a variety of communication protocols and devices, enhancing the versatility and interoperability of this DSP.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EV256GM106-H/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

ADC Channels:

YES

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of I/O Lines:

53

No. of Terminals:

64

No. of Timers:

7

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

RAM Bytes:

16384

RAM Words:

16384

ROM Words:

262144

ROM Programmability:

FLASH

Screening Level:

AEC-Q100; TS 16949

Maximum Seated Height:

1 mm

Speed:

40 rpm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

350 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Data EEPROM Size:

0

Connectivity:

CAN, I2C, IRDA, LIN, SENT(2), SMBUS, SPI(2), UART(2)

Peripherals:

BOR, COMPARATOR(5), DMA(4), POR, PWM(6), TIMER(7), WDT

Analog To Digital Convertors:

36-Ch 12-Bit

Trade Compliance

DSPIC33EV256GM106-H/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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