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TMS320F2812ZHHA

Texas Instruments

TMS320F2812ZHHA by Texas Instruments

TMS320F2812ZHHA by Texas Instruments is a 32-bit DSP with 150 MHz clock frequency, 18432 RAM words, and 16-bit data bus width. Widely used in industrial applications for its low power mode, multiple timers, and digital signal processing capabilities.

Median Price

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6

In-Stock Inventory

1k+

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Vyrian

USA . 5,305 parts In-Stock

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Digiode

USA . 3,212 parts In-Stock

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Chip Stock

USA . 925 parts In-Stock

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925

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Cyclops Electronics Ltd

UK . 160 parts In-Stock

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160

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Nova Conductors

Japan . 72 parts In-Stock

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ComSIT Distribution GmbH

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One Stop Electronics

USA . 512 parts In-Stock

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$6.000

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$6.000

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Andel Nordic

Denmark . 1,153 parts In-Stock

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$10.687

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$10.259

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$10.259

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$10.687

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$10.259

AZTECH Wire

Italy . 830 parts In-Stock

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$14.689

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$14.689

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Advanced Electronics

New Zealand . 52 parts In-Stock

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$18.309

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$17.394

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Semicontronic

India . 636 parts In-Stock

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$21.000

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$20.475

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$20.370

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$21.000

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Ampacity Inc.

Singapore . 1,001 parts In-Stock

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$34.000

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Corohmni

South Africa . 2,410 parts In-Stock

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Parana Technologies

USA . 2,208 parts In-Stock

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DigiPath Technology Company

USA . 708 parts In-Stock

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$83.345

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$76.677

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ChromeModa Solutions

Germany . 4,946 parts In-Stock

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$85.046

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$69.738

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$69.738

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IDEA Electronic Components Group

UK . 723 parts In-Stock

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$85.046

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$80.794

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$76.541

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$76.541

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S.R.D Solutions

India . 30,000 parts In-Stock

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Lixinc

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Corphita

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Argo Parts USA

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Perfect Parts

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Kepictronics

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A-Z Elektronik GmbH

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Continental Prestige Electronics

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Microchip USA

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Bastille Electronics

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Overview

Elevate your projects with the TMS320F2812ZHHA by Texas Instruments, a top-tier digital signal processor that guarantees exceptional quality and performance. As a trusted manufacturer in the industry, Texas Instruments delivers cutting-edge technology that meets the highest standards. Ideal for a wide range of applications, this DSP offers unmatched value and benefits to customers looking for reliability and efficiency. Experience seamless integration and advanced capabilities with the TMS320F2812ZHHA, setting new benchmarks in digital processing technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the DSP.

Surface Mount: YES

Allows for easy integration onto printed circuit boards, saving space and streamlining assembly.

Maximum Supply Voltage: 2 V

Efficient power usage and compatibility with a variety of power sources.

On Chip Data RAM Width: 16

Allows for fast data processing and manipulation.

Address Bus Width: 19

Supports large memory addressing capabilities for complex applications.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and robust performance in harsh environments.

Package Shape: SQUARE

Optimal packaging for efficient use of space on PCBs.

Bit Size: 32

High processing power and precision for demanding signal processing tasks.

Power Supplies (V): 1.9, 3.3

Versatile power supply options for flexibility in design and compatibility with different systems.

No. of Terminals: 179

Offering a wide range of connectivity options for peripherals and external devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Enables easy mounting and connection to other components on the PCB.

Minimum Supply Voltage: 1.81 V

Allows for operation at lower power levels for energy efficiency.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications that require operation in high-temperature environments.

CPU Family: C28X

Part of a well-established and reliable family of processor cores.

No. of External Interrupts: 3

Enables the DSP to respond quickly to external events or signals.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold temperatures, ideal for a wide range of environments.

Terminal Finish: TIN SILVER COPPER

Provides good contact reliability and conductivity for the terminal connections.

Terminal Position: BOTTOM

Facilitates easier PCB layout and design for efficient signal routing.

Maximum Seated Height: 1.4 mm

Low profile design for compact and space-saving PCB assemblies.

RAM Words: 18432

Ample memory capacity for storing and manipulating data during processing tasks.

Width: 12 mm

Compact form factor suitable for small or space-constrained applications.

Boundary Scan: YES

Facilitates testing and debugging during development and production.

External Data Bus Width: 16

Efficient data transfer between external devices and the DSP core.

Maximum Clock Frequency: 150 MHz

High clock speed for fast signal processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow profile for reliable soldering and assembly processes.

Peak Reflow Temperature °C: 260

Soldering temperature suitable for lead-free assembly and RoHS compliance.

Internal Bus Architecture: MULTIPLE

Efficient data routing within the DSP core for parallel processing tasks.

Length: 12 mm

Symmetrical form factor for easy integration and alignment on the PCB.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature ranges for robust performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile peripheral support for interfacing with various external devices and systems.

No. of Timers: 8

Allows for precise timing and scheduling of tasks in real-time applications.

RAM Bytes: 36864

High memory capacity for storing program instructions and data during operation.

Technology: CMOS

Low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Facilitates soldering and ensures secure connections to the PCB.

Maximum Supply Current: 230 mA

Efficient power usage with low current consumption for energy-efficient operation.

Nominal Supply Voltage: 1.9 V

Stable supply voltage for consistent and reliable performance.

PWM Channels: YES

Supports Pulse Width Modulation for precise control of analog signals.

ROM Programmability: OTPROM

Allows for one-time programmability of Read-Only Memory for storing critical data.

Terminal Pitch: 0.8 mm

Fine pitch design for efficient routing and placement on the PCB.

Format: FIXED POINT

Optimized for fixed-point arithmetic operations for efficient signal processing.

Moisture Sensitivity Level (MSL): 3

Moderate sensitivity to moisture, suitable for typical PCB assembly processes.

Low Power Mode: YES

Enables power-saving modes for extended battery life in portable applications.

On Chip Program ROM Width: 16

Efficient storage of program instructions for fast execution and performance.

Technical Specifications

Digital Signal Processors (DSPs) TMS320F2812ZHHA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES AT 1.8 SUPPLY AT 135MHZ

Address Bus Width:

19

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

CPU Family:

C28X

Maximum Clock Frequency:

150 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B179

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

3

No. of Terminals:

179

No. of Timers:

8

On Chip Data RAM Width:

16

On Chip Program ROM Width:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA179,14X14,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.9,3.3

Qualification:

Not Qualified

RAM Bytes:

36864

RAM Words:

18432

ROM Programmability:

OTPROM

Screening Level:

AEC-Q100

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

230 mA

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.81 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320F2812ZHHA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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