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DSPIC33EP256MC506T-I/MR

Microchip Technology

DSPIC33EP256MC506T-I/MR by Microchip Technology

DSPIC33EP256MC506T-I/MR by Microchip is a 16-bit DSP with max clock freq of 60MHz, operating temp range -40 to 85°C. Ideal for industrial applications, it features flash ROM programmability, operates at 3.3V, and has a package style of chip carrier with very thin profile.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,098 parts In-Stock

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Nova Conductors

Japan . 54 parts In-Stock

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AZTECH Wire

Italy . 728 parts In-Stock

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$10.395

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728

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Ampacity Inc.

Singapore . 219 parts In-Stock

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$20.000

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Advanced Electronics

New Zealand . 91 parts In-Stock

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$56.419

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$51.341

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$46.264

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Corohmni

South Africa . 43 parts In-Stock

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$78.931

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Marpe Global Electronics

Taiwan . 7,465 parts In-Stock

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XL Components Corporation

Australia . 6,290 parts In-Stock

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Argo Parts USA

USA . 4,765 parts In-Stock

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Continental Prestige Electronics

USA . 2,925 parts In-Stock

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QualityLine Systems

Poland . 2,245 parts In-Stock

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Microchip USA

USA . 1,140 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Bastille Electronics

Australia . 15 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the DSPIC33EP256MC506T-I/MR by Microchip Technology. As a leader in the industry, Microchip ensures top-notch quality and reliability in their Digital Signal Processors (DSPs), making them the go-to choice for a wide range of applications. From controllers to digital signal processing, this product offers unmatched value, benefits, and advantages to customers looking for seamless performance and precision. Elevate your projects to the next level with the DSPIC33EP256MC506T-I/MR and experience the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy as the package body material provides durability and protection for the internal components of the DSP, making it suitable for various environments.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexibility in power supply options, ensuring compatibility with different systems and applications.

Bit Size: 16

With a 16-bit architecture, the DSP can handle complex signal processing tasks with precision and accuracy, making it ideal for audio processing, digital communications, and other demanding applications.

Maximum Clock Frequency: 60 MHz

The high clock frequency enables fast processing speeds and real-time responsiveness, making the DSP suitable for high-performance applications that require quick data processing.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and flexible firmware updates, enabling customization and adaptation to changing requirements without the need for external programming equipment.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EP256MC506T-I/MR attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

60 MHz

External Data Bus Width:

0

Format:

FLOATING POINT

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e3

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

On Chip Program ROM Width:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

150 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

9 mm

Trade Compliance

DSPIC33EP256MC506T-I/MR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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