Loading...

XOMAPL137DZKBA3

Texas Instruments

XOMAPL137DZKBA3 by Texas Instruments

XOMAPL137DZKBA3 by Texas Instruments is a DSP with 16-bit external data bus, 30 MHz clock frequency, and 1.2V nominal voltage. Ideal for industrial applications requiring low power consumption and single internal bus architecture.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,348 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,348

-

-

-

-

Digiode

USA . 3,216 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,216

-

-

-

-

Nova Conductors

Japan . 600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

600

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,323 parts In-Stock

1+ parts

$6.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,323

$6.000

-

-

-

AZTECH Wire

Italy . 274 parts In-Stock

1+ parts

$6.870

100+ parts

-

1k+ parts

-

10k+ parts

-

274

$6.870

-

-

-

Corohmni

South Africa . 1,084 parts In-Stock

1+ parts

$26.972

100+ parts

-

1k+ parts

-

10k+ parts

-

1,084

$26.972

-

-

-

Ampacity Inc.

Singapore . 944 parts In-Stock

1+ parts

$30.000

100+ parts

-

1k+ parts

-

10k+ parts

-

944

$30.000

-

-

-

Semicontronic

India . 575 parts In-Stock

1+ parts

$32.000

100+ parts

$31.200

1k+ parts

$31.040

10k+ parts

-

575

$32.000

$31.200

$31.040

-

Parana Technologies

USA . 2,210 parts In-Stock

1+ parts

$75.863

100+ parts

-

1k+ parts

-

10k+ parts

-

2,210

$75.863

-

-

-

DigiPath Technology Company

USA . 559 parts In-Stock

1+ parts

$83.534

100+ parts

-

1k+ parts

-

10k+ parts

-

559

$83.534

-

-

-

IDEA Electronic Components Group

UK . 1,836 parts In-Stock

1+ parts

$85.239

100+ parts

$80.977

1k+ parts

$76.715

10k+ parts

-

1,836

$85.239

$80.977

$76.715

-

ChromeModa Solutions

Germany . 928 parts In-Stock

1+ parts

$85.239

100+ parts

$69.896

1k+ parts

-

10k+ parts

-

928

$85.239

$69.896

-

-

Lixinc

USA . 6,187 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,187

-

-

-

-

Continental Prestige Electronics

USA . 5,368 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,368

-

-

-

-

Argo Parts USA

USA . 4,509 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,509

-

-

-

-

Corphita

USA . 3,344 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,344

-

-

-

-

Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,000

-

-

-

-

Advanced Electronics

New Zealand . 650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

650

-

-

-

-

Microchip USA

USA . 196 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

196

-

-

-

-

Bastille Electronics

Australia . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Elevate your digital signal processing projects with the XOMAPL137DZKBA3 by Texas Instruments. With a reputation for top-quality manufacturing, Texas Instruments delivers a cutting-edge product designed to push boundaries in the DSP category. This versatile processor offers customers unmatched value, benefits, and advantages, making it ideal for a wide range of applications. Upgrade your technology game today with the XOMAPL137DZKBA3 and experience next-level performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material helps in reducing the overall weight of the product and provides good insulation properties.

Surface Mount: YES

Surface mount technology helps in easy and quick assembly of the product on the circuit board.

Maximum Supply Voltage: 1.32 V

Allows for efficient power consumption and operation within specified voltage limits.

Address Bus Width: 15

Wide address bus width allows for efficient memory address handling and access.

Package Shape: SQUARE

Square package shape makes it easier to integrate the product on the circuit board.

No. of Terminals: 256

High number of terminals allow for multiple connections and interfaces with other components.

Package Style (Meter): GRID ARRAY

Grid array package style provides good thermal conductivity and mechanical stability.

Minimum Supply Voltage: 1.14 V

Ensures stable operation even during low voltage conditions.

Maximum Operating Temperature: 85 °C

Operates efficiently even in high temperature environments.

Minimum Operating Temperature: -40 °C

Can withstand cold temperatures without affecting performance.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides good conductivity and corrosion resistance.

Terminal Position: BOTTOM

Bottom terminal position allows for easy mounting and connection.

Maximum Seated Height: 2.05 mm

Low seated height helps in compact design and space-saving on the circuit board.

Width: 17 mm

Compact width allows for easy integration in various electronic devices.

Boundary Scan: YES

Boundary scan feature helps in testing and debugging the product during production.

External Data Bus Width: 16

Wide external data bus width enables efficient data transfer between components.

Maximum Clock Frequency: 30 MHz

High clock frequency allows for faster processing and data handling.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures that the product can withstand reflow soldering processes without damage.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance for reliable soldering and assembly.

Internal Bus Architecture: SINGLE

Single internal bus architecture simplifies data flow and processing within the product.

Length: 17 mm

Compact length allows for space-saving integration in electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh environmental conditions.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specifically designed for digital signal processing applications, making it suitable for various signal processing tasks.

Technology: CMOS

CMOS technology provides low power consumption and fast switching speeds.

Terminal Form: BALL

Ball terminal form facilitates easy mounting and soldering on the circuit board.

Nominal Supply Voltage: 1.2 V

Stable nominal supply voltage for efficient and reliable operation.

Terminal Pitch: 1 mm

Close terminal pitch allows for compact design and space-saving on the circuit board.

Format: FLOATING POINT

Supports floating-point arithmetic operations for precise and accurate calculations.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the product can withstand moderate exposure to moisture during storage and handling.

Low Power Mode: YES

Low power mode feature helps in reducing power consumption during idle or low-load conditions.

Technical Specifications

Digital Signal Processors (DSPs) XOMAPL137DZKBA3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

15

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.05 mm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

XOMAPL137DZKBA3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 12