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XOMAP3503DCUS

Texas Instruments

XOMAP3503DCUS by Texas Instruments

XOMAP3503DCUS by Texas Instruments is a DSP with 16-bit external data bus width, 38.4 MHz clock frequency, and 423 terminals in a low-profile grid array package. Ideal for commercial applications requiring a CMOS technology-based digital signal processor with floating-point format and boundary scan capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,733 parts In-Stock

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Digiode

USA . 4,836 parts In-Stock

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4,836

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Distributors (Availability)

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One Stop Electronics

USA . 619 parts In-Stock

1+ parts

$11.000

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619

$11.000

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AZTECH Wire

Italy . 622 parts In-Stock

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$19.324

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622

$19.324

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Parana Technologies

USA . 1,533 parts In-Stock

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$19.954

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$19.900

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1,533

$19.954

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$19.900

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ChromeModa Solutions

Germany . 5,494 parts In-Stock

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$22.420

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$18.384

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5,494

$22.420

$18.384

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IDEA Electronic Components Group

UK . 66 parts In-Stock

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$22.420

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$21.299

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$20.178

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66

$22.420

$21.299

$20.178

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Corohmni

South Africa . 2,104 parts In-Stock

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$28.419

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2,104

$28.419

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Corphita

USA . 4,394 parts In-Stock

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DigiPath Technology Company

USA . 1,608 parts In-Stock

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$20.214

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1,608

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Overview

Unlock the power of cutting-edge technology with the XOMAP3503DCUS by Texas Instruments. As a leading manufacturer in digital signal processors, Texas Instruments delivers unmatched quality and performance in this category. From enhancing audio and video processing to improving communication systems, this product offers countless applications that cater to various industries. With low power mode capabilities and a floating point format, customers can expect unparalleled efficiency and precision in their projects. Experience the value and benefits of advanced technology with the XOMAP3503DCUS today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on PCBs, saving space and simplifying manufacturing processes.

Maximum Supply Voltage: 1.89 V

The high maximum supply voltage allows for a wider operating range, increasing flexibility in power supply configurations.

Address Bus Width: 26

A wide address bus width of 26 enables the processor to handle large amounts of memory, improving overall performance in data-intensive applications.

No. of Terminals: 423

With a high number of terminals, the processor can support various connections and interfaces, making it versatile for different system configurations.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage allows for efficient power management and can help reduce power consumption in low-power modes.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliable performance even in extreme environmental conditions, making it suitable for a wide range of applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

The mixed peripheral IC type allows the processor to handle multiple types of signals, making it versatile for various signal processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) XOMAP3503DCUS attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

26

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B423

Length:

16 mm

Low Power Mode:

YES

No. of Terminals:

423

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.4 mm

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Width:

16 mm

Peripheral IC Type:

Trade Compliance

XOMAP3503DCUS Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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