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XOMAP3503BCBB

Texas Instruments

XOMAP3503BCBB by Texas Instruments

XOMAP3503BCBB by Texas Instruments is a DSP with 16-bit external data bus, 38.4 MHz clock frequency, and 26-bit address bus width. Ideal for commercial applications requiring low power consumption and floating-point format processing in a compact grid array package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,782 parts In-Stock

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Digiode

USA . 1,039 parts In-Stock

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1,039

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Distributors (Availability)

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Andel Nordic

Denmark . 3,669 parts In-Stock

1+ parts

$9.350

100+ parts

-

1k+ parts

$8.976

10k+ parts

$8.976

3,669

$9.350

-

$8.976

$8.976

AZTECH Wire

Italy . 818 parts In-Stock

1+ parts

$9.860

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818

$9.860

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One Stop Electronics

USA . 1,266 parts In-Stock

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$10.000

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1,266

$10.000

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Corohmni

South Africa . 306 parts In-Stock

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$17.650

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306

$17.650

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Parana Technologies

USA . 2,350 parts In-Stock

1+ parts

$19.550

100+ parts

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$19.553

10k+ parts

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2,350

$19.550

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$19.553

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DigiPath Technology Company

USA . 221 parts In-Stock

1+ parts

$21.527

100+ parts

$19.805

1k+ parts

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221

$21.527

$19.805

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IDEA Electronic Components Group

UK . 1,570 parts In-Stock

1+ parts

$21.966

100+ parts

$20.868

1k+ parts

$19.769

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1,570

$21.966

$20.868

$19.769

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ChromeModa Solutions

Germany . 968 parts In-Stock

1+ parts

$21.966

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$18.012

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968

$21.966

$18.012

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Microchip USA

USA . 491 parts In-Stock

1+ parts

$95.360

100+ parts

$93.700

1k+ parts

$92.870

10k+ parts

$92.040

491

$95.360

$93.700

$92.870

$92.040

Corphita

USA . 1,830 parts In-Stock

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1,830

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Perfect Parts

USA . 6 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the XOMAP3503BCBB by Texas Instruments, a leading manufacturer known for quality and innovation. As a top-of-the-line Digital Signal Processor (DSP), this product offers unparalleled performance and reliability for a wide range of applications. From audio processing to telecommunications, the XOMAP3503BCBB delivers seamless operation and efficiency, making it the perfect choice for customers looking for superior value and unbeatable benefits in their electronic devices. Trust Texas Instruments to provide you with the best in digital signal processing technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good durability and reliability for the product

Surface Mount: YES

Surface mount technology simplifies the assembly process and saves space on the circuit board

Maximum Supply Voltage: 1.89 V

High maximum supply voltage allows for flexibility in power input

Address Bus Width: 26

Wide address bus width enables efficient data processing and memory access

Power Supplies (V): 1.1,1.8,3.3

Multiple power supply options allow for versatile use in different systems

No. of Terminals: 515

High number of terminals provide ample connectivity options

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with thin profile and fine pitch enhances signal transmission and reduces interference

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage ensures efficiency in power consumption

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliability in challenging environments

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures functionality in a wide range of conditions

Terminal Position: BOTTOM

Bottom terminal position facilitates easy integration into circuit boards

Maximum Seated Height: 1 mm

Low maximum seated height saves space and enables compact design

Width: 14 mm

Compact width allows for easy installation in various systems

Boundary Scan: YES

Boundary scan capability enhances testing and debugging processes

External Data Bus Width: 16

Optimal external data bus width for efficient data communication

Maximum Clock Frequency: 38.4 MHz

High maximum clock frequency enables fast data processing and response times

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and processing capabilities

Length: 14 mm

Compact length facilitates space-efficient design

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

Mixed signal processing capability enhances the versatility of the product

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity

Terminal Form: BALL

Ball terminal form allows for reliable connections and easy soldering

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage for consistent performance

Terminal Pitch: 0.5 mm

Fine terminal pitch enables dense packaging and high connectivity

Format: FLOATING POINT

Floating point format provides precision in mathematical operations

Low Power Mode: YES

Low power mode option enhances energy efficiency

Technical Specifications

Digital Signal Processors (DSPs) XOMAP3503BCBB attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

26

Barrel Shifter:

NO

Boundary Scan:

YES

Maximum Clock Frequency:

38.4 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B515

Length:

14 mm

Low Power Mode:

YES

No. of Terminals:

515

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA515,28X28,16

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Power Supplies (V):

1.1,1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Graphics Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

14 mm

Peripheral IC Type:

Trade Compliance

XOMAP3503BCBB Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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