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DSPIC33EV256GM104-I/P8

Microchip Technology

DSPIC33EV256GM104-I/P8 by Microchip Technology

DSPIC33EV256GM104-I/P8 by Microchip is a 16-bit digital signal processor with 32768 RAM words, operating at up to 40 MHz. Ideal for industrial applications, it features low power mode, flash ROM programmability, and multiple internal bus architecture for efficient processing.

Median Price

$5.260

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 393 parts In-Stock

1+ parts

$5.260

100+ parts

$4.370

1k+ parts

$4.360

10k+ parts

-

393

$5.260

$4.370

$4.360

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DigiKey

USA . 217 parts In-Stock

1+ parts

$5.260

100+ parts

$4.370

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-

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217

$5.260

$4.370

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$4.719

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700

$4.719

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Vyrian

USA . 7,007 parts In-Stock

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7,007

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Distributors (Availability)

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Ampacity Inc.

Singapore . 242 parts In-Stock

1+ parts

$4.470

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242

$4.470

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Aranea Global

USA . 500 parts In-Stock

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$4.625

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$4.440

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500

$4.625

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$4.440

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Continental Prestige Electronics

USA . 2,684 parts In-Stock

1+ parts

$4.719

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$4.625

2,684

$4.719

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-

$4.625

AZTECH Wire

Italy . 691 parts In-Stock

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$12.105

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691

$12.105

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Corohmni

South Africa . 516 parts In-Stock

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$51.267

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516

$51.267

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Argo Parts USA

USA . 4,736 parts In-Stock

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4,736

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West Coast Incorporated

USA . 2,573 parts In-Stock

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2,573

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Overview

Unleash the power of cutting-edge technology with the Microchip Technology DSPIC33EV256GM104-I/P8 Digital Signal Processor. Designed for seamless integration and optimal performance, this high-quality product offers unparalleled value and benefits to customers across various industries. From automotive to industrial applications, experience the advantages of precision engineering, reliability, and efficiency that only a trusted manufacturer like Microchip can provide. Upgrade your systems with the DSPIC33EV256GM104-I/P8 and elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Operating at a maximum supply voltage of 5.5V provides flexibility and compatibility with various power sources.

On Chip Data RAM Width: 8

Having a wide on-chip data RAM width of 8 bits allows for efficient data processing and storage.

Screening Level: TS 16949

TS 16949 screening level ensures high quality and reliability, making it suitable for automotive applications.

Package Shape: SQUARE

Square package shape provides uniformity and ease of mounting on the PCB.

Bit Size: 16

16-bit processing capability enables handling of complex algorithms and tasks efficiently.

No. of Terminals: 48

With 48 terminals, there are enough interfacing options for connectivity with other devices.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

This package style offers compact size, thin profile for space-constrained applications, and fine pitch for high-density packaging.

Minimum Supply Voltage: 4.5 V

Supporting a minimum supply voltage of 4.5V ensures operation even in low-power scenarios.

Maximum Operating Temperature: 85 °C

Operating at up to 85°C allows for stable performance in harsh environments.

No. of External Interrupts: 3

3 external interrupt pins allow for efficient handling of external events without missing critical tasks.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC33EV256GM104-I/P8 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Address Bus Width:

0

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

Integrated Cache:

NO

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G48

Length:

9 mm

Low Power Mode:

YES

No. of DMA Channels:

4

No. of External Interrupts:

3

No. of Terminals:

48

No. of Timers:

9

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

RAM Words:

32768

ROM Programmability:

FLASH

Screening Level:

TS 16949

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

60 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

9 mm

Trade Compliance

DSPIC33EV256GM104-I/P8 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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