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TMS320DM6435ZWT6

Texas Instruments

TMS320DM6435ZWT6 by Texas Instruments

TMS320DM6435ZWT6 by Texas Instruments is a 32-bit DSP with integrated cache, 8-word data RAM, and 32-bit external data bus. It operates b/w 0-90°C and has 72 DMA channels for applications requiring high-speed signal processing in digital systems.

Median Price

$38.214

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 630 parts In-Stock

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$30.649

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$27.244

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$20.032

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630

$30.649

$27.244

$20.032

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DigiKey

USA . 123 parts In-Stock

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$45.780

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$33.278

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$33.278

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Distributors (In-Stock)

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Digiode

USA . 3,316 parts In-Stock

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$29.117

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Nova Conductors

Japan . 200 parts In-Stock

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$31.684

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$31.684

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Vyrian

USA . 3,276 parts In-Stock

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Chip Stock

USA . 2,833 parts In-Stock

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Speed Components Ltd

Israel . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 512 parts In-Stock

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$6.255

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512

$6.255

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Ampacity Inc.

Singapore . 246 parts In-Stock

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$26.050

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$26.050

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Corphita

USA . 3,401 parts In-Stock

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$27.584

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$27.584

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Aranea Global

USA . 2,000 parts In-Stock

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$31.050

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$29.808

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$31.050

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Continental Prestige Electronics

USA . 5,494 parts In-Stock

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$31.684

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$31.050

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$31.050

Corohmni

South Africa . 685 parts In-Stock

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$31.684

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$41.327

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$37.608

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$33.888

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$41.327

$37.608

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Semicontronic

India . 292 parts In-Stock

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$56.700

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$55.282

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$54.999

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$54.999

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Parana Technologies

USA . 2,091 parts In-Stock

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$68.024

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DigiPath Technology Company

USA . 759 parts In-Stock

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$74.902

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$68.910

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ChromeModa Solutions

Germany . 2,802 parts In-Stock

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$76.431

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IDEA Electronic Components Group

UK . 339 parts In-Stock

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$76.431

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$72.609

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$68.788

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339

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$68.788

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Lixinc

USA . 7,763 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,571 parts In-Stock

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Argo Parts USA

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Perfect Parts

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Kepictronics

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Overview

Unlock the power of digital signal processing with the TMS320DM6435ZWT6 by Texas Instruments. This cutting-edge DSP offers unparalleled quality and reliability, backed by the trusted name of Texas Instruments. Ideal for a wide range of applications, this DSP provides customers with unmatched value and benefits. Whether you're looking to enhance audio, video, or communication systems, the TMS320DM6435ZWT6 delivers superior performance and efficiency, making it the perfect choice for your next project. Elevate your designs with the TMS320DM6435ZWT6 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP, ensuring long-lasting performance.

Integrated Cache: YES

Having an integrated cache allows for faster data access and processing, improving overall performance.

Maximum Supply Voltage: 1.26 V

This voltage level provides the necessary power for the DSP to operate efficiently without risking damage.

On Chip Data RAM Width: 8

A wider data RAM width allows for the storage and processing of larger amounts of data simultaneously, enhancing performance.

Address Bus Width: 13

With a wider address bus width, the DSP can access and manage a larger memory space, enabling more complex calculations and operations.

Bit Size: 32

A 32-bit architecture enables the DSP to process data in larger chunks, leading to faster computation and execution of tasks.

Power Supplies (V): 1.2, 1.8, 3.3

Having multiple power supply options allows for flexibility in different operating scenarios and power consumption requirements.

No. of Terminals: 361

A higher number of terminals provide more connectivity options and interfaces for peripherals, expanding the capabilities of the DSP.

RAM Words: 81920

With a large RAM capacity, the DSP can store and retrieve a significant amount of data quickly, improving efficiency and performance.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supporting various peripheral IC types enables the DSP to interface with a wide range of devices and systems, enhancing its versatility.

Technology: CMOS

CMOS technology offers low power consumption, high speed, and reliability, making the DSP suitable for a variety of applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM6435ZWT6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B361

JESD-609 Code:

e1

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

361

No. of Timers:

5

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA361,19X19,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

81920

ROM Programmability:

MROM

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

TMS320DM6435ZWT6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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