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DSPIC30F6015T-20E/PT

Microchip Technology

DSPIC30F6015T-20E/PT by Microchip Technology

DSPIC30F6015T-20E/PT by Microchip is a 16-bit DSP with max clock freq of 40MHz, operating temp range -40 to 125 °C. Ideal for automotive applications, it features flash ROM programmability, operates at supply voltages of 4.5-5.5V, and comes in a square package with 64 terminals.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,335 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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150

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AZTECH Wire

Italy . 380 parts In-Stock

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$11.084

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380

$11.084

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Corohmni

South Africa . 937 parts In-Stock

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$26.151

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937

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Semicontronic

India . 1,183 parts In-Stock

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$27.000

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$26.325

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$26.190

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$27.000

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$26.190

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Aztec Data Supply Inc.

USA . 100 parts In-Stock

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$27.520

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100

$27.520

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Ampacity Inc.

Singapore . 435 parts In-Stock

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$30.000

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435

$30.000

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Advanced Electronics

New Zealand . 650 parts In-Stock

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$58.077

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$55.173

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$55.173

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650

$58.077

$55.173

$55.173

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NIA Electronics

USA . 5,060 parts In-Stock

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Ledger Components

France . 5,060 parts In-Stock

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Continental Prestige Electronics

USA . 5,053 parts In-Stock

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LOOK Integrated Logistics

Peru . 4,252 parts In-Stock

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LMD Electronica

Estonia . 3,579 parts In-Stock

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Montano Global Distributors

Canada . 3,037 parts In-Stock

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Argo Parts USA

USA . 1,108 parts In-Stock

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Bastille Electronics

Australia . 450 parts In-Stock

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450

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Microchip USA

USA . 322 parts In-Stock

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322

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Overview

Unleash the power of cutting-edge technology with the Microchip Technology DSPIC30F6015T-20E/PT Digital Signal Processor. Manufactured by a trusted industry leader, this device offers unmatched quality and reliability. Ideal for a wide range of applications, this DSP provides customers with unparalleled performance and efficiency. Experience seamless operation and superior functionality with this innovative product, designed to meet your every need. Upgrade your projects and elevate your work with the Microchip Technology DSPIC30F6015T-20E/PT today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable applications.

Surface Mount: YES

Surface mount technology allows for easier assembly and miniaturization of the product.

Maximum Supply Voltage: 5.5 V

Higher supply voltage allows for better performance and flexibility in operation.

Package Shape: SQUARE

Square shape helps in efficient placement on circuit boards and compact designs.

Bit Size: 16

16-bit processing capability allows for accurate and precise calculations.

Power Supplies (V): 3/5

Support for multiple voltage supplies enables versatile use in different systems.

No. of Terminals: 64

Higher number of terminals provide connectivity to various external components.

Package Style (Meter): FLATPACK, THIN PROFILE, FINE PITCH

This package style offers space-saving and efficient heat dissipation benefits.

Minimum Supply Voltage: 4.5 V

Allows operation at lower voltages for power efficiency and compatibility.

Maximum Operating Temperature: 125 °C

Higher operating temperature range ensures reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions.

Terminal Finish: Matte Tin (Sn)

Matte tin finish provides good solderability and corrosion resistance.

Terminal Position: QUAD

Quad terminal positioning simplifies PCB layout and connection of external components.

Maximum Seated Height: 1.2 mm

Low profile design allows for compact and slim applications.

Width: 10 mm

Narrow width enables placement in tight spaces on circuit boards.

Maximum Clock Frequency: 40 MHz

High clock frequency supports fast processing and real-time operation.

Maximum Time At Peak Reflow Temperature (s): 40

Allows for efficient reflow soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable solder joints.

Length: 10 mm

Compact length helps in space-constrained designs.

Temperature Grade: AUTOMOTIVE

Automotive-grade components are designed to withstand rugged conditions in vehicle applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, CONTROLLER

Combination of DSP and controller functionality enhances processing capabilities for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and ease of soldering.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance in different operating conditions.

ROM Programmability: FLASH

Flash ROM programmability allows for easy updates and customization of software.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density integration and miniaturization.

Format: FIXED POINT

Fixed-point format simplifies arithmetic operations and enhances computational efficiency.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, suitable for standard manufacturing processes.

On Chip Program ROM Width: 24

Wide on-chip program ROM width allows for storing larger amounts of code and data.

Technical Specifications

Digital Signal Processors (DSPs) DSPIC30F6015T-20E/PT attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Microchip Technology

Specs

Additional Features:

OPERATES AT 3V MINIMUM SUPPLY AT 15 MHZ

Address Bus Width:

0

Bit Size:

16

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

0

Format:

FIXED POINT

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

On Chip Program ROM Width:

24

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

10 mm

Trade Compliance

DSPIC30F6015T-20E/PT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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